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1.发明申请ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER 审中-公开胶粘组合物，电路连接材料和连接电路结构公开(公告)号：US20120085579A1
公开(公告)日：2012-04-12
申请号：US12159323
申请日：2006-12-14
CPC分类号： H05K3/323 , C08K3/04 , C08K3/08 , C09J9/02 , C09J11/04 , H01B1/22 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/29499 , H01L2224/32225 , H01L2224/83101 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K2201/0209 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%.
摘要翻译： 一种粘合剂组合物，包括：粘合剂组分，导电颗粒和绝缘颗粒，其中绝缘颗粒Ri的平均粒度与导电颗粒Rc（R i / R c）的平均粒度之比为120至300％。
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2.发明申请CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF 审中-公开电路连接材料，使用该电路的电路连接结构及其制造方法公开(公告)号：US20100012358A1
公开(公告)日：2010-01-21
申请号：US12438883
申请日：2007-08-06
CPC分类号： H05K3/323 , C08K7/16 , C09J9/02 , C09J11/00 , H01B1/22 , H01L2224/83101 , H01L2924/07811 , H01R4/04 , H01R12/52 , H05K3/361 , H05K2201/0154 , H05K2201/0212 , Y10T29/49144 , H01L2924/00
摘要： The circuit-connecting material of the present invention is a circuit-connecting material for connecting a first circuit component having a plurality of first circuit electrodes on a main surface of a first circuit board and a second circuit component having a plurality of second circuit electrodes on a main surface of a second circuit board, in such a manner that the first circuit electrodes and the second circuit electrodes are electrically connected while being opposed to one another; wherein the circuit-connecting material contains an adhesive composition, conductive particles, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particles.
摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于将具有多个第一电路电极的第一电路部件连接到第一电路板的主表面上，以及第二电路部件具有多个第二电路电极 第二电路板的主表面，使得第一电路电极和第二电路电极彼此相对电连接; 其中所述电路连接材料包含粘合剂组合物，导电颗粒和包含聚酰胺酸颗粒和聚酰亚胺颗粒中的一者或两者的多个绝缘颗粒。
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公开(公告)号：US20050151271A1
公开(公告)日：2005-07-14
申请号：US11029628
申请日：2005-01-06
IPC分类号： C09J7/02 , C09J4/02 , C09J7/00 , H01B1/22 , H01B5/00 , H01B5/16 , H01L21/60 , H01L23/482 , H01R11/01 , H05K1/14 , H05K3/32 , H01L23/48 , B32B3/00 , H04L12/28
CPC分类号： H01L24/83 , C09J7/10 , C09J2433/00 , H01L23/4828 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , Y10T428/24917 , Y10T428/2857 , Y10T428/2896 , H01L2924/00
摘要： The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
摘要翻译： 本发明提供了一种用于电路连接的粘合膜，其被插入在彼此面对的电路电极之间并且用于将电路电极彼此电连接，其包括固化剂以加热产生自由基，可自由基聚合的物质， 和成膜聚合物，并且其中具有电路电极的柔性基板的临时固定电力为40-180N / m。
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公开(公告)号：US07776438B2
公开(公告)日：2010-08-17
申请号：US11976506
申请日：2007-10-25
IPC分类号： B32B15/04
CPC分类号： H01L24/83 , C09J7/10 , C09J2433/00 , H01L23/4828 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , Y10T428/24917 , Y10T428/2857 , Y10T428/2896 , H01L2924/00
摘要： The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
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公开(公告)号：US20080064849A1
公开(公告)日：2008-03-13
申请号：US11976506
申请日：2007-10-25
CPC分类号： H01L24/83 , C09J7/10 , C09J2433/00 , H01L23/4828 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , Y10T428/24917 , Y10T428/2857 , Y10T428/2896 , H01L2924/00
摘要： The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
摘要翻译： 本发明提供了一种用于电路连接的粘合膜，其被插入在彼此面对的电路电极之间并且用于将电路电极彼此电连接，其包括固化剂以加热产生自由基，可自由基聚合的物质， 和成膜聚合物，并且其中具有电路电极的柔性基板的临时固定电力为40-180N / m。
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公开(公告)号：US07785708B2
公开(公告)日：2010-08-31
申请号：US11029628
申请日：2005-01-06
IPC分类号： B32B15/04
CPC分类号： H01L24/83 , C09J7/10 , C09J2433/00 , H01L23/4828 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , Y10T428/24917 , Y10T428/2857 , Y10T428/2896 , H01L2924/00
摘要： The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
摘要翻译： 本发明提供了一种用于电路连接的粘合膜，其被插入在彼此面对的电路电极之间并且用于将电路电极彼此电连接，其包括固化剂以加热产生自由基，可自由基聚合的物质， 和成膜聚合物，并且其中具有电路电极的柔性基板的临时固定电力为40-180N / m。
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公开(公告)号：US06841022B2
公开(公告)日：2005-01-11
申请号：US10260342
申请日：2002-10-01
IPC分类号： H01L25/18 , H01L21/52 , H01L21/60 , H01L21/603 , H01L21/68 , H01L25/04 , H05K3/32 , B32B31/18 , B05D5/12 , B32B31/20 , H01L21/50 , H01L21/58
CPC分类号： H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T428/2486 , Y10T428/287 , H01L2924/00
摘要： An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.
摘要翻译： 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片，使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时，粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合膜层，使得粘合剂膜层涂覆电极表面的所有暴露部分并涂覆至少一个电极的所有暴露表面。
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公开(公告)号：US06479757B1
公开(公告)日：2002-11-12
申请号：US09685951
申请日：2000-10-12
IPC分类号： H05K102
CPC分类号： H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T428/2486 , Y10T428/287 , H01L2924/00
摘要： An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode
摘要翻译： 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片，使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时，粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合剂膜层，使得粘合剂膜层涂覆电极表面的所有暴露部分并且涂覆至少一个电极的所有暴露表面
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公开(公告)号：US6158115A
公开(公告)日：2000-12-12
申请号：US907017
申请日：1997-08-06
IPC分类号： H01L25/18 , H01L21/52 , H01L21/60 , H01L21/603 , H01L21/68 , H01L25/04 , H05K3/32 , H05K3/30
CPC分类号： H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T428/2486 , Y10T428/287
摘要： A method of mounting electronic parts on a circuit board comprises an adhesive layer formation step of forming, on an electrode surface of each electronic part on which electrodes are formed, a film-like thermosetting adhesive layer having an area substantially equal to that of the corresponding electrode surface so as to obtain adhesive-coated electronic parts. The electrodes on which the adhesive layer is formed are arranged so as to face corresponding electrodes of the circuit board, and the electrodes are positioned relative to each other. Heat and pressure are applied to the electrodes of the electronic parts and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts on the circuit board, it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.
摘要翻译： 一种将电子部件安装在电路板上的方法包括：粘附层形成步骤，在其上形成有电极的每个电子部件的电极表面上形成具有基本上等于相应的面积的膜状热固性粘合剂层 电极表面，以获得粘合剂涂覆的电子部件。 其上形成有粘合剂层的电极被布置成面对电路板的相应电极，并且电极相对于彼此定位。 在电极定位后，将电压和电压施加到电子部件的电极和电路板的电极上以将电极彼此固定。 几乎没有粘合剂从电极表面多余地出来。 因此，当将电子部件安装在电路板上时，与常规方法不同，不需要去除多余的粘合剂，从而提高效率并且还可以降低成本。
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公开(公告)号：US10032952B2
公开(公告)日：2018-07-24
申请号：US12615244
申请日：2009-11-09
CPC分类号： H01L31/186 , C09J5/06 , C09J7/22 , C09J7/35 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/322 , C09J2400/163 , H01L31/0512 , Y02E10/50 , Y10T29/49194
摘要： The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.
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