公开(公告)号：US4707425A

公开(公告)日：1987-11-17

申请号：US879827

申请日：1986-06-26

申请人： Katsuyoshi Sasagawa ,  Kunio Nishihara ,  Hiroshi Ozawa ,  Masao Imai

发明人： Katsuyoshi Sasagawa ,  Kunio Nishihara ,  Hiroshi Ozawa ,  Masao Imai

IPC分类号： G03C5/16 ,  G11B7/246

CPC分类号： G03C5/16 ,  G03C5/164 ,  G11B7/246 ,  G11B7/2492 ,  G11B7/252 ,  G11B7/2585 ,  Y10S430/146 ,  Y10S430/167 ,  Y10S430/168

摘要： An optical recording method which comprises providing a recording layer containing a recording susbstance that has an absorption maximum in the visible and near infrared wavelength region of 600 to 1,200 nm and loses or diminishes its power to absorb visible or near infrared radiation in the aforesaid wavelength region upon exposure to ultraviolet radiation, X-rays, an electron beam or an ion beam, and irradiating desired locations of the recording layer with ultraviolet radiation, X-rays, an electron beam or ion beam to form a pattern based on the presence or absence, or variation in strength, of the power to absorb visible or near infrared radiation in the aforesaid wavelength region so as to record information in the recording layer; a method for reading optically recorded information which comprises illuminating a pattern formed as described above with laser light having a wavelength in the aforesaid visible and near infrared region and detecting the presence or absence, or variation in intensity, of absorption of the laser light to read the recorded information; and optical recording media for use in the above-described optical recording method.

摘要翻译： 一种光记录方法，包括提供包含在600至1,200nm的可见光和近红外波长区域中具有最大吸收的记录载体的记录层，并且损失或减少其功率以吸收前述波长区域中的可见光或近红外辐射 在暴露于紫外线，X射线，电子束或离子束的同时，用紫外线，X射线，电子束或离子束照射记录层的所需位置，以形成基于有无的 或强度的变化，以吸收上述波长区域中的可见光或近红外辐射，以便将信息记录在记录层中; 用于读取光学记录信息的方法，其包括用上述可见光和近红外区域中的波长的激光照射如上所述形成的图案，并且检测激光的吸收的存在或不存在或变化，以便读取 记录的信息; 以及用于上述光学记录方法的光学记录介质。

公开(公告)号：US4839232A

公开(公告)日：1989-06-13

申请号：US69449

申请日：1987-06-25

申请人： Moritsugu Morita ,  Kazuo Miyazaki ,  Akihiro Yamaguchi ,  Masahiro Ohta ,  Shoji Tamai ,  Kunio Nishihara

发明人： Moritsugu Morita ,  Kazuo Miyazaki ,  Akihiro Yamaguchi ,  Masahiro Ohta ,  Shoji Tamai ,  Kunio Nishihara

IPC分类号： B32B15/00 ,  B32B15/08 ,  C08G69/26 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

CPC分类号： C08G73/1064 ,  C08G69/265 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  H01B3/306 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A polyimide film formed by using a symmetrical aromatic meta-substituted primary diamine and a symmetrical aromatic para-substituted primary diamine as raw materials in a specific proportion has excellent heat resistance, electrical properties, flexibility and the like. Such a polyimide film can be bonded to a metal foil not by using any adhesive, but by coating the metal foil with a polyamic acid constituting a precursor of the polyimide and further reacting the polyamic acid to convert it to the polyimide. In this manner, there can be obtained a flexible laminate for printed-circuit board comprising a polyimide film bonded to a metal foil with good adhesion and exhibiting excellent properties as described above.

公开(公告)号：US5639990A

公开(公告)日：1997-06-17

申请号：US185897

申请日：1994-01-26

申请人： Kunio Nishihara ,  Youichi Hosono ,  Kunihiro Nagamine ,  Takashi Kayama ,  Takayuki Ishikawa

发明人： Kunio Nishihara ,  Youichi Hosono ,  Kunihiro Nagamine ,  Takashi Kayama ,  Takayuki Ishikawa

IPC分类号： H01L23/043 ,  H01L23/10 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/492 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/00 ,  H05K1/05 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/36 ,  H05K3/46 ,  H01L23/28 ,  H01L21/56 ,  H01R9/00

CPC分类号： H05K1/147 ,  H01L23/043 ,  H01L23/10 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/49861 ,  H01L25/0655 ,  H01L25/16 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/141 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/117 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/10477 ,  H05K2203/063 ,  H05K2203/1316 ,  H05K2203/302 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/363 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49169 ,  Y10T29/49172

摘要： The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic polyimide sheet between each copper foil. The metal base substrate with a circuit pattern prepared on each copper foil layer is processed by bending or deep drawing into a box-shaped work which has an opening surface. The opening surface is processed so as to have a substantially equal area with that of the bottom of the substrate and have a collar portion on the periphery thereof. On the collar portion, leads to be used for connection with other wiring substrate are formed by patterning on copper foil layers. Mounting the solid printed substrate on other wiring substrate with the opening surface downwardly oriented, the leads and corresponding circuit patterns of the other wiring substrate are then soldered to finish the mounting of the solid printed substrate on the other wiring substrate. Therefore, by mounting electronic parts on the bottom of the solid printed substrate, an electronic circuit package can be constructed.

摘要翻译： PCT No.PCT / JP93 / 00756 Sec。 371日期1994年1月26日 102（e）日期1994年1月26日PCT Filed 1993年6月4日PCT公布。 第WO93 / 26142号公报 日期：1993年12月23日本发明涉及用于安装电子部件的固体印刷基板及其制造方法。 使用层叠有多个铜箔层的金属基底基板，在每个铜箔之间放置热塑性聚酰亚胺片。 在每个铜箔层上制备的具有电路图案的金属基底板通过弯曲或深拉加工成具有开口表面的盒形工件。 处理开口表面以与基板的底部基本上相等的面积，并且在其周边上具有凸缘部分。 在铜箔层上通过图案化形成在与其他布线基板的连接用的引线部上。 将固体印刷基板安装在具有向下取向的开口表面的其它布线基板上，然后焊接另一布线基板的引线和相应的电路图案，以完成将固体印刷基板安装在另一布线基板上。 因此，通过将电子部件安装在固体印刷基板的底部，可以构成电子电路封装。

公开(公告)号：US5266746A

公开(公告)日：1993-11-30

申请号：US798958

申请日：1991-11-27

申请人： Kunio Nishihara ,  Yoichi Hosono ,  Takayuki Ishikawa

发明人： Kunio Nishihara ,  Yoichi Hosono ,  Takayuki Ishikawa

IPC分类号： H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K1/00

CPC分类号： H05K1/189 ,  H05K1/118 ,  H05K3/0061 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/053 ,  H05K2201/09109 ,  H05K2201/2009 ,  H05K3/4611 ,  H05K3/4691

摘要： A flexible circuit board including a flexible substrate having an insulating polyimide sheet and a wiring pattern portion formed in a mounting portion and a wiring pattern portion formed in a connecting portion, and a metal substrate on which only the mounting portion of the flexible substrate is secured by means of a thermoplastic polyimide film. Electronic devices are mounted on the mounting portion of the flexible substrate and heat generated by the electric devices can be effectively dissipated through the metal substrate. The connecting portion of the flexible substrate can be connected to an external circuit by means of a connector provided at an edge of the connecting portion. Since the connecting portion is not secured to the metal substrate, connector pins having a large mechanical strength can be used and the connecting portion can be bent at will.

公开(公告)号：US5173162A

公开(公告)日：1992-12-22

申请号：US637554

申请日：1991-01-04

申请人： Atsushi Hagimura ,  Mutsuo Nakajima ,  Kunio Nishihara ,  Ikuo Inage

发明人： Atsushi Hagimura ,  Mutsuo Nakajima ,  Kunio Nishihara ,  Ikuo Inage

IPC分类号： H01L41/083 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03

CPC分类号： H01L41/0472 ,  H01L41/293 ,  H05K1/0254 ,  H05K1/0298 ,  H05K1/0306 ,  Y10T428/265 ,  Y10T428/31681

摘要： A multi-layered electrostrictive effect element comprises films or thin plates of an electrostrictive material and inner electrodes alternatively arranged in layers, the inner electrodes being formed on the entire surface of the films or thin plates of the electrostrictive material, wherein the insulating layer which insulates the inner electrodes exposed on the side end faces of the element comprises a polyimide resin having repeating units represented by the following general formula (I): ##STR1## (wherein X represents a tetravalent group selected from the group consisting of tetravalent phenyl groups; tetravalent biphenyl groups; and tetravalent polyphenyl groups in which at least one of either the phenyl or bipheny groups are bonded through at least one member selected from the group consisting of O, CO, S, CH.sub.2, C(CH.sub.3).sub.2 and C(CF.sub.3).sub.2 and Y represents a bivalent groups selected from the group consisting of bivalent phenyl groups; bivalent biphenyl groups; bivalent polyphenyl groups in which at least one of either the phenyl or biphenyl groups are bonded through at least one member selected from the group consisting of O, CO, S, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 and C(CF.sub.3).sub.2 ; alkylene groups; and xylylene groups) and an insulating filler. A process for making a multi-layered electrorestrictive effect element having a high dielectric strength is also disclosed.

摘要翻译： 多层电致伸缩效应元件包括电致伸缩材料的薄膜或薄板和交替布置成层的内电极，内电极形成在电致伸缩材料的薄膜或薄板的整个表面上，其中绝缘层 在元件的侧端面上露出的内电极包括具有由以下通式（I）表示的重复单元的聚酰亚胺树脂：其中X表示选自四价苯基的四价基团 基团;四价联苯基;和四价聚苯基，其中苯基或联苯基中的至少一个通过选自O，CO，S，CH 2，C（CH 3）2和C （CF 3）2，Y表示选自二价苯基，二价联苯基，二价聚苯基 其中苯基或联苯基中的至少一个通过选自O，CO，S，SO 2，CH 2，C（CH 3）2和C（CF 3）2中的至少一个成员键合; 亚烷基; 和亚二甲苯基）和绝缘填料。 还公开了一种制造具有高介电强度的多层电致紧致效应元件的方法。