公开(公告)号：US06252301B1

公开(公告)日：2001-06-26

申请号：US09450252

申请日：1999-11-29

申请人： Kenneth B. Gilleo ,  Gary W. Grube ,  Gaetan Mathieu

发明人： Kenneth B. Gilleo ,  Gary W. Grube ,  Gaetan Mathieu

IPC分类号： H01L2352

CPC分类号： H01L24/83 ,  H01L23/3114 ,  H01L23/4985 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05644 ,  H01L2224/05124

摘要： A semiconductor chip package assembly is mounted to contact pads on a die. A compliant interposer layer is disposed between the die and a dielectric substrate wiring layer. The contacts on the die are connected to terminals on the compliant interposer layer by means of a compliant, conductive polymer extending through apertures in the interposer layer. Compliancy in the interposer layer and in the conductive polymer permits relative movement of the terminals on the dielectric substrate wiring layer to the contacts on the die and hence relieves the shear forces caused by differential thermal expansion. The arrangement provides a compact packaged structure similar to that achieved through flip-ship bonding, but with markedly increased resistance to thermal cycling damage. Further, the packaged structure allows the standardization of the packages such that several companies can make competing chips that are packaged such that the resultant packaged structures are roughly the same as far as the end user is concerned.

摘要翻译： 将半导体芯片封装组件安装到管芯上的接触焊盘。 在芯片和电介质基板布线层之间设置顺应性插入层。 芯片上的触点通过延伸穿过插入层中的孔的柔性导电聚合物连接到顺应性插入层上的端子。 插入层和导电聚合物中的兼容性允许电介质基板布线层上的端子相对于模具上的触点的相对运动，并且因此减轻由不同的热膨胀引起的剪切力。 该装置提供了类似于通过翻转接合实现的紧凑的封装结构，但是具有显着提高的耐热循环损伤性。 此外，封装结构允许包装的标准化，使得几个公司可以制造被包装的竞争芯片，使得最终的封装结构在最终用户方面大致相同。

公开(公告)号：US6020220A

公开(公告)日：2000-02-01

申请号：US709470

申请日：1996-09-05

申请人： Kenneth B. Gilleo ,  Gary W. Grube ,  Gaetan Mathieu

发明人： Kenneth B. Gilleo ,  Gary W. Grube ,  Gaetan Mathieu

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L24/83 ,  H01L23/3114 ,  H01L23/4985 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/351

摘要： A semiconductor chip package assembly is mounted to contact pads on a die. A compliant interposer layer is disposed between the die and a dielectric substrate wiring layer. The contacts on the die are connected to terminals on the compliant interposer layer by means of a compliant, conductive polymer extending through apertures in the interposer layer. Compliancy in the interposer layer and in the conductive polymer permits relative movement of the terminals on the dielectric substrate wiring layer to the contacts on the die and hence relieves the shear forces caused by differential thermal expansion. The arrangement provides a compact packaged structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage. Further, the packaged structure allows the standardization of the packages such that several companies can make competing chips that are packaged such that the resultant packaged structures are roughly the same as far as the end user is concerned.

摘要翻译： 将半导体芯片封装组件安装到管芯上的接触焊盘。 在芯片和电介质基板布线层之间设置顺应性插入层。 芯片上的触点通过延伸穿过插入层中的孔的柔性导电聚合物连接到顺应性插入层上的端子。 插入层和导电聚合物中的兼容性允许电介质基板布线层上的端子相对于模具上的触点的相对运动，并且因此减轻由不同的热膨胀引起的剪切力。 该装置提供了类似于通过倒装芯片接合实现的紧凑封装结构，但是具有显着提高的耐热循环损伤性。 此外，封装结构允许包装的标准化，使得几个公司可以制造被包装的竞争芯片，使得最终的封装结构在最终用户方面大致相同。

公开(公告)号：US06888229B2

公开(公告)日：2005-05-03

申请号：US10872105

申请日：2004-06-18

申请人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

发明人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  H01L2924/00

摘要： A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure. A semiconductor chip is disposed beneath the bottom surface of the support structure. The leads are adapted to be bonded to contacts on the semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leads from the bus and engage the leads with the contacts of the semiconductor chip.

摘要翻译： 半导体芯片安装部件包括适于接合半导体芯片的支撑结构。 支撑结构具有顶表面，底表面和延伸穿过支撑结构的间隙，用于限定支撑结构在间隙的相对侧上的第一和第二部分。 支撑结构包括在支撑结构的第二部分上沿着间隙布置的至少一个细长总线。 支撑结构包括多个导电引线，每个引线具有跨越间隙延伸的连接部分，连接部分具有设置在支撑结构的第一部分上的第一端和固定到总线的第二端。 每个引线包括设置在连接部分的第一和第二端之间的易碎部分，该易碎部分的横截面积小于连接部分的横截面面积。 间隙在支撑结构的底部表面开口。 半导体芯片设置在支撑结构的底表面下方。 引线适于通过断开引线的易碎部分而与半导体芯片上的触点接合，从而将引线的第二端与母线断开，并与半导体芯片的触点接合引线。

公开(公告)号：US5915752A

公开(公告)日：1999-06-29

申请号：US374559

申请日：1995-05-08

申请人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

发明人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40 ,  H01R43/00

CPC分类号： H01L23/49572 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/01 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool which has features adapted to control the position of the lead.

摘要翻译： PCT No.PCT / US93 / 06930 Sec。 371日期1995年5月8日 102（e）日期1995年5月8日PCT提交1993年7月23日PCT公布。 出版物WO94 / 03036 日期1994年2月3日用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙（40）的优选电介质支撑结构（70）。 引线延伸穿过这些间隙，使得引线被支撑在间隙（66,70）的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括与间隙的一侧相邻的易碎部分（72），并且当引线与触点接合时，易碎部分断裂。 引线与芯片上的触点的最终对准由具有适于控制引线位置的特征的焊接工具提供。

公开(公告)号：US6054756A

公开(公告)日：2000-04-25

申请号：US268289

申请日：1999-03-15

申请人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

发明人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/36 ,  H05K3/40 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/86 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084

摘要： A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap connecting one end of the lead connection section to a bus extending alongside the gap. The frangible section is broken when the lead is engaged with the contact.

摘要翻译： 用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。 引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括邻近连接引线连接部分的一端与沿着间隙延伸的总线的间隙的一侧相邻的易碎部分。 当领导与联系人接触时，易碎部分断裂。

公开(公告)号：US5398863A

公开(公告)日：1995-03-21

申请号：US96693

申请日：1993-07-23

申请人： Gary W. Grube ,  Gaetan Mathieu ,  Jason Sweis ,  John A. Grange

发明人： Gary W. Grube ,  Gaetan Mathieu ,  Jason Sweis ,  John A. Grange

IPC分类号： H01L23/12 ,  B23K20/10 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/50 ,  B23K20/10 ,  B23K2201/40 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082

摘要： In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool horizontally towards the proximal or first end of the lead, thereby forcing the bonding region towards the first end and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end of the lead and again advanced downwardly to secure the lead to the chip contact.

摘要翻译： 在半导体内引线接合工艺中，具有引线的连接部件设置在芯片表面上，使得引线位于触点上方。 每个引线的接合区域被工具向下压迫与芯片上的接触件接合，而引线的第一或近端保持附接到电介质支撑结构。 通过将接合工具水平地朝向引线的近端或第一端移动，从而将引线变形为S形构造，从而迫使接合区朝向第一端并弯曲或弯曲引线。 或者，引线通过工具向下弯曲，然后工具可以从引线脱离，从引线的近端移开，并再次向前推进以将引线固定到芯片接触。

公开(公告)号：US20200296540A1

公开(公告)日：2020-09-17

申请号：US16892701

申请日：2020-06-04

申请人： Gary W. Grube ,  Evan Edward Quisenberry ,  John Edward Buchalo

发明人： Gary W. Grube ,  Evan Edward Quisenberry ,  John Edward Buchalo

IPC分类号： H04W4/021 ,  H04W8/22 ,  H04W4/90 ,  H04L12/18 ,  H04L12/58 ,  H04M1/725 ,  H04W4/02 ,  H04W8/18

摘要： A method includes identifying a first user device potentially associated with a biohazard and identifying a geographic area associated with the biohazard based on previous location information of the first user device. The method further includes identifying a second user device potentially associated with the biohazard based on the geographic area associated with the biohazard and previous location information of the second user device. The method further includes issuing a safety notification to the second user device, where the safety notification includes one or more of the geographic area associated with the biohazard, a safety status request, a safety status level of the first user device, a subset of the previous location information of the first user device, and a subset of the previous location information of the second user device.

公开(公告)号：US10652722B2

公开(公告)日：2020-05-12

申请号：US16388978

申请日：2019-04-19

申请人： Gary W. Grube

发明人： Gary W. Grube

IPC分类号： H04W4/90 ,  H04W4/029 ,  H04W4/14 ,  G06Q10/06 ,  H04L29/08 ,  H04L29/06 ,  H04W4/021 ,  H04W4/12 ,  H04W4/08 ,  H04W4/02 ,  H04W4/00

摘要： A method includes establishing information regarding a potentially adverse condition associated with one or more user devices. The information includes one or more of: geographic location coordinates of the potentially adverse condition, an identifier of the potentially adverse condition, and a relevant time period of the potentially adverse condition. The method further includes determining group constraints for a group regarding the potentially adverse condition. The group constraints include one or more of: family member devices, neighbor devices, friend devices, first responders, co-workers, and devices of other persons having an affiliating commonality. The method further includes selecting user devices to produce selected user devices. The selected user devices have an affiliation with the group. The method further includes obtaining status associated with the selected user devices and issuing the status to the selected user devices.

公开(公告)号：US20180270641A1

公开(公告)日：2018-09-20

申请号：US15980975

申请日：2018-05-16

申请人： Gary W. Grube

发明人： Gary W. Grube

IPC分类号： H04W4/90 ,  H04W4/021 ,  H04L29/06 ,  H04L29/08 ,  H04W4/12 ,  H04W4/02

CPC分类号： H04W4/90 ,  G06Q10/06315 ,  H04L67/36 ,  H04L67/42 ,  H04W4/00 ,  H04W4/02 ,  H04W4/021 ,  H04W4/08 ,  H04W4/12 ,  H04W4/14

摘要： A method begins by a first user device of a plurality of user devices establishing information regarding a potentially adverse condition associated with the first user device and determining group constraints for a group regarding the potentially adverse condition. The method continues with the first user device selecting one or more other user devices of the plurality of user devices affiliated with the group to produce selected user devices. The method continues with the first user device determining a status associated with the first user device and issuing a status response message to at least some of the user devices of the plurality of user devices affiliated with the group, where the status response message includes the status associated with the first user device.

公开(公告)号：US09549304B2

公开(公告)日：2017-01-17

申请号：US14944406

申请日：2015-11-18

申请人： Gary W. Grube

发明人： Gary W. Grube

IPC分类号： G06F15/16 ,  H04W4/22 ,  G06Q10/06 ,  H04W4/02 ,  H04W4/14 ,  H04L29/08 ,  H04L29/06 ,  H04W4/12 ,  H04W4/00

CPC分类号： H04W4/90 ,  G06Q10/06315 ,  H04L67/36 ,  H04L67/42 ,  H04W4/00 ,  H04W4/02 ,  H04W4/021 ,  H04W4/08 ,  H04W4/12 ,  H04W4/14

摘要： A method begins by an application server establishing information regarding a potentially adverse event and determining group constraints for a group regarding the potentially adverse event. The method continues with the application server selecting one or more user devices of a plurality of user devices affiliated with the group to produce selected user devices. The method continues with the application server obtaining, for each selected user device, a status associated with the selected user device and issuing a status response message to at least some of the user devices of the plurality of user devices affiliated with the group, where the status response message includes the status associated with each selected user device.

摘要翻译： 一种方法由应用服务器开始建立关于潜在不利事件的信息，并且确定关于潜在不利事件的组的组约束。 该方法继续，应用服务器选择与该组相关联的多个用户设备的一个或多个用户设备以产生所选择的用户设备。 该方法继续，应用服务器针对每个所选择的用户设备获得与所选择的用户设备相关联的状态，并向附属于该组的多个用户设备中的至少一些用户设备发布状态响应消息，其中 状态响应消息包括与每个所选择的用户设备相关联的状态。