公开(公告)号：US08012795B2

公开(公告)日：2011-09-06

申请号：US12379357

申请日：2009-02-19

申请人： Jean Brun ,  Benoît Lepine ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Benoît Lepine ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/00 ,  H01L21/50

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

摘要翻译： 该方法使得能够形成初始形成在晶片上的芯片的组装。 每个芯片包括由侧面连接的两个平行的主面。 至少一个侧面包括用于容纳螺纹元件的至少一个凹槽。 首先将晶片粘在柔性膜上，然后切割芯片。 然后将薄膜变形以使芯片彼此分开，并使凹槽可访问。 然后通过至少一个螺纹元件形成连接芯片的菊花链，每个芯片通过将线插入所述芯片的凹槽中而插入菊链中，然后从可变形薄膜去除芯片。

公开(公告)号：US08093617B2

公开(公告)日：2012-01-10

申请号：US12310246

申请日：2007-06-21

申请人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

发明人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

IPC分类号： H01L33/00

CPC分类号： H01L25/0657 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/481 ,  H01L23/58 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

摘要翻译： 微电子芯片包括两个平行的主面和侧面。 至少一个面包括设置有至少一个电连接元件并形成用于线元件的壳体的凹部。 线元件同时通过所述连接元件构成芯片和外部之间的电连接，以及用于所述芯片的柔性机械支撑。

公开(公告)号：US20090200066A1

公开(公告)日：2009-08-13

申请号：US12310246

申请日：2007-06-21

申请人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

发明人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

IPC分类号： H05K1/03 ,  H01K3/10

CPC分类号： H01L25/0657 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/481 ,  H01L23/58 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

摘要翻译： 微电子芯片包括两个平行的主面和侧面。 至少一个面包括设置有至少一个电连接元件并形成用于线元件的壳体的凹部。 线元件同时通过所述连接元件构成芯片和外部之间的电连接，以及用于所述芯片的柔性机械支撑。

公开(公告)号：US20100136746A1

公开(公告)日：2010-06-03

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/60

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US08258011B2

公开(公告)日：2012-09-04

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US20090227069A1

公开(公告)日：2009-09-10

申请号：US12379357

申请日：2009-02-19

申请人： Jean Brun ,  Benoit Lepine ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Benoit Lepine ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/78 ,  H01L21/67

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

摘要翻译： 该方法使得能够形成初始形成在晶片上的芯片的组装。 每个芯片包括由侧面连接的两个平行的主面。 至少一个侧面包括用于容纳螺纹元件的至少一个凹槽。 首先将晶片粘在柔性膜上，然后切割芯片。 然后将薄膜变形以将芯片彼此分开，并使凹槽可访问。 然后通过至少一个螺纹元件形成连接芯片的菊花链，每个芯片通过将线插入所述芯片的凹槽中而插入菊链中，然后从可变形薄膜去除芯片。

公开(公告)号：US20070200478A1

公开(公告)日：2007-08-30

申请号：US10581485

申请日：2004-11-30

申请人： Jean Dijon ,  Bruno Mourey ,  Jean-Frederic Clerc

发明人： Jean Dijon ,  Bruno Mourey ,  Jean-Frederic Clerc

IPC分类号： H01J1/00 ,  H01J63/04

CPC分类号： B82Y10/00 ,  H01J1/304 ,  H01J1/3044 ,  H01J9/025 ,  H01J2201/30469

摘要： A field emission device including a cathode, a porous insulating layer, of which the pores contain electron emitters, and a conductive layer as a gate layer.

摘要翻译： 一种场发射器件，包括阴极，多孔绝缘层，其中孔包含电子发射体，以及导电层作为栅极层。

公开(公告)号：US5319381A

公开(公告)日：1994-06-07

申请号：US047360

申请日：1993-04-19

申请人： Bruno Mourey ,  Eric Benoit ,  Antoine Dupont

发明人： Bruno Mourey ,  Eric Benoit ,  Antoine Dupont

IPC分类号： G02F1/133 ,  G09G3/20 ,  G09G3/36

CPC分类号： G09G3/2011 ,  G09G3/3648 ,  G09G3/3688 ,  G09G2310/0259 ,  G09G2320/0204 ,  G09G3/3614

摘要： Disclosed is a method for the addressing of each column of a matrix type LCD panel consisting in the production of a pulse to control a driver transistor of said column, said pulse having a duration determined by the value of the video signal sample at input, said pulse acting on the conduction state of said transistor to connect said column to a supply terminal where a voltage gradient develops. According to the method two pulse durations, the sum of which is predetermined, are alternated and, in order that a given value of a video signal sample may produce the same optical effect from one period to the next one, differentiated excitation voltages are applied to at least one of the electrodes sandwiching the liquid crystal layer, namely said column and its counter-electrode. Application notably to active matrix LCD panels.

摘要翻译： 公开了一种用于寻址矩阵型LCD面板的每列的方法，该矩阵型LCD面板包括产生脉冲以控制所述列的驱动晶体管，所述脉冲具有由输入端的视频信号样本的值确定的持续时间， 脉冲作用于所述晶体管的导通状态，以将所述列连接到产生电压梯度的电源端。 根据该方法，其总和为预定的两个脉冲持续时间是交替的，为了使视频信号样本的给定值可以从一个周期到下一个周期产生相同的光学效应，将分化的激励电压施加到 夹着液晶层的电极中的至少一个，即所述柱及其对置电极。 主要应用于有源矩阵液晶面板。

公开(公告)号：US08614698B2

公开(公告)日：2013-12-24

申请号：US12515247

申请日：2007-11-20

申请人： Yohan Desieres ,  Pierre Gidon ,  Ludovic Poupinet ,  Bruno Mourey

发明人： Yohan Desieres ,  Pierre Gidon ,  Ludovic Poupinet ,  Bruno Mourey

IPC分类号： G09G5/00 ,  G09G3/30

CPC分类号： H01L51/5265 ,  H01L27/3206 ,  H01L27/3244 ,  H01L51/5206 ,  H01L51/5209 ,  H01L51/5275

摘要： An electrode of a light-emitting device of the OLED type adapted for forming with a second electrode, an optical cavity, including at least one layer based on a material of refraction index n1 including a structured face comprising a plurality of recesses filled with a material of refractive index n2 different from n1.

摘要翻译： 适于与第二电极形成的OLED型发光器件的电极，光腔，其包括基于折射率n1的材料的至少一层，所述材料包括结构化面，所述结构化面包括填充有材料的多个凹部 的折射率n2不同于n1。

公开(公告)号：US07795575B2

公开(公告)日：2010-09-14

申请号：US12087592

申请日：2007-01-29

申请人： Christophe Kopp ,  Xavier Hugon ,  Bruno Mourey ,  Alexei Tchelnokov

发明人： Christophe Kopp ,  Xavier Hugon ,  Bruno Mourey ,  Alexei Tchelnokov

IPC分类号： F21V99/00

CPC分类号： H05B33/0869 ,  H01L25/167 ,  H01L2224/16225

摘要： The light-emitting device includes a base substrate and preferably three light-emitting diodes respectively associated with three primary colors and emitting a part of their signal in the direction of the base substrate. The device includes three chromatic photodetectors formed in the base substrate constituting a semiconducting substrate, and each arranged under an associated light-emitting diode. Each chromatic photodetector includes superposed first, second and third layers. The first layer and third layer have a first type of conductivity and the second layer has a second type of conductivity. The device includes a control component connected to the chromatic photodetectors and to the light-emitting diodes to control the global color of the light emitted by the device.

摘要翻译： 发光装置包括基底，优选地分别与三原色相配合的三个发光二极管，并在基底基板的方向上发射它们的一部分信号。 该器件包括形成在构成半导体衬底的基底衬底中的三个彩色光电检测器，并且每个配置在相关联的发光二极管的下方。 每个彩色光电探测器包括叠加的第一，第二和第三层。 第一层和第三层具有第一类型的导电性，第二层具有第二类导电性。 该装置包括连接到彩色光电检测器和发光二极管以控制由该装置发射的光的全局颜色的控制部件。