公开(公告)号：US20070054114A1

公开(公告)日：2007-03-08

申请号：US10571495

申请日：2004-09-09

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: B32B15/04 ,  B32B7/12

CPC classification number: H05K3/323 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2203/326 ,  H01R4/04 ,  H05K2203/1189 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287

Abstract: A multilayer anisotropic conductive adhesive in which resistance to reflow is sufficiently obtained and which can facilitate connection and a connection structure using the multilayer anisotropic conductive adhesive are provided. A multilayer anisotropic conductive adhesive 11 includes a plurality of adhesive layers 1 and 2 laminated, each of which at least contains an insulating resin and a hardening agent; wherein conductive particles are contained either in the plurality of adhesive layers 1 or in the plurality of adhesive layers 2, and at least the top or bottom adhesive layer 1 has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Further, a connection structure is constructed in which a first electronic component that has an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the above-described multilayer anisotropic conductive adhesive 11.

Abstract translation: 提供了其中充分获得耐回流性并且可以促进连接并且使用多层各向异性导电粘合剂的连接结构的多层各向异性导电粘合剂。 多层各向异性导电粘合剂11包括层叠的多个粘合层1和2，每个粘合层至少包含绝缘树脂和硬化剂; 其中导电颗粒包含在多个粘合剂层1或多个粘合剂层2中，并且至少顶部或底部粘合剂层1具有130℃或更高的DSC（差示扫描量热法）放热峰温度 180℃以下。 此外，构造了一种连接结构，其中在其表面上具有电极和绝缘膜的第一电子部件和其表面上具有电极的第二电子部件通过上述多层各向异性导电粘合剂电连接 11。

公开(公告)号：US07025852B2

公开(公告)日：2006-04-11

申请号：US10439180

申请日：2003-05-16

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: B32B31/00

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.

公开(公告)号：US06452111B1

公开(公告)日：2002-09-17

申请号：US09976162

申请日：2001-10-15

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: H05K102

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/09102 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/3011 ,  H05K1/189 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/0257 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T428/28 ,  H01L2924/00

Abstract: Provided is an electrically conductive adhesive capable of reliably connecting a semiconductor element and a flexible wiring board without causing short circuits. When electrically conductive adhesives of the present invention containing conductive particles having an average diameter of from 10 nm or more to 90 nm or less are used to connect a flexible wiring board and a semiconductor element, the signal part of a wiring film under a protective film is protected and no short circuit occurs in wiring films of the resulting electric device because conductive particles do not break through the protective film of the semiconductor element.

Abstract translation: 提供一种能够可靠地连接半导体元件和柔性布线板而不引起短路的导电粘合剂。 当使用包含平均直径为10nm以上且90nm以下的导电性粒子的本发明的导电性粘合剂来连接柔性布线基板和半导体元件时，保护膜下方的配线膜的信号部 被保护，并且由于导电颗粒不会穿过半导体元件的保护膜而导致所得电子器件的布线膜不发生短路。

公开(公告)号：US08845849B2

公开(公告)日：2014-09-30

申请号：US13314847

申请日：2011-12-08

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: C04B37/00 ,  H01B1/02 ,  H01B1/22 ,  H01R4/04 ,  C09J9/02 ,  H05K3/32 ,  C09J11/04 ,  C09J163/00 ,  H01L23/00 ,  C08G59/50 ,  C08K7/06 ,  C08K3/08

CPC classification number: H05K3/323 ,  C08G59/5073 ,  C08K3/08 ,  C08K7/06 ,  C08K2201/016 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L27/28 ,  H01L2224/2919 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H05K2201/0245 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles, the minor axis of the metal flake power being, in a length, 10 to 50% of the major axis. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.

Abstract translation: 通过将导电粒子分散在粘合剂树脂组合物中，制备电子部件与布线基板在无压力或低压下各向异性导电连接的各向异性导电粘合剂。 使用长轴为10〜40μm，厚度为0.5〜2μm，长宽比为5〜50的金属片状粉末作为导电性粒子，金属片状动力的短轴为 长度，长轴的10〜50％。 各向异性导电粘合剂中所含的导电性粒子的含量为5〜35质量％。

公开(公告)号：US08092636B2

公开(公告)日：2012-01-10

申请号：US12678424

申请日：2008-09-05

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: C04B37/00 ,  H01B1/02 ,  H01B1/22

CPC classification number: H05K3/323 ,  C08G59/5073 ,  C08K3/08 ,  C08K7/06 ,  C08K2201/016 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L27/28 ,  H01L2224/2919 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H05K2201/0245 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. This anisotropic conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic component is preliminarily connected to a connection terminal of a substrate while arranging the anisotropic conductive adhesive therebetween. Then, the electronic component is heated without applying a pressure or while applying a low pressure to the electronic component to connect the substrate with the electronic component.

Abstract translation: 通过将导电粒子分散在粘合剂树脂组合物中，制备电子部件与布线基板在无压力或低压下各向异性导电连接的各向异性导电粘合剂。 使用长径为10〜40μm，厚度为0.5〜2μm，纵横比为5〜50的金属片状粉末作为导电性粒子。 各向异性导电粘合剂中所含的导电性粒子的含量为5〜35质量％。 这种各向异性导电粘合剂被提供给布线板的连接端子，并且电子部件的连接端子预先连接到基板的连接端子，同时在其间布置各向异性导电粘合剂。 然后，电子部件被加热而不施加压力或者同时向电子部件施加低压以将基板与电子部件连接。

公开(公告)号：US07459046B2

公开(公告)日：2008-12-02

申请号：US11617666

申请日：2006-12-28

Applicant: Hiroyuki Kumakura ,  Yukio Yamada

Inventor： Hiroyuki Kumakura ,  Yukio Yamada

IPC: B32B41/00

CPC classification number: B65H37/002 ,  B65H2301/51432 ,  H05K3/323 ,  Y10T156/1092 ,  Y10T156/1705

Abstract: A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive 1 comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.

Abstract translation: 薄膜状粘合剂涂布装置包括：供给卷轴保持器，用于安装用于卷绕成卷状的膜状粘合剂供给卷轴，包括基膜和形成在其上的粘合层的膜状粘合剂1，用于热压缩的热压接装置 将从薄膜状粘合剂供给卷轴拉出的薄膜状粘合剂粘合到被粘物上，以及用于安装卷绕卷轴的卷取卷轴保持器，用于卷绕热压粘合膜状粘合剂的基膜，以及进一步的温度控制 用于控制在规定温度下安装在供带盘保持器上的胶片状粘合剂供给卷轴的装置（热屏蔽板，冷却器等）。

公开(公告)号：US20070102105A1

公开(公告)日：2007-05-10

申请号：US11617666

申请日：2006-12-28

Applicant: Hiroyuki Kumakura ,  Yukio Yamada

Inventor： Hiroyuki Kumakura ,  Yukio Yamada

IPC: B44C1/17 ,  B32B37/00 ,  B32B38/00 ,  B32B41/00

CPC classification number: B65H37/002 ,  B65H2301/51432 ,  H05K3/323 ,  Y10T156/1092 ,  Y10T156/1705

Abstract: A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive 1 comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.

Abstract translation: 薄膜状粘合剂涂布装置包括：供给卷轴保持器，用于安装用于卷绕成卷状的膜状粘合剂供给卷轴，包括基膜和形成在其上的粘合层的膜状粘合剂1，用于热压缩的热压接装置 将从薄膜状粘合剂供给卷轴拉出的薄膜状粘合剂粘合到被粘物上，以及用于安装卷绕卷轴的卷取卷轴保持器，用于卷绕热压粘合膜状粘合剂的基膜，以及进一步的温度控制 用于控制在规定温度下安装在供带盘保持器上的胶片状粘合剂供给卷轴的装置（热屏蔽板，冷却器等）。

公开(公告)号：US06861655B2

公开(公告)日：2005-03-01

申请号：US10340781

申请日：2003-01-13

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: C09J9/00 ,  C09J201/00 ,  G01N21/64 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32

CPC classification number: G01N21/6458 ,  G01N21/6428 ,  H05K1/0269 ,  H05K3/305 ,  H05K3/323

Abstract: In a method for non-destructively testing the curing level of the cured product of a curable adhesive composition, a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to the curable adhesive composition, the curable adhesive composition containing this fluorescent component is cured, the cured product thus obtained is irradiated with excitation light, and the fluorescent light thus produced is observed to test the curing level of the cured product.

Abstract translation: 在对可固化粘合剂组合物的固化产物的固化水平进行非破坏性测试的方法中，将含有该荧光成分的可固化粘合剂组合物添加到可固化粘合剂组合物中，在用激发光照射时发射荧光的荧光成分是 固化，用激发光照射由此获得的固化产物，观察所产生的荧光，以测试固化产物的固化水平。

公开(公告)号：US08444882B2

公开(公告)日：2013-05-21

申请号：US13142956

申请日：2010-02-22

Applicant: Shiyuki Kanisawa ,  Hiroyuki Kumakura ,  Hidetsugu Namiki

Inventor： Shiyuki Kanisawa ,  Hiroyuki Kumakura ,  Hidetsugu Namiki

IPC: H01B1/02 ,  H01B1/22 ,  H01L33/00 ,  B32B5/16

CPC classification number: H01L24/32 ,  C08K3/08 ,  C08K9/04 ,  C09J7/10 ,  C09J11/04 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2463/00 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/323 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1189 ,  Y10T428/25 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

Abstract translation: 提供一种各向异性导电膜，其在发光二极管元件上不具有光反射层，当使用LED元件的发光器件被倒装芯片安装时，导致成本增加，并且不会导致发射效率 恶化。 此外，提供了使用这种各向异性导电膜的发光器件。 这种各向异性导电膜具有层叠反光绝缘粘合剂层和各向异性导电粘合剂层的结构，其中反光绝缘粘合剂层具有其中光反射颗粒分散在绝缘粘合剂中的结构。 发光器件具有将发光二极管元件倒装芯片安装在基板上的结构，其中该各向异性导电膜设置在基板上的连接端子和用于连接发光二极管元件的突起之间。

公开(公告)号：US08265332B2

公开(公告)日：2012-09-11

申请号：US12927953

申请日：2010-11-30

Applicant: Hiroyuki Kumakura ,  Koji Yamazawa

Inventor： Hiroyuki Kumakura ,  Koji Yamazawa

IPC: H04R25/00

CPC classification number: H04R7/14

Abstract: A speaker diaphragm with a circular opening in a center zone thereof has a pattern of concave and convex sections formed on a front surface or a rear surface thereof. A plurality of concave and convex sections are formed in each of regions provided at a regular interval with a specific angle in a circumferential direction of the diaphragm. The concave and convex sections formed in each region have different sizes in a radial direction of the diaphragm. The concave and convex sections formed in adjacent regions are displaced from each other in the radial direction. The concave and convex sections formed on the diaphragm are aligned on at least a first and a second imaginary curved line, respectively, each imaginary curved line passing regions and approaching an inner periphery of the circular opening from an outer periphery of the diaphragm.

Abstract translation: 在其中心区域具有圆形开口的扬声器隔膜具有形成在其前表面或后表面上的凹凸部分的图案。 在隔膜的圆周方向上以规定间隔以特定角度设置的各区域中形成有多个凹凸部。 形成在各区域的凹凸部在隔膜的径向方向上具有不同的尺寸。 在相邻区域中形成的凹凸部在径向上彼此偏移。 形成在隔膜上的凹凸部分别在至少第一和第二假想曲线上排列，每个虚拟曲线通过区域并从隔膜的外周接近圆形开口的内周。