公开(公告)号：US20140375553A1

公开(公告)日：2014-12-25

申请号：US14311676

申请日：2014-06-23

申请人： Georg Mrusek ,  Tobias Hipp ,  Reiner Schnitzer ,  Frank Fischer ,  Lutz Rauscher ,  Christopher Delfs ,  Ming Liu ,  Gael Pilard

发明人： Georg Mrusek ,  Tobias Hipp ,  Reiner Schnitzer ,  Frank Fischer ,  Lutz Rauscher ,  Christopher Delfs ,  Ming Liu ,  Gael Pilard

IPC分类号： G06F3/01

CPC分类号： G06F3/017

摘要： A method for determining gestures in the beam region of a projector includes: projecting an image onto a surface with the aid of the projector, using light; measuring a first set of light intensities of light backscattered from the direction of the surface, under the influence of a gesture made in the beam region of the projector; assigning the measured light intensities to, in each instance, a position of the image projected by the projector; at a first time point, generating a first light intensity function over a second set of positions, which are assigned measured light intensities; at a second time point, generating at least one second light intensity function over the second set of positions; and determining the gesture made, based on the result of a comparison between the first and second light intensity functions.

摘要翻译： 用于确定投影仪的光束区域中的手势的方法包括：借助于投影仪，使用光将图像投影到表面上; 在投影仪的光束区域中产生的手势的影响下，测量从表面的方向向后散射的第一组光强度; 在每种情况下将测量的光强度分配给由投影仪投影的图像的位置; 在第一时间点，在被分配测量的光强度的第二组位置上产生第一光强度函数; 在第二时间点，在所述第二组位置上产生至少一个第二光强度函数; 以及基于所述第一和第二光强度函数之间的比较的结果来确定所作的手势。

公开(公告)号：US09323341B2

公开(公告)日：2016-04-26

申请号：US14311676

申请日：2014-06-23

申请人： Georg Mrusek ,  Tobias Hipp ,  Reiner Schnitzer ,  Frank Fischer ,  Lutz Rauscher ,  Christoph Delfs ,  Ming Liu ,  Gael Pilard

发明人： Georg Mrusek ,  Tobias Hipp ,  Reiner Schnitzer ,  Frank Fischer ,  Lutz Rauscher ,  Christoph Delfs ,  Ming Liu ,  Gael Pilard

IPC分类号： G06F3/041 ,  G06F3/01

CPC分类号： G06F3/017

摘要： A method for determining gestures in the beam region of a projector includes: projecting an image onto a surface with the aid of the projector, using light; measuring a first set of light intensities of light backscattered from the direction of the surface, under the influence of a gesture made in the beam region of the projector; assigning the measured light intensities to, in each instance, a position of the image projected by the projector; at a first time point, generating a first light intensity function over a second set of positions, which are assigned measured light intensities; at a second time point, generating at least one second light intensity function over the second set of positions; and determining the gesture made, based on the result of a comparison between the first and second light intensity functions.

摘要翻译： 用于确定投影仪的光束区域中的手势的方法包括：借助于投影仪，使用光将图像投影到表面上; 在投影仪的光束区域中产生的手势的影响下，测量从表面的方向向后散射的第一组光强度; 在每种情况下将测量的光强度分配给由投影仪投影的图像的位置; 在第一时间点，在被分配测量的光强度的第二组位置上产生第一光强度函数; 在第二时间点，在所述第二组位置上产生至少一个第二光强度函数; 以及基于所述第一和第二光强度函数之间的比较的结果来确定所作的手势。

公开(公告)号：US20150062678A1

公开(公告)日：2015-03-05

申请号：US14470755

申请日：2014-08-27

申请人： Frank Fischer ,  Gael Pilard ,  Lutz Rauscher

发明人： Frank Fischer ,  Gael Pilard ,  Lutz Rauscher

IPC分类号： G02B26/10 ,  G02B26/08

CPC分类号： G02B26/10 ,  G02B26/0875 ,  G02B26/101 ,  G02B27/1006 ,  H04N9/3129 ,  H04N9/3164 ,  Y10T29/49002

摘要： A multi-laser projection device includes: a plurality of first assemblies, each including a fixed assemblage of a respective laser diode and an associated first collimator lens; a second assembly that forms a fixed assemblage of a beam combiner and a respective second collimator lens that is fastened on an entry surface of the beam combiner and that appertains to a respective laser diode; and a deflection unit. The plurality of first assemblies, the second assembly, and the deflection unit are mounted in a common housing so as to be adjusted to one another.

摘要翻译： 多激光投影装置包括：多个第一组件，每个第一组件包括相应激光二极管的固定组件和相关联的第一准直透镜; 第二组件，其形成光束组合器的固定组合件和相应的第二准直透镜，所述第二准直透镜固定在所述光束组合器的入射表面上并且与相应的激光二极管相对应; 和偏转单元。 多个第一组件，第二组件和偏转单元安装在公共壳体中以便彼此调节。

公开(公告)号：US08835222B2

公开(公告)日：2014-09-16

申请号：US13623244

申请日：2012-09-20

申请人： Mathias Bruendel ,  Frieder Haag ,  Jens Frey ,  Rolf Speicher ,  Juergen Fritz ,  Lutz Rauscher

发明人： Mathias Bruendel ,  Frieder Haag ,  Jens Frey ,  Rolf Speicher ,  Juergen Fritz ,  Lutz Rauscher

IPC分类号： H01L21/00 ,  B81C1/00 ,  H01L21/56 ,  H01L21/50 ,  H01L23/48 ,  H01L23/00 ,  H01L23/544 ,  H01L21/768

CPC分类号： H01L23/48 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00238 ,  B81C2203/0154 ,  B81C2203/0792 ,  H01L21/50 ,  H01L21/561 ,  H01L21/76898 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54466 ,  H01L2224/0401 ,  H01L2224/09181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/00

摘要： A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.

摘要翻译： 一种用于制造双芯片组件的方法包括：提供具有第一厚度的晶片，该晶片具有前侧和后侧，在晶片的前侧设置有第一多个第一芯片; 在晶片的前侧附加第二多个第二芯片，使得每个第一芯片在每种情况下都连接到第二芯片并形成相应的双芯片对; 在所述晶片的前侧形成粘结的模具包，使得所述第二芯片被包装; 将晶片从背面变薄至小于第一厚度的第二厚度; 从后侧到第二芯片形成通孔; 并将两芯片对分离成相应的双芯片组件。

公开(公告)号：US08810252B2

公开(公告)日：2014-08-19

申请号：US13156208

申请日：2011-06-08

申请人： Eric Ochs ,  Holger Hoefer ,  Lutz Rauscher ,  Eckart Schellkes ,  Florian Grabmaier

发明人： Eric Ochs ,  Holger Hoefer ,  Lutz Rauscher ,  Eckart Schellkes ,  Florian Grabmaier

IPC分类号： G01R31/08

CPC分类号： H05K1/0268 ,  H01L23/3121 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48229 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09663 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

摘要翻译： 集成电路包括壳体中的电子电路和用于将电路焊接到电路板的对应的第二接触装置的第一接触装置。 第一和第二接触装置分别被分成第一部分和第二部分，其中一个接触装置的部分彼此固定地电连接，另一个接触装置的部分可选择性地连接到用于电阻的装置 决心。

公开(公告)号：US20120161260A1

公开(公告)日：2012-06-28

申请号：US13334398

申请日：2011-12-22

申请人： Uwe HANSEN ,  Lutz Rauscher

发明人： Uwe HANSEN ,  Lutz Rauscher

IPC分类号： H01L29/84 ,  H01L29/66 ,  H01L21/56

CPC分类号： B81B7/0061 ,  H01L2224/48095 ,  H01L2224/48465 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.

摘要翻译： 引入了措施，使得具有媒体访问的传感器芯片的低成本封装成为可能。 为此，传感器芯片首先安装在基板上并被接触。 然后将传感器芯片至少部分地嵌入模塑料中。 最后，介质通道的至少一部分通过随后的模塑料的结构而产生。

公开(公告)号：US20120126352A1

公开(公告)日：2012-05-24

申请号：US13291278

申请日：2011-11-08

申请人： Hans-Peter Baer ,  Paul Farber ,  Stefan Weiss ,  Lutz Rauscher

发明人： Hans-Peter Baer ,  Paul Farber ,  Stefan Weiss ,  Lutz Rauscher

IPC分类号： H01L29/82 ,  H01L21/50 ,  H01L21/78

CPC分类号： H01L24/94 ,  H01L24/05 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/02313 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2224/85186 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2224/0231 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.

摘要翻译： 在平行于晶片平面的上侧具有接触表面的半导体芯片在垂直于上侧的端子焊盘侧具有端子焊盘，每个端子焊盘导电地连接到分配的接触表面。 这允许将芯片垂直安装在基板上并借助常规的接合技术进行接触。 描述制造方法和两种安装方法。

公开(公告)号：US20120025863A1

公开(公告)日：2012-02-02

申请号：US13156208

申请日：2011-06-08

申请人： Eric Ochs ,  Holger Hoefer ,  Lutz Rauscher ,  Eckart Schellkes ,  Florian Grabmaier

发明人： Eric Ochs ,  Holger Hoefer ,  Lutz Rauscher ,  Eckart Schellkes ,  Florian Grabmaier

IPC分类号： G01R31/26 ,  H01L23/58

CPC分类号： H05K1/0268 ,  H01L23/3121 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48229 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09663 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

摘要翻译： 集成电路包括壳体中的电子电路和用于将电路焊接到电路板的对应的第二接触装置的第一接触装置。 第一和第二接触装置分别被分成第一部分和第二部分，其中一个接触装置的部分彼此固定地电连接，另一个接触装置的部分可选择性地连接到用于电阻的装置 决心。