-
1.发明授权Integration of pressure or inertial sensors into integrated circuit fabrication and packaging 有权将压力或惯性传感器集成到集成电路制造和封装中公开(公告)号：US09260294B2
公开(公告)日：2016-02-16
申请号：US14141875
申请日：2013-12-27
Applicant: Kyu Oh Lee , Sasha N. Oster , Feras Eid , Sarah Haney
Inventor： Kyu Oh Lee , Sasha N. Oster , Feras Eid , Sarah Haney
CPC classification number: G05D16/2026 , B81B3/0027 , B81B7/007 , B81B7/008 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81B2207/094 , B81C1/00158 , B81C1/00238 , B81C1/00246 , B81C1/00333 , B81C1/00547 , B81C2201/056 , B81C2203/0172 , B81C2203/0714 , B81C2203/0792
Abstract: The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.
Abstract translation: 描述了将压力或惯性传感器集成到集成电路制造和封装流程中。 在一个示例中，通过在第一介电层上沉积金属形成隔膜。 在隔膜上形成第二电介质层。 在第二电介质上形成金属网层。 第一介电层在隔膜下蚀刻形成空腔。 空腔内衬密封层。 空腔被覆盖以形成邻近隔膜的室，并且盖被密封抵靠空腔。
-
公开(公告)号：US20150185247A1
公开(公告)日：2015-07-02
申请号：US14141759
申请日：2013-12-27
Applicant: Feras Eid , Sasha N. OSTER , Kyu Oh LEE , Sarah HANEY
Inventor： Feras Eid , Sasha N. OSTER , Kyu Oh LEE , Sarah HANEY
CPC classification number: G01P1/04 , B81B3/0027 , B81B7/007 , B81B7/008 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81B2207/094 , B81C1/00238 , B81C1/00246 , B81C1/00333 , B81C1/00547 , B81C2201/056 , B81C2203/0172 , B81C2203/0714 , B81C2203/0792 , G01P15/097 , H01L27/22 , Y10T29/49075
Abstract: Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.
Abstract translation: 集成电路封装描述了磁铁放置。 在一个示例中，端子被施加到磁体。 然后将磁体放置在衬底的顶层上，焊料在端子和顶层之间，并且焊料被回流以将磁体附着到衬底上。
-
公开(公告)号：US20180026393A1
公开(公告)日：2018-01-25
申请号：US15215531
申请日：2016-07-20
Applicant: Feras Eid , Sasha N. Oster , Adel A. Elsherbini , Aleksandar Aleksov , Johanna M. Swan , Amit Sudhir Baxi , Vincent S. Mageshkumar
Inventor： Feras Eid , Sasha N. Oster , Adel A. Elsherbini , Aleksandar Aleksov , Johanna M. Swan , Amit Sudhir Baxi , Vincent S. Mageshkumar
IPC: H01R13/62 , H01R13/631 , H01R13/627
CPC classification number: H01R13/6205 , H01R11/30 , H01R13/627 , H01R13/631
Abstract: Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.
-
公开(公告)号：US20190214328A1
公开(公告)日：2019-07-11
申请号：US15866793
申请日：2018-01-10
Applicant: Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
Inventor： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
IPC: H01L23/433 , H01L25/00 , H01L21/56 , H01L23/29 , H01L25/18
CPC classification number: H01L23/4334 , H01L21/56 , H01L23/04 , H01L23/16 , H01L23/295 , H01L23/367 , H01L23/42 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589
Abstract: A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.
-
公开(公告)号：US20190003854A1
公开(公告)日：2019-01-03
申请号：US15636599
申请日：2017-06-28
Applicant: Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
Inventor： Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
IPC: G01C25/00 , G01C19/5656
CPC classification number: G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
Abstract: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.
-
Patent Agency Ranking
6.发明申请公开(公告)号：US20140083858A1
公开(公告)日：2014-03-27
申请号：US13624288
申请日：2012-09-21
Applicant: Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
Inventor： Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
CPC classification number: H05K1/0272 , H01L21/568 , H01L24/19 , H01L24/20 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2924/1815 , H01L2924/18162 , H05K1/0212 , H05K1/185 , H05K3/0097 , H05K2201/097 , H05K2203/1536 , H05K2203/308 , Y10T29/4913
Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.
Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。
-
公开(公告)号：US20180084643A1
公开(公告)日：2018-03-22
申请号：US15267872
申请日：2016-09-16
Applicant: Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
Inventor： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
CPC classification number: H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
Abstract: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
-
公开(公告)号：US20170094749A1
公开(公告)日：2017-03-30
申请号：US14866625
申请日：2015-09-25
Applicant: Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
Inventor： Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
CPC classification number: H05B33/28 , A41B1/08 , A41D1/002 , A42B1/004 , A42B1/242 , F21V33/0008 , H05B33/04 , H05B33/06
Abstract: Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.
-
公开(公告)号：US20170093007A1
公开(公告)日：2017-03-30
申请号：US14866693
申请日：2015-09-25
Applicant: Adel A. ELSHERBINI , Mathew Manusharow , Krishna Bharath , Zhichao Zhang , Yidnekachew S. Mekonnen , Aleksandar Aleksov , Henning Braunisch , Feras Eid , Javier Soto
Inventor： Adel A. ELSHERBINI , Mathew Manusharow , Krishna Bharath , Zhichao Zhang , Yidnekachew S. Mekonnen , Aleksandar Aleksov , Henning Braunisch , Feras Eid , Javier Soto
IPC: H01P3/08
Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.
-
公开(公告)号：US20150163921A1
公开(公告)日：2015-06-11
申请号：US14102676
申请日：2013-12-11
Applicant: Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
Inventor： Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
CPC classification number: H05K1/189 , G06F1/163 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/181 , H01L2924/18162 , H05K1/0393 , H05K1/181 , H05K1/185 , H05K13/0469 , H05K2201/0137 , H05K2203/1469 , Y10T29/49146 , H01L2924/00
Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.
Abstract translation: 本公开一般涉及用于制造柔性微电子组件的装置，系统和方法。 在一个实例中，聚合物模制在微电子部件上，聚合物模具在模制之后呈现基本刚性的状态。 相对于微电子部件和聚合物模具形成布线层，布线层包括电耦合到微电子部件的迹线。 输入被施加到聚合物模具，聚合物模具在施加输入时从基本刚性状态转变到基本上柔性的状态。
-
-
-
-
-
-
-
-
-
Search Results
29
records
(took 0.026 seconds)
