公开(公告)号：US20100136746A1

公开(公告)日：2010-06-03

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/60

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US08012795B2

公开(公告)日：2011-09-06

申请号：US12379357

申请日：2009-02-19

申请人： Jean Brun ,  Benoît Lepine ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Benoît Lepine ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/00 ,  H01L21/50

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

摘要翻译： 该方法使得能够形成初始形成在晶片上的芯片的组装。 每个芯片包括由侧面连接的两个平行的主面。 至少一个侧面包括用于容纳螺纹元件的至少一个凹槽。 首先将晶片粘在柔性膜上，然后切割芯片。 然后将薄膜变形以使芯片彼此分开，并使凹槽可访问。 然后通过至少一个螺纹元件形成连接芯片的菊花链，每个芯片通过将线插入所述芯片的凹槽中而插入菊链中，然后从可变形薄膜去除芯片。

公开(公告)号：US08093617B2

公开(公告)日：2012-01-10

申请号：US12310246

申请日：2007-06-21

申请人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

发明人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

IPC分类号： H01L33/00

CPC分类号： H01L25/0657 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/481 ,  H01L23/58 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

摘要翻译： 微电子芯片包括两个平行的主面和侧面。 至少一个面包括设置有至少一个电连接元件并形成用于线元件的壳体的凹部。 线元件同时通过所述连接元件构成芯片和外部之间的电连接，以及用于所述芯片的柔性机械支撑。

公开(公告)号：US20090200066A1

公开(公告)日：2009-08-13

申请号：US12310246

申请日：2007-06-21

申请人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

发明人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

IPC分类号： H05K1/03 ,  H01K3/10

CPC分类号： H01L25/0657 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/481 ,  H01L23/58 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

摘要翻译： 微电子芯片包括两个平行的主面和侧面。 至少一个面包括设置有至少一个电连接元件并形成用于线元件的壳体的凹部。 线元件同时通过所述连接元件构成芯片和外部之间的电连接，以及用于所述芯片的柔性机械支撑。

公开(公告)号：US08258011B2

公开(公告)日：2012-09-04

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US20090227069A1

公开(公告)日：2009-09-10

申请号：US12379357

申请日：2009-02-19

申请人： Jean Brun ,  Benoit Lepine ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Benoit Lepine ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/78 ,  H01L21/67

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

摘要翻译： 该方法使得能够形成初始形成在晶片上的芯片的组装。 每个芯片包括由侧面连接的两个平行的主面。 至少一个侧面包括用于容纳螺纹元件的至少一个凹槽。 首先将晶片粘在柔性膜上，然后切割芯片。 然后将薄膜变形以将芯片彼此分开，并使凹槽可访问。 然后通过至少一个螺纹元件形成连接芯片的菊花链，每个芯片通过将线插入所述芯片的凹槽中而插入菊链中，然后从可变形薄膜去除芯片。

公开(公告)号：US08782880B2

公开(公告)日：2014-07-22

申请号：US13115419

申请日：2011-05-25

申请人： Dominique Vicard ,  Jean Brun

发明人： Dominique Vicard ,  Jean Brun

IPC分类号： B23P19/00 ,  H01R43/00 ,  B65B15/00 ,  H01L25/065

CPC分类号： B65B15/00 ,  H01L25/0655 ,  H01L2924/0002 ,  Y10T29/5187 ,  Y10T29/5193 ,  Y10T29/53178 ,  Y10T29/53213 ,  Y10T29/53261 ,  H01L2924/00

摘要： An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.

摘要翻译： 一种用于在线上组装芯片器件的装置，每个芯片器件包括两个基本上平行的侧壁，以及用于接收所述线的一个侧壁中的凹槽。 该装置包括具有两个相对表面的夹持装置，相对表面之间的距离基本上恒定并且基本上等于芯片装置的两个侧壁之间的距离。 供线器适于连续地将电线与夹持装置的相对表面中的一个接触。 芯片装置馈送器适于在相对的表面之间一次一个地驱动芯片装置，并且它们的槽朝向导线。 夹持装置可以包括具有基本上垂直于线的旋转轴的两个圆柱形辊，相对的表面由辊的相应表面形成。

公开(公告)号：US08611101B2

公开(公告)日：2013-12-17

申请号：US13124762

申请日：2009-10-21

申请人： Jean Brun ,  Sophie Verrun ,  Dominique Vicard

发明人： Jean Brun ,  Sophie Verrun ,  Dominique Vicard

IPC分类号： H01R9/00 ,  H01R43/00

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/85 ,  H01L25/065 ,  H01L25/50 ,  H01L2224/32014 ,  H01L2224/45015 ,  H01L2224/45028 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/858 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  Y10T29/49194 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.

摘要翻译： 组装具有线元件的至少一个微电子芯片，该芯片包括用于嵌入线元件的凹槽。 线元件是具有基本上平行于凹槽的轴线的纵向轴线的线，包括至少两个被绝缘体覆盖的导电线。 该芯片包括凹槽中的至少一个导电凸块，该凸起与该线束的单根导电线的剥离区域电接触。

公开(公告)号：US20100245182A1

公开(公告)日：2010-09-30

申请号：US12665419

申请日：2008-06-18

申请人： Dominique Vicard ,  Jean Brun ,  Benoit Lepine

发明人： Dominique Vicard ,  Jean Brun ,  Benoit Lepine

IPC分类号： H01Q1/24 ,  H01L21/98

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.

摘要翻译： 本发明涉及射频发送/接收设备的制造。 本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时 机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

公开(公告)号：US08814054B2

公开(公告)日：2014-08-26

申请号：US13703255

申请日：2011-06-23

申请人： Jean Brun ,  Laurent Lancon ,  Dominique Vicard

发明人： Jean Brun ,  Laurent Lancon ,  Dominique Vicard

IPC分类号： G06K19/06 ,  D02G3/36 ,  G06K19/077 ,  H01L25/00 ,  H01L23/00

CPC分类号： G06K19/07749 ,  D02G3/362 ,  D10B2401/18 ,  G06K19/07718 ,  G06K19/07758 ,  G06K19/07786 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/78 ,  H01L2224/8517 ,  H01L2224/858 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01058 ,  Y10T29/49002 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.

摘要翻译： 一种用于形成护套线的方法包括以下步骤：使芯通过护套区域轴向推进; 在护套区域围绕芯部缠绕护套纤维; 并且在护套区域中提供一系列各自设置有线部分的微电子芯片元件，使得围绕芯部包覆的护套纤维也缠绕在芯片元件及其线部分上以形成护套线 结合间隔开的芯片元件。