摘要:
In a voice data communication system comprising a switchboard for switching lines, a network, interworking units for interworking a protocol on the network with a protocol for a line switching, and IP extension terminals connected to the interworking units through the network, a switchboard notifies a communication between interworking units to the interworking units when recognizing the communication between the interworking units, which are provided corresponding to each of IP extension terminals, and establish a relay route to the interworking unit according to a notification from the switchboard and establish a voice data packet route to a route between the IP extension terminals through the network by using the relay route in response to a route establishment request from the IP extension terminals accommodated, or when the interworking unit is a single and the notification is received from the switchboard, establish a voice data packet route to a route between the IP extension terminals through the network according to a route establishment request from the IP extension terminal accommodated.
摘要:
In an electronic component in which a semiconductor chip (semiconductor element) and a passive component are integrated on a multilayer wiring board and the semiconductor chip and the passive component constitute a feedback circuit, an input end and an output end of the semiconductor chip (semiconductor element) are electrically separated from each other. The electronic component includes the multilayer wiring board, the semiconductor chip disposed on the main surface of or inside the multilayer wiring board, and the passive component having a first terminal and a second terminal connected to the input end and the output end of the semiconductor chip respectively, and is configured such that a conductive member constituting the multilayer wiring board is located at a position where a distance from at least one of the first terminal and the second terminal is smaller than a distance between the first terminal and the second terminal.
摘要:
By using a high-range sub-band signal, a correction coefficient corresponding to importance of auditory sense is calculated to correct a noise level and generate additional signal information, thereby accurately reflecting the noise level of the sub-band important in the auditory sense. Thus, it is possible to calculate additional signal information reflecting the noise level of the sub-band important in the auditory sense according to importance with a small calculation amount. The calculation amount can further be reduced by using a correction coefficient based on the characteristic of an ordinary audio signal.
摘要:
Provided is a multi-point connection device including: a first signal receiving unit which receives a first signal containing a plurality of constituent elements and first analysis information expressing the relationship between the constituent elements contained in the first signal; a second signal receiving unit which receives a second signal containing a plurality of constituent elements and second analysis information expressing the relationship between the constituent elements contained in the second signal; a signal mixing unit which mixes the first signal and the second signal; and an analysis information mixing unit which mixes the first analysis information and the second analysis information.
摘要:
A signal analysis device includes: a signal reception unit which receives an input signal containing a plurality of constituent elements; and a signal analysis unit which generates analysis information indicating the relationship between the constituent elements from the input signal.
摘要:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要:
[Problems] To provide a high-quality audio signal encoding technique by controlling the number of time/frequency groups in a frame.[Means for Solving Problems] An audio encoding device includes: a time group boundary candidate position extraction unit (101) for analyzing a sub-band signal (2001) obtained by frequency-changing an input signal and calculating a candidate position of the time group boundary; a time group quantity generation unit (103) for outputting a maximum value of the time group quantity; a time group selection unit (102) for generating a time group quantity not greater than the maximum time group quantity by using the candidate position; and a frequency group generation unit (104) for generating a frequency group by using the generated time group information. The device generates a time/frequency group accurately reflecting a change of the input signal and performs operations while controlling the number of time/frequency groups in the frame.
摘要:
A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.
摘要:
A wiring board provided with a line 1, a shield pattern 2 formed in parallel with the line 1, a conductor layer 4 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 3, a conductor layer 6 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 5, and conductive pillars 7a, 7b for connecting the conductor layer 4 to the conductor layer 6. The conductive pillars 7a, 7b are connected to each other through the shield pattern 2. In the above structure, by supplying the ground potential to the shield pattern 2, conductor layers 4, 6, and conductive pillars 7a, 7b, an electromagnetic field is blocked in the direction where the line 1 extends over 360° about the line 1.