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    Chip-scale carrier for semiconductor devices including mounted spring contacts
    7.
    发明授权
    Chip-scale carrier for semiconductor devices including mounted spring contacts 失效
    用于包括安装的弹簧触点的半导体器件的芯片级载体

    公开(公告)号：US6023103A

    公开(公告)日：2000-02-08

    申请号：US106943

    申请日：1998-06-30

    申请人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    发明人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L29/417

    CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L23/4985 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

    摘要： A plurality of free-standing resilient contact structures (spring elements) are mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se. The carrier substrate is pre-fabricated, by mounting the spring elements thereto prior to mounting the carrier substrate to the semiconductor device(s), or vice-versa.

    摘要翻译： 多个独立的弹性接触结构（弹簧元件）被安装到载体基板的表面上。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 在半导体器件从形成它们的半导体晶片分离之前，将载体衬底安装到一个或多个半导体器件。 通过从载体基板本身延伸的弹簧元件提供弹性和顺应性来实现与半导体器件的压力连接。 在将载体衬底安装到半导体器件之前，通过将弹簧元件安装到其上来预先制造载体衬底，反之亦然。

    Process of mounting spring contacts to semiconductor devices
    8.
    发明授权
    Process of mounting spring contacts to semiconductor devices 失效
    将弹簧触点安装到半导体器件的过程

    公开(公告)号：US06168974A

    公开(公告)日：2001-01-02

    申请号：US09499963

    申请日：2000-02-08

    申请人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    发明人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    IPC分类号： H01L2144

    CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se.

    摘要翻译： 一种用于提供安装到载体基板的表面上的多个自立的弹性接触结构（弹簧元件）的方法。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 载体衬底在半导体器件被从形成它们的半导体晶片分离之前被安装到一个或多个半导体器件上。由载体衬底延伸的弹簧元件提供抵抗半导体器件的压力连接的弹性和顺应性， 本身。