公开(公告)号：US06854979B2

公开(公告)日：2005-02-15

申请号：US10324534

申请日：2002-12-19

申请人： Hong Xie ,  Ram Viswanath ,  PR Patel

发明人： Hong Xie ,  Ram Viswanath ,  PR Patel

IPC分类号： H05K1/02 ,  H05K7/10 ,  H01R12/00

CPC分类号： H05K7/1092 ,  H01L2224/16225 ,  H05K1/0263

摘要： A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

公开(公告)号：US06979208B2

公开(公告)日：2005-12-27

申请号：US10922581

申请日：2004-08-19

申请人： Hong Xie ,  Ram Viswanath ,  Pr Patel

发明人： Hong Xie ,  Ram Viswanath ,  Pr Patel

IPC分类号： H01R12/00 ,  H01R13/648

CPC分类号： H01R13/193

摘要： A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

摘要翻译： 描述了一种叠层插座触点，用于减少与集成电路封装的电源连接中的电感。 触点包括导电电源面板，导电接地面板，介于电源面板和接地面板层之间的薄非导电层以及从电源面板和接地面板中的每一个延伸的至少一个导电指状物。 该插座触点的各种实施例可以与功率条连接器，侧端子连接器或针连接器一起使用。

公开(公告)号：US20050085106A1

公开(公告)日：2005-04-21

申请号：US10922581

申请日：2004-08-19

申请人： Hong Xie ,  Ram Viswanath ,  Pr Patel

发明人： Hong Xie ,  Ram Viswanath ,  Pr Patel

IPC分类号： H01R12/00 ,  H01R13/648

CPC分类号： H01R13/193

摘要： A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

公开(公告)号：US06672880B2

公开(公告)日：2004-01-06

申请号：US10325213

申请日：2002-12-19

申请人： Hong Xie ,  Ram Viswanath ,  PR Patel

发明人： Hong Xie ,  Ram Viswanath ,  PR Patel

IPC分类号： H01R1200

CPC分类号： H05K7/1092 ,  H01L2224/16225 ,  H05K1/0263

摘要： A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

摘要翻译： 描述了一种叠层插座触点，用于减少与集成电路封装的电源连接中的电感。 触点包括导电电源面板，导电接地面板，介于电源面板和接地面板层之间的薄非导电层以及从电源面板和接地面板中的每一个延伸的至少一个导电指状物。 该插座触点的各种实施例可以与功率条连接器，侧端子连接器或针连接器一起使用。

公开(公告)号：US06575766B1

公开(公告)日：2003-06-10

申请号：US10082881

申请日：2002-02-26

申请人： Hong Xie ,  Ram Viswanath ,  PR Patel

发明人： Hong Xie ,  Ram Viswanath ,  PR Patel

IPC分类号： H01R1200

CPC分类号： H05K7/1092 ,  H01L2224/16225 ,  H05K1/0263

摘要： A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

公开(公告)号：US20140268577A1

公开(公告)日：2014-09-18

申请号：US13826614

申请日：2013-03-14

申请人： Rajasekaran Raja Swaminathan ,  Donald T. Tran ,  Brent S. Stone ,  Ram Viswanath

发明人： Rajasekaran Raja Swaminathan ,  Donald T. Tran ,  Brent S. Stone ,  Ram Viswanath

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/11 ,  H01R12/62 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/094 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10378 ,  Y02P70/611

摘要： This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.

摘要翻译： 本公开总体上涉及一种芯片封装组件，其被布置为电耦合到包括多个电路板触点的电路板。 芯片封装组件可以包括包括第一侧和第二侧的芯片封装，第二侧包括布置成电耦合到多个电路板触点的第一多个触点，以及布置成电耦合的第二多个触点 通过连接器组件连接到远程设备。

公开(公告)号：US20160044786A1

公开(公告)日：2016-02-11

申请号：US14456606

申请日：2014-08-11

申请人： Rajasekaran Swaminathan ,  Sairam Agraharam ,  Amruthavalli Pallavi Alur ,  Ram Viswanath ,  Wei-Lun Kane Jen

发明人： Rajasekaran Swaminathan ,  Sairam Agraharam ,  Amruthavalli Pallavi Alur ,  Ram Viswanath ,  Wei-Lun Kane Jen

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H01L23/00

CPC分类号： H05K1/112 ,  H01L23/5381 ,  H01L23/5385 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1403 ,  H01L2224/16165 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16501 ,  H01L2224/29082 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81444 ,  H01L2224/81464 ,  H01L2224/83101 ,  H01L2224/83191 ,  H05K1/09 ,  H05K1/113 ,  H05K1/185 ,  H05K3/243 ,  H05K3/244 ,  H05K3/4046 ,  H05K2201/09472 ,  H05K2201/10189 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01079

摘要： This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a substantially non-conductive material, the package insulator layer being substantially planar, and a via. The via may be formed within the package insulator layer and electrically coupled to the electrically conductive pad. The via may include a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end and a finish layer secured to the second end of the conductor, the finish layer including a gold compound.

摘要翻译： 本公开一般涉及电子封装和方法，其包括导电焊盘，包括基本上不导电的材料的封装绝缘体层，封装绝缘体层基本上是平面的，以及通孔。 通孔可以形成在封装绝缘体层内并电耦合到导电焊盘。 通孔可以包括垂直延伸穿过封装绝缘体层的至少一部分并且具有靠近导电焊盘的第一端和与第一端相对的第二端和固定到导体的第二端的光洁度层的导体， 层包括金化合物。

公开(公告)号：US06189601B1

公开(公告)日：2001-02-20

申请号：US09305847

申请日：1999-05-05

申请人： Lloyd Jack Goodman ,  Chai-Pin Chiu ,  Abhay W. Watwe ,  Ram Viswanath

发明人： Lloyd Jack Goodman ,  Chai-Pin Chiu ,  Abhay W. Watwe ,  Ram Viswanath

IPC分类号： F18F700

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/22 ,  F28F2215/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at the second portion so that heat can be transferred therefrom to the second portion.

摘要翻译： 本发明提供一种用于冷却和电子设备的散热器。 散热器包括构件和固定到构件的热管。 该构件在第二部分上具有第一部分，第二部分和多个翅片。 热管具有第一蒸发器部分和第二冷凝器部分。 第一部分位于第一部分，使得热量可以从电子设备的发热部件转移到其上。 第二部分位于第二部分，使得热量可以从其转移到第二部分。