Method and apparatus for thermally actuated self testing of silicon
structures
    8.
    发明授权
    Method and apparatus for thermally actuated self testing of silicon structures 失效
    用于硅结构的热致自我测试的方法和装置

    公开(公告)号:US5355712A

    公开(公告)日:1994-10-18

    申请号:US758836

    申请日:1991-09-13

    IPC分类号: G01P21/00

    摘要: The present invention discloses a method and apparatus for testing the operational capability of flexure area equipped sensors especially those made of micromachined silicon. A thermal actuator beam is provided to bridge the structures which are joined by the flexure area. During the test, the beam's temperature is changed relative to that of the flexure area so as to provide a differential expansion or contraction. The result is that the flexure area bends and conventional bending sensors for the flexure area can sense the amount of bend. By comparing the actual amount of bend sensed with the amount expected from the temperature change applied to the beam, the operational capability can be determined.

    摘要翻译: 本发明公开了一种用于测试装有挠曲区域的传感器,特别是由微加工硅制成的传感器的操作能力的方法和装置。 提供热致动器梁以桥接由弯曲区域连接的结构。 在测试期间,光束的温度相对于弯曲部分的温度改变,以便提供差别的膨胀或收缩。 结果是弯曲区域弯曲,弯曲区域的常规弯曲传感器可以感测弯曲量。 通过将感测到的实际弯曲量与应用于梁的温度变化的预期量进行比较,可以确定操作能力。