公开(公告)号：US20120227786A1

公开(公告)日：2012-09-13

申请号：US13501981

申请日：2010-10-14

申请人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Michiko Natori ,  Aya Momozaki

发明人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Michiko Natori ,  Aya Momozaki

IPC分类号： H01L31/05 ,  H01B1/22 ,  H01L31/0224

CPC分类号： H01B1/22 ,  C09J9/02 ,  H01L31/022425 ,  H01L31/048 ,  H01L31/0512 ,  Y02E10/50

摘要： A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.

摘要翻译： 提供了包含导电颗粒的导电粘合剂，包括金属，热固性树脂，助熔剂，优选流变控制剂。 导电性粒子的熔点优选为220℃以下。 导电性粘合剂用于将配线构件4a，4b电连接并粘接到与太阳能电池单元6连接的电极3a，3b。

公开(公告)号：US09837572B2

公开(公告)日：2017-12-05

申请号：US13981540

申请日：2012-01-11

申请人： Aya Momozaki ,  Shigeki Katogi ,  Hiroki Hayashi ,  Michiko Natori ,  Shinichirou Sukata

发明人： Aya Momozaki ,  Shigeki Katogi ,  Hiroki Hayashi ,  Michiko Natori ,  Shinichirou Sukata

IPC分类号： H01L31/18 ,  H01L31/0224 ,  B32B17/10 ,  H01B1/22 ,  H01L31/048 ,  H01L31/05 ,  H01B1/02 ,  H01L23/00

CPC分类号： H01L31/18 ,  B32B17/10018 ,  B32B17/10091 ,  B32B17/10788 ,  B32B17/10807 ,  H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H01L24/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/30 ,  H01L31/022425 ,  H01L31/048 ,  H01L31/0512 ,  Y02E10/50

摘要： Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

公开(公告)号：US20130340813A1

公开(公告)日：2013-12-26

申请号：US13981540

申请日：2012-01-11

申请人： Aya Momozaki ,  Shigeki Katogi ,  Hiroki Hayashi ,  Michiko Natori ,  Shinichirou Sukata

发明人： Aya Momozaki ,  Shigeki Katogi ,  Hiroki Hayashi ,  Michiko Natori ,  Shinichirou Sukata

IPC分类号： H01L31/18 ,  H01L31/02

CPC分类号： H01L31/18 ,  B32B17/10018 ,  B32B17/10091 ,  B32B17/10788 ,  B32B17/10807 ,  H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H01L24/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/30 ,  H01L31/022425 ,  H01L31/048 ,  H01L31/0512 ,  Y02E10/50

摘要： Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

摘要翻译： 本发明提供一种太阳能电池模块的制造方法，其特征在于，包括：涂布导电性粘合剂组合物的工序（A），其包含具有金属的导电性粒子等; 布置配线构件以使介于其间的所施加的导电粘合剂组合物与太阳能电池单元的电极相对的步骤（B）; 利用在步骤（B）中获得的布线构件加热太阳能电池单元的步骤（C）; 以及将步骤（C）中获得的布线构件将密封树脂层压到太阳能电池单元的两个表面上的步骤（D），将保护玻璃层压到太阳能电池单元的光接收表面上，并将保护膜层压到 并且进行加热，其中导电粒子中的金属的熔点低于步骤（C）中的加热温度。

公开(公告)号：US08962986B2

公开(公告)日：2015-02-24

申请号：US13501981

申请日：2010-10-14

申请人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Michiko Natori ,  Aya Momozaki

发明人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Michiko Natori ,  Aya Momozaki

IPC分类号： H01L31/00 ,  H01B1/22 ,  C09J9/02 ,  H01L31/0224 ,  H01L31/048 ,  H01L31/05

CPC分类号： H01B1/22 ,  C09J9/02 ,  H01L31/022425 ,  H01L31/048 ,  H01L31/0512 ,  Y02E10/50

摘要： A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.

摘要翻译： 提供了包含导电颗粒的导电粘合剂，包括金属，热固性树脂，助熔剂，优选流变控制剂。 导电性粒子的熔点优选为220℃以下。 导电性粘合剂用于将配线构件4a，4b电连接并粘接到与太阳能电池单元6连接的电极3a，3b。

公开(公告)号：US20140144481A1

公开(公告)日：2014-05-29

申请号：US13879322

申请日：2011-09-30

申请人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Aya Momozaki

发明人： Hiroki Hayashi ,  Shigeki Katogi ,  Shinichirou Sukata ,  Aya Momozaki

IPC分类号： H01L31/05

CPC分类号： H01L31/0516 ,  H01L31/0512 ,  Y02E10/50

摘要： Provided is a solar cell module in which a plurality of solar cells and a wiring member for electrically connecting the solar cells are connected via connecting portions and, wherein a plurality of finger electrodes are formed on a light receiving surface of a photoelectric conversion body of the solar cell, the wiring member is arranged so as to intersect with the plurality of finger electrodes, and the connecting portion on a light receiving surface side comprises a metal portion which is formed by allowing conductive particles containing a metal having a melting temperature of 200° C. or less to melt and aggregate in a resin and connects the individual finger electrodes and the wiring member; and a resin portion which is composed of the resin and surrounds the metal portion to bond the photoelectric conversion body and the wiring member.

摘要翻译： 提供了一种太阳能电池模块，其中多个太阳能电池和用于电连接太阳能电池的布线构件经由连接部分连接，并且其中多个指状电极形成在光电转换体的光接收表面上 太阳能电池，布线部件被布置成与多个指状电极相交，并且光接收表面侧上的连接部分包括通过使含有熔融温度为200°的金属的导电粒子形成的金属部分 C以下熔融并聚集在树脂中并连接各个指状电极和布线构件; 以及树脂部分，其由树脂构成并且围绕金属部分以结合光电转换体和布线构件。

公开(公告)号：US08518303B2

公开(公告)日：2013-08-27

申请号：US11908897

申请日：2006-03-15

申请人： Shigeki Katogi ,  Hiroyuki Izawa ,  Houko Sutou ,  Masami Yusa ,  Tohru Fujinawa

发明人： Shigeki Katogi ,  Hiroyuki Izawa ,  Houko Sutou ,  Masami Yusa ,  Tohru Fujinawa

IPC分类号： H01B1/00 ,  H01L23/48 ,  H05K1/11 ,  C08F8/00

CPC分类号： C08G18/672 ,  C08G18/3212 ,  C08G18/44 ,  C08G18/73 ,  C08L75/16 ,  C08L2666/20 ,  C09J133/066 ,  C09J133/14 ,  C09J175/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K3/323 ,  H05K2201/0129 ,  C08G18/664 ,  C08G18/6674 ,  C08G18/6607 ,  C08G18/48 ,  H01L2924/00

摘要： The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

摘要翻译： 本发明的粘合剂组合物包括自由基发生剂，热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯（甲基）丙烯酸酯，重均分子量为3000-3000。

公开(公告)号：US20120263946A1

公开(公告)日：2012-10-18

申请号：US13509362

申请日：2010-11-10

申请人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

发明人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

IPC分类号： B32B7/12 ,  C09J7/02 ,  H01L21/50

CPC分类号： H01L24/27 ,  C08F220/30 ,  H01L21/565 ,  H01L21/67132 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/27002 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2224/93 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/2809 ,  Y10T428/31935 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.

摘要翻译： 本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

公开(公告)号：US08138268B2

公开(公告)日：2012-03-20

申请号：US11629068

申请日：2005-06-08

申请人： Shigeki Katogi ,  Houko Sutou ,  Hiroyuki Izawa ,  Toshiaki Shirasaka ,  Masami Yusa ,  Takanobu Kobayashi

发明人： Shigeki Katogi ,  Houko Sutou ,  Hiroyuki Izawa ,  Toshiaki Shirasaka ,  Masami Yusa ,  Takanobu Kobayashi

IPC分类号： C08F8/00

CPC分类号： H05K3/323 ,  C09J4/06 ,  H01B1/22 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H05K2201/0129 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

公开(公告)号：US20110121435A1

公开(公告)日：2011-05-26

申请号：US12863068

申请日：2009-01-09

申请人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

发明人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

IPC分类号： H01L25/00 ,  C08J3/28 ,  B32B3/30 ,  H01L21/50

CPC分类号： C09J179/08 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/106 ,  C08K5/0025 ,  C08K5/3417 ,  C08L79/08 ,  C08L2312/06 ,  C09J7/20 ,  C09J163/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.

摘要翻译： 一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％ 组合物中的整个光引发剂混合物为200℃或更高。

公开(公告)号：US20090309220A1

公开(公告)日：2009-12-17

申请号：US11908897

申请日：2006-03-15

申请人： Shigeki Katogi ,  Hiroyuki Izawa ,  Houko Sutou ,  Masami Yusa ,  Tohru Fujinawa

发明人： Shigeki Katogi ,  Hiroyuki Izawa ,  Houko Sutou ,  Masami Yusa ,  Tohru Fujinawa

IPC分类号： H01L23/52 ,  C08L75/04 ,  H01B1/12 ,  H05K1/11

CPC分类号： C08G18/672 ,  C08G18/3212 ,  C08G18/44 ,  C08G18/73 ,  C08L75/16 ,  C08L2666/20 ,  C09J133/066 ,  C09J133/14 ,  C09J175/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K3/323 ,  H05K2201/0129 ,  C08G18/664 ,  C08G18/6674 ,  C08G18/6607 ,  C08G18/48 ,  H01L2924/00

摘要： The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

摘要翻译： 本发明的粘合剂组合物包括自由基发生剂，热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯（甲基）丙烯酸酯，重均分子量为3000-3000。