公开(公告)号：US20100221559A1

公开(公告)日：2010-09-02

申请号：US12680923

申请日：2008-10-02

申请人： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

发明人： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

IPC分类号： B32B15/02 ,  H01B1/02 ,  H01B1/22

CPC分类号： H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

摘要： There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

摘要翻译： 提供了一种粘合剂组合物，其保持储存稳定性，并且进一步得到固化产物，其中在固化产物润湿其组分并令人满意地在组分（或部分）之间铺展的状态下形成金属粘合剂，由此转变优异的粘合性能 ，导电性和安装的可靠性，如TCT电阻或耐高温电阻; 使用该基板的电子元件安装基板; 和半导体器件。 粘合剂组合物包括导电颗粒（A）和粘合剂组分（B），其中导电颗粒（A）包括熔点等于或高于回流温度并且不含铅的金属（a1）和金属 （a2），其熔点低于回流温度，不含铅，粘合剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

公开(公告)号：US09247652B2

公开(公告)日：2016-01-26

申请号：US12680923

申请日：2008-10-02

申请人： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

发明人： Kaoru Konno ,  Hiroki Hayashi ,  Takashi Kawamori

IPC分类号： B32B15/02 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  B22F1/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  B23K35/365 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00 ,  C08K3/00 ,  C08K3/08 ,  H05K1/14

CPC分类号： H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

摘要： There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

摘要翻译： 提供了一种粘合剂组合物，其保持储存稳定性，并进一步得到固化产物，其中在固化产物润湿其组分并令人满意地在组分（或部分）之间铺展的状态下形成金属粘合剂，由此转变粘合性能优异 ，导电性和安装的可靠性，如TCT电阻或耐高温电阻; 使用该基板的电子元件安装基板; 和半导体器件。 粘合剂组合物包括导电颗粒（A）和粘合剂组分（B），其中导电颗粒（A）包括熔点等于或高于回流温度并且不含铅的金属（a1）和金属 （a2），其熔点低于回流温度，不含铅，粘合剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

公开(公告)号：US08421247B2

公开(公告)日：2013-04-16

申请号：US12990082

申请日：2009-04-28

申请人： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

发明人： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC分类号： H01L23/488 ,  B32B5/16 ,  C09K5/00 ,  C22C5/06

CPC分类号： H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

摘要： A connecting material that includes metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy and a mean particle size between 0.1 μm and 50 μm; and especially a connecting material that includes metallic particles that have been subjected to treatment for removal of a surface oxide film and subjected to surface treatment with a surface protective material, so as to provide a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C.; as well as a semiconductor device employing the connecting material to bond a semiconductor element to a support member.

摘要翻译： 一种连接材料，其包含通过X射线光电子能谱测定的氧状态比小于15％的金属颗粒，平均粒径为0.1μm至50μm; 特别是包含金属粒子的连接材料，该金属粒子已被处理去除表面氧化膜并用表面保护材料进行表面处理，从而即使在连接时也提供具有高导热系数的连接材料 在高达200℃的固化温度下，不施加负载，并且即使当固化产物在260℃下被加热时也具有足够的粘合强度; 以及使用连接材料将半导体元件结合到支撑构件的半导体器件。

公开(公告)号：US20110101543A1

公开(公告)日：2011-05-05

申请号：US12990082

申请日：2009-04-28

申请人： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

发明人： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC分类号： H01L23/488 ,  C09K5/00 ,  C22C5/06 ,  B32B5/16

CPC分类号： H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

摘要： The invention provides a connecting material comprising metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy, and especially a connecting material comprising metallic particles that have been subjected to treatment for removal of the surface oxide film and to surface treatment with a surface protective material, for the purpose of providing a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C., as well as a semiconductor device employing it.

摘要翻译： 本发明提供了一种连接材料，其包括通过X射线光电子能谱法测量的氧状态比小于15％的金属颗粒，特别是包括已经经过去除表面氧化膜的处理的金属颗粒的连接材料， 为了提供具有高导热系数的连接材料的目的，即使在高达200℃的固化温度下接合而不施加负载，并且具有足够的接合强度 即使固化产物已经在260℃加热，以及使用它的半导体器件也是如此。

公开(公告)号：US20130302603A1

公开(公告)日：2013-11-14

申请号：US13981612

申请日：2012-01-24

申请人： Kaoru Konno ,  Hiroki Hayashi ,  Michiko Natori

发明人： Kaoru Konno ,  Hiroki Hayashi ,  Michiko Natori

IPC分类号： H01L23/00

CPC分类号： H01L24/28 ,  C08K3/08 ,  C08K5/04 ,  C08K7/06 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  H01B1/02 ,  H01B1/22 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05655 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The adhesive composition of the present invention includes (A) flake silver particles wherein an oxygen state ratio derived from silver oxide measured by X-ray photoelectron spectroscopy is less than 15% and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or more.

摘要翻译： 本发明的粘合剂组合物包括（A）通过X射线光电子能谱测定的氧化银得到的氧状态比小于15％的片状银粒子，（B）沸点为300的醇或羧酸 °C以上。

公开(公告)号：US20130183535A1

公开(公告)日：2013-07-18

申请号：US13823278

申请日：2011-09-27

申请人： Kaoru Konno ,  Hiroki Hayashi

发明人： Kaoru Konno ,  Hiroki Hayashi

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  C08K2003/0806 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/04026 ,  H01L2224/05644 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive composition having high electrical conductibility and thermal conductivity under no load and even at a curing temperature of 200° C. or lower, and having a high adhesive force even at 260° C., and a semiconductor device produced by using the adhesive composition are provided. Disclosed is an adhesive composition comprising (A) silver particles having a state ratio of oxygen derived from silver oxide of less than 15% as measured by X-ray photoelectron spectroscopy, and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or higher.

摘要翻译： 一种粘合剂组合物，其在无负载下甚至在200℃或更低的固化温度下具有高导电性和导热性，并且即使在260℃也具有高的粘合力，以及通过使用粘合剂组合物制备的半导体器件 被提供。 公开了一种粘合剂组合物，其包含（A）通过X射线光电子能谱法测量的，氧化银衍生自氧化银的氧的状态比例小于15％的银颗粒，（B）沸点为300的醇或羧酸 ℃以上。

公开(公告)号：USD1030020S1

公开(公告)日：2024-06-04

申请号：US29828869

申请日：2022-03-01

申请人： Hiroki Hayashi ,  Chihiro Sugano ,  Takaaki Sanagi ,  Koki Nishikawa

设计人： Hiroki Hayashi ,  Chihiro Sugano ,  Takaaki Sanagi ,  Koki Nishikawa

摘要： FIG. 1 is a perspective view of an air conditioner showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a right side view thereof;
FIG. 8 is a sectional view thereof taken along line 8-8 in FIG. 2; and,
FIG. 9 is a perspective view thereof in a state of the usage.

公开(公告)号：US08962986B2

公开(公告)日：2015-02-24

申请号：US13501981

申请日：2010-10-14

申请人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Michiko Natori ,  Aya Momozaki

发明人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Michiko Natori ,  Aya Momozaki

IPC分类号： H01L31/00 ,  H01B1/22 ,  C09J9/02 ,  H01L31/0224 ,  H01L31/048 ,  H01L31/05

CPC分类号： H01B1/22 ,  C09J9/02 ,  H01L31/022425 ,  H01L31/048 ,  H01L31/0512 ,  Y02E10/50

摘要： A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.

摘要翻译： 提供了包含导电颗粒的导电粘合剂，包括金属，热固性树脂，助熔剂，优选流变控制剂。 导电性粒子的熔点优选为220℃以下。 导电性粘合剂用于将配线构件4a，4b电连接并粘接到与太阳能电池单元6连接的电极3a，3b。

公开(公告)号：US08960869B2

公开(公告)日：2015-02-24

申请号：US13574562

申请日：2011-02-16

申请人： Hitoshi Takada ,  Yasuo Kotaki ,  Koichi Kubo ,  Hiroki Hayashi ,  Tatsuo Nanjo ,  Takeho Miyashita

发明人： Hitoshi Takada ,  Yasuo Kotaki ,  Koichi Kubo ,  Hiroki Hayashi ,  Tatsuo Nanjo ,  Takeho Miyashita

IPC分类号： B41J2/175

CPC分类号： B41J2/1752 ,  B41J2/17513 ,  B41J2/17523 ,  Y10T137/598

摘要： The invention is to prevent positional deviation of a sealing valve, improve bubble releasability during atmosphere introduction, and stably supply ink to a recording head. The configuration is provided with an opening 270 on an upper portion of a cylindrical regulating body 165 of a joint base 140 in a state where an ink tank 100 is mounted on a connection unit 10 of a printer.

摘要翻译： 本发明是为了防止密封阀的位置偏离，提高气氛导入时的气泡释放性，稳定地向记录头供给油墨。 该配置在墨盒100安装在打印机的连接单元10上的状态下，在接头基座140的圆柱形调节主体165的上部设置开口270。

公开(公告)号：US20140144481A1

公开(公告)日：2014-05-29

申请号：US13879322

申请日：2011-09-30

申请人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Aya Momozaki

发明人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Aya Momozaki

IPC分类号： H01L31/05

CPC分类号： H01L31/0516 ,  H01L31/0512 ,  Y02E10/50

摘要： Provided is a solar cell module in which a plurality of solar cells and a wiring member for electrically connecting the solar cells are connected via connecting portions and, wherein a plurality of finger electrodes are formed on a light receiving surface of a photoelectric conversion body of the solar cell, the wiring member is arranged so as to intersect with the plurality of finger electrodes, and the connecting portion on a light receiving surface side comprises a metal portion which is formed by allowing conductive particles containing a metal having a melting temperature of 200° C. or less to melt and aggregate in a resin and connects the individual finger electrodes and the wiring member; and a resin portion which is composed of the resin and surrounds the metal portion to bond the photoelectric conversion body and the wiring member.

摘要翻译： 提供了一种太阳能电池模块，其中多个太阳能电池和用于电连接太阳能电池的布线构件经由连接部分连接，并且其中多个指状电极形成在光电转换体的光接收表面上 太阳能电池，布线部件被布置成与多个指状电极相交，并且光接收表面侧上的连接部分包括通过使含有熔融温度为200°的金属的导电粒子形成的金属部分 C以下熔融并聚集在树脂中并连接各个指状电极和布线构件; 以及树脂部分，其由树脂构成并且围绕金属部分以结合光电转换体和布线构件。