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    Wireless communication medium and method for operating the same
    1.
    再颁专利
    Wireless communication medium and method for operating the same 有权
    无线通信介质及其操作方法

    公开(公告)号：USRE44415E1

    公开(公告)日：2013-08-06

    申请号：US13283515

    申请日：2011-10-27

    申请人： Ji Man Park ,  Yong-sung Jeon ,  Hong-il Ju ,  Young-soo Park ,  Sung-ik Jun ,  Kyo-il Chung

    发明人： Ji Man Park ,  Yong-sung Jeon ,  Hong-il Ju ,  Young-soo Park ,  Sung-ik Jun ,  Kyo-il Chung

    IPC分类号： H04B1/16

    CPC分类号： G06K19/0723

    摘要： A wireless communication medium includes an antenna, an analog signal processor, a digital signal processor, and a central processing unit & logic module. The antenna transmits and receives a signal to and from an external apparatus. The analog signal processor converts an analog signal to a digital signal, and converts a digital signal to an analog signal. The digital signal processor demodulates the digital signal, detects the start and end of data, and generates a first control signal for determining whether data is transmitted to the external apparatus and a second control signal for perceiving the end of data, blocking the reception of data, modulating data, and determining whether modulated data is transmitted to the external apparatus. The central processing unit & logic module processes data received from and transmitted to the external apparatus. Accordingly, an efficiency of processing a RF signal can be improved.

    摘要翻译： 无线通信介质包括天线，模拟信号处理器，数字信号处理器和中央处理单元和逻辑模块。 天线向外部设备发送和接收信号。 模拟信号处理器将模拟信号转换为数字信号，并将数字信号转换为模拟信号。 数字信号处理器解调数字信号，检测数据的开始和结束，并且产生用于确定数据是否被发送到外部设备的第一控制信号和用于感知数据结束的第二控制信号，阻止数据的接收 调制数据，以及确定调制数据是否被发送到外部设备。 中央处理单元和逻辑模块处理从外部设备接收和发送的数据。 因此，可以提高处理RF信号的效率。

    Wireless communication medium and method for operating the same
    2.
    发明授权
    Wireless communication medium and method for operating the same 有权
    无线通信介质及其操作方法

    公开(公告)号：US07177621B2

    公开(公告)日：2007-02-13

    申请号：US10334355

    申请日：2002-12-31

    申请人： Ji-man Park ,  Yong-sung Jeon ,  Hong-il Ju ,  Young-soo Park ,  Sung-ik Jun ,  Kyo-il Chung

    发明人： Ji-man Park ,  Yong-sung Jeon ,  Hong-il Ju ,  Young-soo Park ,  Sung-ik Jun ,  Kyo-il Chung

    IPC分类号： H04B1/16

    CPC分类号： G06K19/0723

    摘要： A wireless communication medium includes an antenna, an analog signal processor, a digital signal processor, and a central processing unit & logic module. The antenna transmits and receives a signal to and from an external apparatus. The analog signal processor converts an analog signal to a digital signal, and converts a digital signal to an analog signal. The digital signal processor demodulates the digital signal, detects the start and end of data, and generates a first control signal for determining whether data is transmitted to the external apparatus and a second control signal for perceiving the end of data, blocking the reception of data, modulating data, and determining whether modulated data is transmitted to the external apparatus. The central processing unit & logic module processes data received from and transmitted to the external apparatus. Accordingly, an efficiency of processing a RF signal can be improved.

    摘要翻译： 无线通信介质包括天线，模拟信号处理器，数字信号处理器和中央处理单元和逻辑模块。 天线向外部设备发送和接收信号。 模拟信号处理器将模拟信号转换为数字信号，并将数字信号转换为模拟信号。 数字信号处理器解调数字信号，检测数据的开始和结束，并且产生用于确定数据是否被发送到外部设备的第一控制信号和用于感知数据结束的第二控制信号，阻止数据的接收 调制数据，以及确定调制数据是否被发送到外部设备。 中央处理单元和逻辑模块处理从外部设备接收和发送的数据。 因此，可以提高处理RF信号的效率。

    Wireless communication medium and method for operating the same
    3.
    再颁专利
    Wireless communication medium and method for operating the same 有权
    无线通信介质及其操作方法

    公开(公告)号：USRE43001E1

    公开(公告)日：2011-12-06

    申请号：US12368589

    申请日：2009-02-10

    申请人： Ji Man Park ,  Yong-sung Jeon ,  Hong-il Ju ,  Young-soo Park ,  Sung-ik Jun ,  Kyo-ill Chung

    发明人： Ji Man Park ,  Yong-sung Jeon ,  Hong-il Ju ,  Young-soo Park ,  Sung-ik Jun ,  Kyo-ill Chung

    IPC分类号： H04B1/16

    CPC分类号： G06K19/0723

    摘要： A wireless communication medium includes an antenna, an analog signal processor, a digital signal processor, and a central processing unit & logic module. The antenna transmits and receives a signal to and from an external apparatus. The analog signal processor converts an analog signal to a digital signal, and converts a digital signal to an analog signal. The digital signal processor demodulates the digital signal, detects the start and end of data, and generates a first control signal for determining whether data is transmitted to the external apparatus and a second control signal for perceiving the end of data, blocking the reception of data, modulating data, and determining whether modulated data is transmitted to the external apparatus. The central processing unit & logic module processes data received from and transmitted to the external apparatus. Accordingly, an efficiency of processing a RF signal can be improved.

    摘要翻译： 无线通信介质包括天线，模拟信号处理器，数字信号处理器和中央处理单元和逻辑模块。 天线向外部设备发送和接收信号。 模拟信号处理器将模拟信号转换为数字信号，并将数字信号转换为模拟信号。 数字信号处理器解调数字信号，检测数据的开始和结束，并且产生用于确定数据是否被发送到外部设备的第一控制信号和用于感知数据结束的第二控制信号，阻止数据的接收 调制数据，以及确定调制数据是否被发送到外部设备。 中央处理单元和逻辑模块处理从外部设备接收和发送的数据。 因此，可以提高处理RF信号的效率。

    Microprocessor chip, data center, and computing system
    4.
    发明授权
    Microprocessor chip, data center, and computing system 有权
    微处理器芯片，数据中心和计算系统

    公开(公告)号：US09059808B2

    公开(公告)日：2015-06-16

    申请号：US13611839

    申请日：2012-09-12

    申请人： Ho-jung Kim ,  Young-soo Park

    发明人： Ho-jung Kim ,  Young-soo Park

    IPC分类号： H04B10/00 ,  H04B10/80

    CPC分类号： H04B10/801

    摘要： A microprocessor chip includes a plurality of processors; at least one first optical input/output unit configured to receive optical signals from an external device and transmit optical signals to the external device; and an optical system bus that is connected between the plurality of processors and the at least one first optical input/output unit.

    摘要翻译： 微处理器芯片包括多个处理器; 至少一个第一光输入/输出单元，被配置为从外部设备接收光信号并将光信号传输到所述外部设备; 以及连接在所述多个处理器与所述至少一个第一光学输入/输出单元之间的光学系统总线。

    Hybrid laser light sources for photonic integrated circuits
    5.
    发明授权
    Hybrid laser light sources for photonic integrated circuits 有权
    用于光子集成电路的混合激光光源

    公开(公告)号：US09042690B2

    公开(公告)日：2015-05-26

    申请号：US13614432

    申请日：2012-09-13

    申请人： Bok-ki Min ,  Taek Kim ,  Young-soo Park

    发明人： Bok-ki Min ,  Taek Kim ,  Young-soo Park

    IPC分类号： G02B6/34 ,  H01S3/08 ,  H01S5/183 ,  H01S3/00 ,  H01S5/20

    CPC分类号： H01S5/18358 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/1032 ,  H01S5/105 ,  H01S5/18325 ,  H01S5/18341 ,  H01S5/18361 ,  H01S5/1838 ,  H01S5/2018 ,  H01S5/2031

    摘要： A light source for a photonic integrated circuit may comprise a reflection coupling layer formed on a substrate in which an optical waveguide is provided, at least one side of the reflection coupling layer being optically connected to the optical waveguide; an optical mode alignment layer provided on the reflection coupling layer; and/or an upper structure provided on the optical mode alignment layer and including an active layer for generating light and a reflection layer provided on the active layer. A light source for a photonic integrated circuit may comprise a lower reflection layer; an optical waveguide optically connected to the lower reflection layer; an optical mode alignment layer on the lower reflection layer; an active layer on the optical mode alignment layer; and/or an upper reflection layer on the active layer.

    摘要翻译： 用于光子集成电路的光源可以包括形成在其中设置有光波导的基板上的反射耦合层，反射耦合层的至少一侧光学连接到光波导; 设置在反射耦合层上的光学模式取向层; 和/或设置在光学模式对准层上的上部结构，并且包括用于产生光的有源层和设置在有源层上的反射层。 光子集成电路的光源可以包括下反射层; 与下反射层光学连接的光波导; 在下反射层上的光学取向层; 光学对准层上的有源层; 和/或有源层上的上反射层。

    3D CMOS image sensors, sensor systems including the same
    6.
    发明授权
    3D CMOS image sensors, sensor systems including the same 有权
    3D CMOS图像传感器，传感器系统包括相同

    公开(公告)号：US09035309B2

    公开(公告)日：2015-05-19

    申请号：US12984972

    申请日：2011-01-05

    申请人： Young-soo Park ,  Won-joo Kim ,  Kyoo-chul Cho ,  Gi-jung Kim ,  Sam-jong Choi

    发明人： Young-soo Park ,  Won-joo Kim ,  Kyoo-chul Cho ,  Gi-jung Kim ,  Sam-jong Choi

    IPC分类号： H01L27/146

    CPC分类号： H01L27/14629 ,  H01L27/14687

    摘要： A three-dimensional (3D) CMOS image sensor (CIS) that sufficiently absorbs incident infrared-rays (IRs) and includes an infrared-ray (IR) receiving unit formed in a thin epitaxial film, thereby being easily manufactured using a conventional CIS process, a sensor system including the 3D CIS, and a method of manufacturing the 3D CIS, the 3D CIS including an IR receiving part absorbing IRs incident thereto by repetitive reflection to produce electron-hole pairs (EHPs); and an electrode part formed on the IR receiving part and collecting electrons produced by applying a predetermined voltage thereto.

    摘要翻译： 一种三维（3D）CMOS图像传感器（CIS），其足以吸收入射的红外线（IR）并且包括形成在薄的外延膜中的红外线（IR）接收单元，由此容易地使用传统的CIS工艺 包括3D CIS的传感器系统和制造3D CIS的方法，3D CIS包括通过重复反射吸收入射到其中的IR的IR接收部分以产生电子 - 空穴对（EHP）; 以及形成在IR接收部上并且收集通过施加预定电压而产生的电子的电极部分。

    Microlens and an image sensor including a microlens
    9.
    发明授权
    Microlens and an image sensor including a microlens 失效
    微透镜和包括微透镜的图像传感器

    公开(公告)号：US08508009B2

    公开(公告)日：2013-08-13

    申请号：US12662607

    申请日：2010-04-26

    申请人： Huaxiang Yin ,  Hyuck Lim ,  Young-soo Park ,  Wenxu Xianyu ,  Hans S. Cho

    发明人： Huaxiang Yin ,  Hyuck Lim ,  Young-soo Park ,  Wenxu Xianyu ,  Hans S. Cho

    IPC分类号： H01L31/062 ,  H01L27/146 ,  H01L31/107

    CPC分类号： H01L27/14627 ,  H01L27/14621 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02327

    摘要： A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.

    摘要翻译： 提供微透镜，包括微透镜的图像传感器，形成微透镜的方法和制造图像传感器的方法。 微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。 微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。 形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案，在硅图案上的半导体衬底上形成覆盖膜，使硅图案和覆盖膜退火，将硅图案改变为具有 圆筒形，并且封盖膜用于圆形微透镜的外壳部分，并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。 图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。