公开(公告)号：US07026657B2

公开(公告)日：2006-04-11

申请号：US10258154

申请日：2001-04-19

申请人： Georg Bogner ,  Siegmar Kugler ,  Ernst Nirschl ,  Raimund Oberschmid ,  Karl-Heinz Schlereth ,  Olaf Schoenfeld ,  Norbert Stath ,  Gerald Neumann

发明人： Georg Bogner ,  Siegmar Kugler ,  Ernst Nirschl ,  Raimund Oberschmid ,  Karl-Heinz Schlereth ,  Olaf Schoenfeld ,  Norbert Stath ,  Gerald Neumann

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/20 ,  H01L33/02 ,  H01L33/08 ,  H01L33/145 ,  H01L33/44 ,  H01L2224/16225

摘要： The invention concerns a light-emitting diode chip (1) comprising a radiation-emitting active region (32) and a window layer (2). To increase the luminous efficiency, the cross-sectional area of the radiation-emitting active region (32) is smaller than the cross-sectional area of the window layer (2) available for the decoupling of light.The invention is further directed to a method for fabricating a lens structure on the surface of a light-emitting component.

摘要翻译： 本发明涉及一种包括发射辐射有源区（32）和窗口层（2）的发光二极管芯片（1）。 为了提高发光效率，发射有源区域（32）的横截面面积小于可用于解耦光的窗口层（2）的横截面面积。 本发明还涉及一种用于在发光部件的表面上制造透镜结构的方法。

公开(公告)号：US07306960B2

公开(公告)日：2007-12-11

申请号：US11311809

申请日：2005-12-19

申请人： Georg Bogner ,  Siegmar Kugler ,  Ernst Nirschl ,  Raimund Oberschmid ,  Karl-Heinz Schlereth ,  Olaf Schoenfeld ,  Norbert Stath ,  Gerald Neumann

发明人： Georg Bogner ,  Siegmar Kugler ,  Ernst Nirschl ,  Raimund Oberschmid ,  Karl-Heinz Schlereth ,  Olaf Schoenfeld ,  Norbert Stath ,  Gerald Neumann

IPC分类号： H01L21/00

CPC分类号： H01L33/20 ,  H01L33/02 ,  H01L33/08 ,  H01L33/145 ,  H01L33/44 ,  H01L2224/16225

摘要： The invention concerns a light-emitting diode chip comprising a radiation-emitting active region and a window layer. To increase the luminous efficiency, the cross-sectional area of the radiation-emitting active region is smaller than the cross-sectional area of the window layer available for the decoupling of light.The invention is further directed to a method for fabricating a lens structure on the surface of a light-emitting component.

摘要翻译： 本发明涉及包括发射有辐射的有源区和窗口层的发光二极管芯片。 为了提高发光效率，发射有源区域的横截面面积小于可用于解耦光的窗口层的横截面面积。 本发明还涉及一种用于在发光部件的表面上制造透镜结构的方法。

公开(公告)号：US20060138439A1

公开(公告)日：2006-06-29

申请号：US11311809

申请日：2005-12-19

申请人： Georg Bogner ,  Siegmar Kugler ,  Ernst Nirschl ,  Raimund Oberschmid ,  Karl-Heinz Schlereth ,  Olaf Schoenfeld ,  Norbert Stath ,  Gerald Neumann

发明人： Georg Bogner ,  Siegmar Kugler ,  Ernst Nirschl ,  Raimund Oberschmid ,  Karl-Heinz Schlereth ,  Olaf Schoenfeld ,  Norbert Stath ,  Gerald Neumann

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L33/02 ,  H01L33/08 ,  H01L33/145 ,  H01L33/44 ,  H01L2224/16225

摘要： The invention concerns a light-emitting diode chip comprising a radiation-emitting active region and a window layer. To increase the luminous efficiency, the cross-sectional area of the radiation-emitting active region is smaller than the cross-sectional area of the window layer available for the decoupling of light. The invention is further directed to a method for fabricating a lens structure on the surface of a light-emitting component.

摘要翻译： 本发明涉及包括发射有辐射的有源区和窗口层的发光二极管芯片。 为了提高发光效率，发射有源区域的横截面面积小于可用于解耦光的窗口层的横截面面积。 本发明还涉及一种用于在发光部件的表面上制造透镜结构的方法。

公开(公告)号：US5999552A

公开(公告)日：1999-12-07

申请号：US9606

申请日：1998-01-20

申请人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

发明人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

IPC分类号： H01L33/56 ,  H01S3/00 ,  H01S5/00 ,  H01S5/022 ,  H01S3/18 ,  H01L33/00

CPC分类号： H01S5/02244 ,  H01S5/02228 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L33/56

摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.

摘要翻译： 辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。 壳体具有光学透明的非导电封装材料。 将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。 半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。 漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。 关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即， 与传统的红外发光二极管相当。

公开(公告)号：US08890306B2

公开(公告)日：2014-11-18

申请号：US13808300

申请日：2011-05-24

申请人： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

发明人： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

IPC分类号： H01L23/15 ,  H01L23/08 ,  H01L33/64 ,  H01L25/075 ,  H05K1/02 ,  H01L23/10 ,  H05K1/05 ,  H01L33/62

CPC分类号： H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

摘要： A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.

摘要翻译： 发光二极管包括具有安装面的载体，并且包括金属基体和至少两个至少两个发光二极管芯片，其至少间接地固定在安装面上，其中金属基体的外表面包括 所述至少两个发光二极管芯片彼此并联连接，所述至少两个发光二极管芯片嵌入在反射涂层中，所述反射涂层覆盖所述安装面和所述发光二极管的侧面 二极管芯片，并且发光二极管芯片以其辐射出射表面突出出反射涂层，并且辐射出射表面背离载体。

公开(公告)号：US08772065B2

公开(公告)日：2014-07-08

申请号：US13611890

申请日：2012-09-12

申请人： Georg Bogner ,  Karlheinz Arndt

发明人： Georg Bogner ,  Karlheinz Arndt

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L23/49805 ,  H01L24/48 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.

摘要翻译： 具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面， 并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向 与安装表面（19）的关系。 此外，提供了一种用于生产包装体（1）的方法。

公开(公告)号：US08283684B2

公开(公告)日：2012-10-09

申请号：US12443155

申请日：2007-09-19

申请人： Reiner Windisch ,  Ralph Wirth ,  Stefan Groetsch ,  Georg Bogner ,  Guenter Kirchberger ,  Klaus Streubel

发明人： Reiner Windisch ,  Ralph Wirth ,  Stefan Groetsch ,  Georg Bogner ,  Guenter Kirchberger ,  Klaus Streubel

IPC分类号： H01L33/00

CPC分类号： H01L27/15 ,  H01L24/24 ,  H01L25/0756 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/32145 ,  H01L2924/0002 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.

摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。 每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小 跨越LED半导体体。 本发明还描述了LED半导体本体的各种用途。

公开(公告)号：US08189123B2

公开(公告)日：2012-05-29

申请号：US11914020

申请日：2006-04-21

申请人： Gerhard Kuhn ,  Moritz Engl ,  Patrick Kromotis ,  Stefan Grötsch ,  Josef Hüttner ,  Mario Wanninger ,  Georg Bogner

发明人： Gerhard Kuhn ,  Moritz Engl ,  Patrick Kromotis ,  Stefan Grötsch ,  Josef Hüttner ,  Mario Wanninger ,  Georg Bogner

IPC分类号： H04N7/24

CPC分类号： G02B19/0066 ,  F21K9/00 ,  F21V17/101 ,  G02B19/0028 ,  G02B26/0833 ,  G02B27/0983 ,  G03B21/14 ,  G03B21/2033 ,  G03B21/208 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H04N9/315 ,  H01L2924/00

摘要： A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size AM and a maximum acceptance angle α for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle β. At least one of the LED chips has a radiation decoupling area of the size AD. The relation 0.7·(AM·sin2(α))/(AD·sin2(β)·n2)≦N≦1.3·(AM·sin2(α))/(AD·sin2(β)·n2) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.

摘要翻译： 一种投影装置，包括一个光调制器，该光调制器具有一个具有被照明的尺寸为AM的横截面积的光接收区域和用于入射光的最大接收角度α，以及至少一个光源， 其操作产生用于照射所述光接收区域的所述横截面积并包括数量N个具有最大辐射角＆lt; bgr的LED芯片的光锥。 至少一个LED芯片具有尺寸为AD的辐射去耦区域。 关系0.7·（AM·sin2（α））/（AD·sin2（＆bgr。）·n2）＆nlE; N＆nlE; 1.3·（AM·sin2（α））/（AD·sin2（＆bgr））·n2） 适用，其中n等于1或与提供LED芯片的耦合介质的折射率。

公开(公告)号：US08110437B2

公开(公告)日：2012-02-07

申请号：US10514461

申请日：2003-05-14

申请人： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

发明人： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L21/52 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.

摘要翻译： 辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。 通过使用以小于10μm的层厚度施加的低熔点焊料3，可以在很大程度上进行焊接工艺，而不会对塑料密封剂5造成热损伤。

公开(公告)号：US07948694B2

公开(公告)日：2011-05-24

申请号：US11574055

申请日：2005-08-02

申请人： Georg Bogner ,  Michael Hiegler ,  Monika Rose ,  Günter Waitl ,  Manfred Wolf

发明人： Georg Bogner ,  Michael Hiegler ,  Monika Rose ,  Günter Waitl ,  Manfred Wolf

IPC分类号： G02B7/02

CPC分类号： H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

摘要翻译： 规定了具有至少一个固定元件的装置，所述固定元件用于将所述装置固定到光电装置的壳体上，并且所述装置被设计为用于单独光学元件的安装件。