公开(公告)号：US20170093852A1

公开(公告)日：2017-03-30

申请号：US14865258

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： HORMUZD M. KHOSRAVI ,  BASSAM N. COURY ,  VINCENT J. ZIMMER

IPC: H04L29/06

CPC classification number: H04L63/0876 ,  G06F21/32 ,  G06F21/57 ,  G06F21/606 ,  H04L63/0861 ,  H04L63/102

Abstract: The present disclosure is directed to secure sensor data transport and processing. End-to-end security may prevent attackers from altering data during the sensor-based security procedure. For example, following sensor data capture execution in a device may be temporarily suspended. During the suspension of execution, sensor interface circuitry in the device may copy the sensor data from a memory location associated with the sensor to a trusted execution environment (TEE) within the device. The TEE may provide a secure location in which the sensor data may be processed and a determination may be made as to whether to grant access to the secure resources. The TEE may comprise, for example, match circuitry to compare the sensor data to previously captured sensor data for users that are allowed to access the secured resources and output circuitry to grant access to the secured resources or to perform activities associated with a security exception.

公开(公告)号：US20180026981A1

公开(公告)日：2018-01-25

申请号：US15709091

申请日：2017-09-19

Applicant: Intel Corporation

Inventor： HORMUZD M. KHOSRAVI ,  BASSAM N. COURY ,  VINCENT J. ZIMMER

IPC: H04L29/06

CPC classification number: H04L63/0876 ,  G06F21/32 ,  G06F21/57 ,  G06F21/606 ,  H04L63/0861 ,  H04L63/102

Abstract: The present disclosure is directed to secure sensor data transport and processing. End-to-end security may prevent attackers from altering data during the sensor-based security procedure. For example, following sensor data capture execution in a device may be temporarily suspended. During the suspension of execution, sensor interface circuitry in the device may copy the sensor data from a memory location associated with the sensor to a trusted execution environment (TEE) within the device. The TEE may provide a secure location in which the sensor data may be processed and a determination may be made as to whether to grant access to the secure resources. The TEE may comprise, for example, match circuitry to compare the sensor data to previously captured sensor data for users that are allowed to access the secured resources and output circuitry to grant access to the secured resources or to perform activities associated with a security exception.

公开(公告)号：US20210109300A1

公开(公告)日：2021-04-15

申请号：US16951723

申请日：2020-11-18

Applicant: INTEL CORPORATION

Inventor： MAHESH WAGH ,  MARK S. MYERS ,  STEPHEN R. VAN DOREN ,  DIMITRIOS ZIAKAS ,  BASSAM N. COURY

IPC: G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F3/06 ,  G06F16/901 ,  G11C5/02 ,  G11C14/00 ,  H03M7/40 ,  H04B10/25 ,  H04L12/24 ,  H04L12/26

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

公开(公告)号：US20190014113A1

公开(公告)日：2019-01-10

申请号：US16116145

申请日：2018-08-29

Applicant: INTEL CORPORATION

Inventor： HORMUZD M. KHOSRAVI ,  BASSAM N. COURY ,  VINCENT J. ZIMMER

IPC: H04L29/06 ,  G06F21/32 ,  G06F21/57 ,  G06F21/60

CPC classification number: H04L63/0876 ,  G06F21/32 ,  G06F21/57 ,  G06F21/606 ,  H04L63/0861 ,  H04L63/102

Abstract: The present disclosure is directed to secure sensor data transport and processing. End-to-end security may prevent attackers from altering data during the sensor-based security procedure. For example, following sensor data capture execution in a device may be temporarily suspended. During the suspension of execution, sensor interface circuitry in the device may copy the sensor data from a memory location associated with the sensor to a trusted execution environment (TEE) within the device. The TEE may provide a secure location in which the sensor data may be processed and a determination may be made as to whether to grant access to the secure resources. The TEE may comprise, for example, match circuitry to compare the sensor data to previously captured sensor data for users that are allowed to access the secured resources and output circuitry to grant access to the secured resources or to perform activities associated with a security exception.

公开(公告)号：US20180027679A1

公开(公告)日：2018-01-25

申请号：US15476910

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： MARK A. SCHMISSEUR ,  BASSAM N. COURY

IPC: H05K7/14

CPC classification number: H04Q11/0005 ,  B25J15/0014 ,  B65G1/0492 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G05D23/1921 ,  G05D23/2039 ,  G06F1/183 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0613 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0625 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/064 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/067 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/3887 ,  G06F9/4401 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F9/544 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/1694 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F16/9014 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C17/02 ,  G08C2200/00 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/3086 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/4056 ,  H03M7/4081 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04B10/2504 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L29/12009 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/145 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/00 ,  H04L49/15 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L49/555 ,  H04L67/02 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/16 ,  H04L67/306 ,  H04L67/34 ,  H04L69/04 ,  H04L69/329 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0003 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1442 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/14 ,  Y02D10/151 ,  Y02P90/30 ,  Y04S10/54 ,  Y10S901/01

Abstract: Examples may include sleds for a rack in a data center including physical compute resources and memory for the physical compute resources. The memory can be disaggregated, or organized into near and far memory. A first sled can comprise the physical compute resources and a first set of physical memory resources while a second sled can comprise a second set of physical memory resources. The first set of physical memory resources can be coupled to the physical compute resources via a local interface while the second set of physical memory resources can be coupled to the physical compute resources via a fabric.