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公开(公告)号：US06887560B2
公开(公告)日：2005-05-03
申请号：US10363165
申请日：2002-07-03
CPC分类号： H05K3/4658 , H05K1/0393 , H05K3/20 , H05K3/281 , H05K3/4038 , H05K3/4602 , H05K3/4617 , H05K3/4635 , H05K3/4652 , H05K2201/0305 , H05K2201/09536 , H05K2203/0425 , Y10S428/901 , Y10T428/24917
摘要： A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.
摘要翻译： 一种可提供高密度布线并且还可以提供厚度和尺寸的减小的多层柔性布线电路板及其制造方法。 通过制备在第一绝缘层的两侧上层叠有第一导体层和第二导体层的双面基板来制造四层柔性布线电路板; 制备其中在第二绝缘层的一个表面上层叠第三导体层的第一单面基板和在第三绝缘层的一个表面上层叠第四导体层的第二单面基板; 通过第一热固性粘合剂层将第一导体层和第三导体层彼此接合; 以及通过第二热固性粘合剂层将所述第二导体层和所述第四导体层彼此接合。
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公开(公告)号：US06902949B2
公开(公告)日：2005-06-07
申请号：US10109680
申请日：2002-04-01
CPC分类号： H05K3/4691 , H01L21/4857 , H01L23/49822 , H01L23/49894 , H01L2924/0002 , H01L2924/15153 , H01L2924/1517 , H05K3/002 , H05K3/281 , H05K3/386 , H05K3/4652 , H05K2201/0195 , H05K2201/0358 , H01L2924/00
摘要： First and second metal foil layers are laminated on opposite surfaces of a first insulating layer to form a first board. Then, the first and second metal foil layers are formed into predetermined conductor patterns respectively. Then, second and third insulating layers of second and third boards formed separately from the first board are laminated on the first and second metal foil layers through first and second adhesive layers respectively. Then, a thin layer portion is removed and thick layer portions are formed into predetermined conductor patterns respectively in third and fourth metal foil layers of the second and third boards.
摘要翻译： 第一和第二金属箔层层叠在第一绝缘层的相对表面上以形成第一板。 然后，第一和第二金属箔层分别形成预定的导体图案。 然后，分别与第一基板形成的第二和第三板的第二绝缘层和第三绝缘层分别通过第一和第二粘合剂层层压在第一和第二金属箔层上。 然后，去除薄层部分，并且将厚层部分分别形成为第二和第三板的第三和第四金属箔层中的预定导体图案。
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公开(公告)号：US20050079652A1
公开(公告)日：2005-04-14
申请号：US10959108
申请日：2004-10-07
申请人： Mineyoshi Hasegawa , Kei Nakamura , Toshikazu Baba
发明人： Mineyoshi Hasegawa , Kei Nakamura , Toshikazu Baba
CPC分类号： H05K3/0038 , H05K1/0393 , H05K3/386 , H05K3/427 , H05K3/429 , H05K3/4626 , H05K3/4635 , H05K3/4652 , H05K3/4655 , H05K2201/0195
摘要： A method of producing a multilayer wired circuit board that can suppress making gouge in an adhesive layer when a hole is formed by irradiation with a laser beam, to provide a smoothened inside surface of the hole so as to provide enhanced reliability of electrical connection. A first substrate 4 having the structure wherein a first metal foil 2 and a second metal foil 3 are formed on both sides of a first insulating layer 1 and a second substrate 7 having the structure wherein a third metal foil 6 is formed on a single side of a second insulating layer 5 are prepared, separately. Then, the first metal foil 2 of the first substrate 4 and the second insulating layer 5 of the second substrate 7 are bonded together through an adhesive layer 8. Thereafter, the resultant laminate is irradiated with a laser beam emitting from the first substrate 4 side toward the second substrate 7 side, to form a through hole 9. When the through hole 9 is formed, the adhesive layer 8 is irradiated with the laser beam decayed in energy after applied to the second metal foil 3 and the first metal foil 2. Hence, the adhesive layer can be prevented from being gouged by thermal decomposition, and as such can permit a smoothened inside surface of the through hole 9.
摘要翻译： 一种制造多层布线电路板的方法，该多层布线电路板可以通过用激光束照射形成孔而能够抑制在粘合剂层中产生气泡，从而提供孔的光滑的内表面，从而提高电连接的可靠性。 具有这样的结构的第一基板4，其中在第一绝缘层1和第二基板7的两侧形成有第一金属箔2和第二金属箔3，第二基板7具有在第一金属箔6的单侧上形成第三金属箔6 分别制备第二绝缘层5。 然后，第一基板4的第一金属箔2和第二基板7的第二绝缘层5通过粘合层8接合在一起。然后，用从第一基板4侧发射的激光束照射所得到的层压体 朝向第二基板7侧形成通孔9.当形成通孔9时，在施加到第二金属箔3和第一金属箔2上之后，用能量衰减的激光束照射粘合剂层8。 因此，可以防止粘合剂层因热分解而被破坏，因此能够使通孔9的内表面平滑化。
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公开(公告)号：US08822834B2
公开(公告)日：2014-09-02
申请号：US13187830
申请日：2011-07-21
IPC分类号： H05K1/00
CPC分类号： H05K3/108 , H05K1/0274 , H05K1/0393 , H05K3/28 , H05K2201/0116 , H05K2201/2054
摘要： A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.
摘要翻译： 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50％的反射率。
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公开(公告)号：US20060016072A1
公开(公告)日：2006-01-26
申请号：US11122369
申请日：2005-05-05
IPC分类号： H05K3/36
CPC分类号： H05K3/427 , H05K1/116 , H05K3/421 , H05K2201/09736 , H05K2203/0353 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.
摘要翻译： 制备在其两侧具有金属箔的绝缘基板，并且形成穿过金属箔和绝缘基板的通孔。 在通孔的内表面和每个金属箔的表面上形成化学镀铜层，然后在无电镀铜层的整个表面上形成电解铜电镀层。 除去除了通孔的内表面和周边区域之外的电解铜电镀层，处理金属箔以形成导体图案。
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公开(公告)号：US09288903B2
公开(公告)日：2016-03-15
申请号：US13094941
申请日：2011-04-27
CPC分类号： H05K1/034 , H01B3/445 , H05K1/0393 , H05K3/06 , H05K3/108 , H05K3/28 , H05K2201/0116 , H05K2201/015
摘要： A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.
摘要翻译： 在由多孔ePTFE制成的多孔基底绝缘层上形成多个导体迹线。 每个导体迹线具有种子层和导体层的层叠结构。 覆盖绝缘层形成在基底绝缘层上以覆盖每个导体迹线。 用作多孔基底绝缘层的ePTFE具有连续的孔。 ePTFE的平均孔径不小于0.05μm且不大于1.0μm。
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公开(公告)号：US08438726B2
公开(公告)日：2013-05-14
申请号：US13083097
申请日：2011-04-08
IPC分类号： H05K3/02
CPC分类号： H05K3/20 , H05K1/0393 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155
摘要： A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
摘要翻译： 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来，将抗蚀剂膜曝光和显影，从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后，在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影，使得在导体图案上形成粘合剂图案。 之后，将基底绝缘层接合到导体图案上，其中夹有粘合剂图案。 最后，将载体层与导体图案分离，从而制造FPC基板。
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公开(公告)号：US07281327B2
公开(公告)日：2007-10-16
申请号：US11122369
申请日：2005-05-05
IPC分类号： H01K3/10
CPC分类号： H05K3/427 , H05K1/116 , H05K3/421 , H05K2201/09736 , H05K2203/0353 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.
摘要翻译： 制备在其两侧具有金属箔的绝缘基板，并且形成穿过金属箔和绝缘基板的通孔。 在通孔的内表面和每个金属箔的表面上形成化学镀铜层，然后在无电镀铜层的整个表面上形成电解铜电镀层。 除去除了通孔的内表面和周边区域之外的电解铜电镀层，处理金属箔以形成导体图案。
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