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公开(公告)号：US20080220567A1
公开(公告)日：2008-09-11
申请号：US11817520
申请日：2006-02-20
IPC分类号： H01L21/56
CPC分类号： H01L23/49894 , H01L21/56 , H01L23/293 , H01L23/3142 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.
摘要翻译： 公开了半导体部件。 在一个实施例中，半导体部件包括布置在基板上的半导体芯片和至少部分地围绕半导体芯片的壳体。 衬底至少部分地设置有聚合物泡沫层。
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2.发明授权Semiconductor chip comprising a metal coating structure and associated production method 有权半导体芯片包括金属涂层结构和相关联的制造方法公开(公告)号：US07880300B2
公开(公告)日：2011-02-01
申请号：US11692530
申请日：2007-03-28
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L23/3142 , H01L23/53238 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05017 , H01L2224/05557 , H01L2224/05562 , H01L2224/05664 , H01L2224/1147 , H01L2224/13099 , H01L2224/45124 , H01L2224/48764 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/48 , H01L2224/05552
摘要： A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).
摘要翻译： 半导体芯片（1）具有在半导体芯片（1）的有源上侧（3）上具有至少一个具有铜或铜合金的下金属层（8）的金属涂层结构（2），在其上具有中心 配置有镍的金属层（9）。 金属涂层结构（2）由钯和/或贵金属的上金属层（10）封端。 具有镍和/或镍磷化物的中心金属层（9）相对于围绕金属涂层结构（2）的塑料封装模塑料具有粗糙界面（11）。
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3.发明授权公开(公告)号：US07749797B2
公开(公告)日：2010-07-06
申请号：US11574861
申请日：2005-08-18
IPC分类号： H01L21/00 , H01L21/48 , H01L31/0203 , H01L23/28
CPC分类号： H01L31/0203 , H01L23/24 , H01L23/49861 , H01L24/83 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83192 , H01L2224/85385 , H01L2224/92247 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
摘要翻译： 公开了半导体器件和方法。 在一个实施例中，半导体器件包括空腔壳体和传感器芯片。 在一个实施例中，空腔壳体具有到周围的开口。 传感器芯片的传感器区域面向所述开口。 传感器芯片与空腔外壳机械分离。 在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。
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4.发明申请公开(公告)号：US20090026558A1
公开(公告)日：2009-01-29
申请号：US11574861
申请日：2005-08-18
CPC分类号： H01L31/0203 , H01L23/24 , H01L23/49861 , H01L24/83 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83192 , H01L2224/85385 , H01L2224/92247 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
摘要翻译： 公开了一种半导体传感器装置和方法。 在一个实施例中，半导体器件包括空腔壳体和传感器芯片。 在一个实施例中，空腔壳体具有到周围的开口。 传感器芯片的传感器区域面向所述开口。 传感器芯片与空腔外壳机械分离。 在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。
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5.发明申请公开(公告)号：US20080224301A1
公开(公告)日：2008-09-18
申请号：US11927239
申请日：2007-10-29
CPC分类号： H01L23/49513 , H01L23/3107 , H01L23/3142 , H01L23/49586 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , Y10S977/938 , H01L2924/00012 , H01L2224/48227 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.
摘要翻译： 用于半导体部件的引线结构包括：用于在塑料外壳组合物外部的外部连接的外部引线，用于塑料外壳组合物内的电连接的内部引线以及由引线材料构成的芯片安装岛。 在离开内部引线的自由接触垫的同时，芯片安装岛的顶侧和内部引线配备有作为锚定层的纳米管。 塑料外壳组合物布置在布置在内部引线上的纳米管之间的间隙中，而用于半导体芯片的粘合剂组合物布置在布置在芯片安装岛上的纳米管之间的间隙中。 粘合剂组合物和塑料外壳组合物以无空隙的方式填充空隙。
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公开(公告)号：US08017438B2
公开(公告)日：2011-09-13
申请号：US11612758
申请日：2006-12-19
IPC分类号： H01L21/00
CPC分类号： H01L23/5385 , H01L23/49531 , H01L23/49575 , H01L23/49811 , H01L24/48 , H01L25/162 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.
摘要翻译： 半导体模块包括：模块封装，包括具有第一半导体器件的第一衬底和具有第二半导体器件的第二衬底。 第一外导体从模块封装延伸并连接到第一基板，第二外导体从模块封装延伸并连接到第二基板。 制造半导体模块的方法包括将引线框架的第一外导体附接到第一基板，其中第一基板包括在附接第一外导体之前或之后附接到第一基板的第一半导体器件。 提供了包括信号处理电路的第二基板，并且第二基板紧固到引线框架的第二外导体。
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7.发明授权Power semiconductor device in lead frame employing connecting element with conductive film 有权引线框中的功率半导体器件采用带导电膜的连接元件公开(公告)号：US08013441B2
公开(公告)日：2011-09-06
申请号：US11581678
申请日：2006-10-16
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/0603 , H01L2224/32245 , H01L2224/40095 , H01L2224/40245 , H01L2224/48247 , H01L2224/73221 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12043 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least one large-area electrode on its top side and a large-area electrode on its rear side. The rear side electrode is surface-mounted on a lead frame chip island of a lead frame and the top side electrode is electrically connected to an internal lead of the lead frame via a connecting element. The connecting element has an electrically conductive film on a surface facing the top side electrode, the electrically conductive film extending from the top side electrode to the internal lead.
摘要翻译： 本发明的一个方面涉及引线框技术中的功率半导体器件及其制造方法。 功率半导体器件具有穿过功率半导体芯片的垂直电流路径。 功率半导体芯片在其顶侧具有至少一个大面积电极，在其后侧具有大面积电极。 背面电极被表面安装在引线框架的引线框架芯片岛上，并且顶侧电极经由连接元件电连接到引线框架的内部引线。 连接元件在面向顶侧电极的表面上具有导电膜，导电膜从顶侧电极延伸到内部引线。
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8.发明申请公开(公告)号：US20100207277A1
公开(公告)日：2010-08-19
申请号：US10598143
申请日：2005-02-09
申请人： Michael Bauer , Thomas Engling , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
发明人： Michael Bauer , Thomas Engling , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
CPC分类号： H01L23/538 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24051 , H01L2224/24145 , H01L2224/24146 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2924/01032 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
摘要翻译： 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。
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9.发明授权Semiconductor component including semiconductor chip and method for producing the same 有权包括半导体芯片的半导体元件及其制造方法公开(公告)号：US07768107B2
公开(公告)日：2010-08-03
申请号：US11598203
申请日：2006-11-13
IPC分类号： H01L23/02
CPC分类号： H01L23/4334 , H01L23/42 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01068 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes at least one semiconductor chip arranged on a mounting substrate and connected thereto via bonding wires. For effective dissipation of heat, a solderable interlayer is arranged on the active upper side of the semiconductor chip and a heat sink is soldered onto the solderable interlayer. A method is also described for producing a semiconductor component with a solderable interlayer disposed on an active upper side of a semiconductor chip and with a heat sink soldered to the solderable interlayer.
摘要翻译： 半导体部件包括布置在安装基板上并通过接合线与其连接的至少一个半导体芯片。 为了有效散热，在半导体芯片的有源上侧设置可焊接中间层，将散热器焊接到可焊接中间层上。 还描述了一种用于制造具有可焊接中间层的半导体部件的方法，其设置在半导体芯片的有源上侧上并且将散热器焊接到可焊接中间层。
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10.发明申请公开(公告)号：US20090039484A1
公开(公告)日：2009-02-12
申请号：US11834262
申请日：2007-08-06
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/50 , H01L24/83 , H01L24/84 , H01L24/86 , H01L2224/06181 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32245 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/37647 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2224/8384 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/0105 , H01L2924/01049 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
摘要翻译： 半导体芯片在其顶侧具有至少一个第一接触和一个第二触点，并具有连接在结构元件上的连接元件，并且将半导体芯片的顶侧的第一触点和第二触点连接到外部 联系人
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