公开(公告)号：US06841022B2

公开(公告)日：2005-01-11

申请号：US10260342

申请日：2002-10-01

申请人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

发明人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

IPC分类号： H01L25/18 ,  H01L21/52 ,  H01L21/60 ,  H01L21/603 ,  H01L21/68 ,  H01L25/04 ,  H05K3/32 ,  B32B31/18 ,  B05D5/12 ,  B32B31/20 ,  H01L21/50 ,  H01L21/58

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

摘要： An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.

摘要翻译： 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片，使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时，粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合膜层，使得粘合剂膜层涂覆电极表面的所有暴露部分并涂覆至少一个电极的所有暴露表面。

公开(公告)号：US06479757B1

公开(公告)日：2002-11-12

申请号：US09685951

申请日：2000-10-12

申请人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

发明人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

IPC分类号： H05K102

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

摘要： An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode

摘要翻译： 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片，使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时，粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合剂膜层，使得粘合剂膜层涂覆电极表面的所有暴露部分并且涂覆至少一个电极的所有暴露表面

公开(公告)号：US6158115A

公开(公告)日：2000-12-12

申请号：US907017

申请日：1997-08-06

申请人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

发明人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

IPC分类号： H01L25/18 ,  H01L21/52 ,  H01L21/60 ,  H01L21/603 ,  H01L21/68 ,  H01L25/04 ,  H05K3/32 ,  H05K3/30

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T428/2486 ,  Y10T428/287

摘要： A method of mounting electronic parts on a circuit board comprises an adhesive layer formation step of forming, on an electrode surface of each electronic part on which electrodes are formed, a film-like thermosetting adhesive layer having an area substantially equal to that of the corresponding electrode surface so as to obtain adhesive-coated electronic parts. The electrodes on which the adhesive layer is formed are arranged so as to face corresponding electrodes of the circuit board, and the electrodes are positioned relative to each other. Heat and pressure are applied to the electrodes of the electronic parts and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts on the circuit board, it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.

摘要翻译： 一种将电子部件安装在电路板上的方法包括：粘附层形成步骤，在其上形成有电极的每个电子部件的电极表面上形成具有基本上等于相应的面积的膜状热固性粘合剂层 电极表面，以获得粘合剂涂覆的电子部件。 其上形成有粘合剂层的电极被布置成面对电路板的相应电极，并且电极相对于彼此定位。 在电极定位后，将电压和电压施加到电子部件的电极和电路板的电极上以将电极彼此固定。 几乎没有粘合剂从电极表面多余地出来。 因此，当将电子部件安装在电路板上时，与常规方法不同，不需要去除多余的粘合剂，从而提高效率并且还可以降低成本。

公开(公告)号：US06338195B1

公开(公告)日：2002-01-15

申请号：US09472026

申请日：1999-12-27

申请人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

摘要翻译： 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，并且至少放置在第一粘合剂层的一侧。 在电极连接的同时，熔融时的第二粘合剂的粘度等于或低于第一粘合剂的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US6034331A

公开(公告)日：2000-03-07

申请号：US681397

申请日：1996-07-23

申请人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H01L21/60 ,  H05K3/32 ,  H05K1/16

CPC分类号： H01L24/83 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

摘要翻译： 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和位于第一粘合剂层的至少一侧并且包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，其中在此时 的第二粘合剂熔融时的粘度等于或低于第一粘合剂熔融时的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US06818086B2

公开(公告)日：2004-11-16

申请号：US10276179

申请日：2002-11-14

申请人： Motohiro Arifuku ,  Hiroshi Yasuda ,  Itsuo Watanabe ,  Kouji Kobayashi ,  Isao Tsukagoshi

发明人： Motohiro Arifuku ,  Hiroshi Yasuda ,  Itsuo Watanabe ,  Kouji Kobayashi ,  Isao Tsukagoshi

IPC分类号： B32B3500

CPC分类号： H05K3/225 ,  H05K3/323 ,  H05K3/361 ,  Y10T29/49117 ,  Y10T29/49718 ,  Y10T29/49721

摘要： The present invention is to provide a method for removing adhesive in a short time without requiring any solvent, a repair of which has conventionally been required for a long time, and there is provided a method for repairing a circuit connection part where circuit members having a large number of opposed circuits are connected electrically through an adhesive, wherein mutual joints at a circuit connection part requiring repair are separated, a basic material for transfer is bonded through a transfer adhesive for transfer to at least one circuit member where the adhesive remains and then the adhesive remaining on the circuit member and the transfer adhesive are removed from the circuit member along with the basic material for transfer.

摘要翻译： 本发明提供一种在短时间内除去粘合剂的方法，而不需要任何长期以往需要修复的任何溶剂，并且提供了一种修复电路连接部分的方法，其中电路部件具有 大量的相对电路通过粘合剂电连接，其中需要修复的电路连接部分处的相互接合被分开，用于转移的基本材料通过转移粘合剂结合以转移到至少一个留下粘合剂的电路构件，然后 残留在电路构件上的粘合剂和转移粘合剂与转移用基材一起从电路构件中除去。

公开(公告)号：US20100012358A1

公开(公告)日：2010-01-21

申请号：US12438883

申请日：2007-08-06

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Naoki Fukushima ,  Takanobu Kobayashi ,  Akihiro Ito

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Naoki Fukushima ,  Takanobu Kobayashi ,  Akihiro Ito

IPC分类号： H05K1/09 ,  H05K3/34

CPC分类号： H05K3/323 ,  C08K7/16 ,  C09J9/02 ,  C09J11/00 ,  H01B1/22 ,  H01L2224/83101 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/52 ,  H05K3/361 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T29/49144 ,  H01L2924/00

摘要： The circuit-connecting material of the present invention is a circuit-connecting material for connecting a first circuit component having a plurality of first circuit electrodes on a main surface of a first circuit board and a second circuit component having a plurality of second circuit electrodes on a main surface of a second circuit board, in such a manner that the first circuit electrodes and the second circuit electrodes are electrically connected while being opposed to one another; wherein the circuit-connecting material contains an adhesive composition, conductive particles, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particles.

摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于将具有多个第一电路电极的第一电路部件连接到第一电路板的主表面上，以及第二电路部件具有多个第二电路电极 第二电路板的主表面，使得第一电路电极和第二电路电极彼此相对电连接; 其中所述电路连接材料包含粘合剂组合物，导电颗粒和包含聚酰胺酸颗粒和聚酰亚胺颗粒中的一者或两者的多个绝缘颗粒。

公开(公告)号：US20120085579A1

公开(公告)日：2012-04-12

申请号：US12159323

申请日：2006-12-14

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Naoki Fukushima

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Naoki Fukushima

IPC分类号： H01R4/04 ,  H01B1/00

CPC分类号： H05K3/323 ,  C08K3/04 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/0209 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%.

摘要翻译： 一种粘合剂组合物，包括：粘合剂组分，导电颗粒和绝缘颗粒，其中绝缘颗粒Ri的平均粒度与导电颗粒Rc（R i / R c）的平均粒度之比为120至300％。

公开(公告)号：US08132319B2

公开(公告)日：2012-03-13

申请号：US12740801

申请日：2008-02-06

申请人： Motohiro Arifuku ,  Kazuyoshi Kojima ,  Kouji Kobayashi

发明人： Motohiro Arifuku ,  Kazuyoshi Kojima ,  Kouji Kobayashi

IPC分类号： H05K3/30

CPC分类号： H05K3/361 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/0191 ,  H05K2203/0594 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.

摘要翻译： 本发明提供一种电路连接方法，其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤，制备柔性布线基板14的步骤，该柔性布线基板14具有形成在基座14a上的电路电极14b，并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分，以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤，使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。

公开(公告)号：US20110300326A1

公开(公告)日：2011-12-08

申请号：US13143159

申请日：2010-02-24

申请人： Takashi Tatsuzawa ,  Takashi Seki ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Kotaro Seki

发明人： Takashi Tatsuzawa ,  Takashi Seki ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Kotaro Seki

IPC分类号： C09J7/02 ,  B32B3/16

CPC分类号： H01R4/04 ,  B65H18/28 ,  B65H2701/377 ,  C09J7/22 ,  C09J7/38 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0191

摘要： The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.

摘要翻译： 根据本发明的接合材料卷轴包括具有带状基材的电路连接带和形成在基材的一个表面上的粘合层，以及缠绕有用于电路连接的带的芯，其中 用于电路连接的带具有已经结合到终端的端带，其中粘合剂层不形成在芯的至少一个卷轴长度上的区域朝向端子的电路连接用带的起始端 以及设置成覆盖该区域的盖带。