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24 条记录 (耗时 0.03 秒)

    Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications
    3.
    发明授权
    Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications 失效
    使用导电胶来形成用于TCA（临时芯片连接）应用的临时电气连接

    公开(公告)号：US06528352B1

    公开(公告)日：2003-03-04

    申请号：US09981269

    申请日：2001-10-17

    申请人： Raymond A. Jackson ,  John U. Knickerbocker ,  Thomas E. Lombardi ,  Amy B. Ostrander

    发明人： Raymond A. Jackson ,  John U. Knickerbocker ,  Thomas E. Lombardi ,  Amy B. Ostrander

    IPC分类号： H01L2144

    CPC分类号： G01R1/0408

    摘要： A structure and method for converting a standard ceramic carrier into a temporary chip attach carrier, wherein the device comprises a substrate, a plurality of metal vias interspersed in the substrate, a carrier layer further comprising a cavity dam with a plurality of holes filled with conductive adhesive. The process of forming the temporary chip attach carrier comprises applying a secondary layer further comprising a plurality of holes on a substrate, applying conductive adhesive in the holes, curing the adhesive, placing a chip containing C4 solder bumps onto the secondary layer, applying a force onto the chip, testing and burning-in the secondary layer, removing the force from the chip, separating the chip from the secondary layer, and then re-using the secondary layer.

    摘要翻译： 一种用于将标准陶瓷载体转换成临时芯片连接载体的结构和方法，其中所述装置包括基板，散布在所述基板中的多个金属通孔，还包括具有多个填充有导电 胶粘剂。 形成临时芯片连接载体的过程包括在基板上施加进一步包括多个孔的二次层，在孔中施加导电粘合剂，固化粘合剂，将含有C4焊料凸块的芯片放置在次级层上，施加力 在芯片上进行测试并在二级层中燃烧，去除芯片上的力，将芯片与次级层分开，然后重新使用二级层。

    Apparatus and method for removing interconnections
    8.
    发明授权
    Apparatus and method for removing interconnections 失效
    用于去除互连的装置和方法

    公开(公告)号：US06497357B2

    公开(公告)日：2002-12-24

    申请号：US09850350

    申请日：2001-05-07

    申请人： Raymond A. Jackson ,  Scott A. Bradley ,  Stephen A. DeLaurentis ,  Mario J. Interrante ,  David C. Linnell

    发明人： Raymond A. Jackson ,  Scott A. Bradley ,  Stephen A. DeLaurentis ,  Mario J. Interrante ,  David C. Linnell

    IPC分类号： B23K120

    CPC分类号： B08B1/008 ,  B08B7/0071 ,  H01L21/4864 ,  H05K3/3436 ,  H05K3/3457

    摘要： A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level. An apparatus for removing at least one molten or solid structure from a substrate for rework, the apparatus comprising: a fixture for sustaining and biasing the substrate against a wiper assembly; the wiper assembly configured and positioned to slidably engage at least a portion of the substrate; a bias for translating the wiper assembly along a surface of the substrate having the at least one molten or solid structure to be removed; and a guide block assembly capable of guiding and locking the wiper assembly.

    摘要翻译： 一种用于从表面去除至少一种熔融或固体结构的方法，包括：将具有至少一种熔融或固体结构的表面放置在固定装置中; 将所述擦拭器组件布置成靠近所述至少一个熔融或固体结构的偏压; 将所述刮水器组件保持在具有等于或高于所述至少一个熔融或固体结构的第二熔点水平的第一温度点水平的装置的第一位置; 并将夹具的温度提高到第一温度点水平; 其中当所述装置达到所述第一温度点水平时，所述至少一个熔融或固体结构从所述表面擦拭。 一种用于从基板去除至少一个熔融或固体结构以进行返修的装置，所述装置包括：固定装置，用于将所述基板保持并偏置在刮水器组件上; 所述擦拭器组件被构造和定位成可滑动地接合所述衬底的至少一部分; 用于沿着具有要移除的至少一个熔融或固体结构的衬底的表面平移擦拭器组件的偏压; 以及能够引导和锁定刮水器组件的导块组件。

    Process and apparatus to remove closely spaced chips on a multi-chip module
    9.
    发明授权
    Process and apparatus to remove closely spaced chips on a multi-chip module 失效
    在多芯片模块上去除紧密间隔的芯片的工艺和装置

    公开(公告)号：US06216937B1

    公开(公告)日：2001-04-17

    申请号：US09470455

    申请日：1999-12-22

    申请人： Stephen A. DeLaurentis ,  Mario J. Interrante ,  Raymond A. Jackson ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

    发明人： Stephen A. DeLaurentis ,  Mario J. Interrante ,  Raymond A. Jackson ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

    IPC分类号： B23K100

    CPC分类号： H01L21/687 ,  B23K1/018 ,  H01L24/98

    摘要： A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bimetallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

    摘要翻译： 一种用于通过在将模块加热到足以导致的温度的温度下向一个或多个倒装芯片的背面施加张力而将一个或多个去除构件施加拉力而移除通过安装在多芯片模块上的C4接头的倒装芯片的方法和装置 C4接头变得熔化。 张力可以是压缩弹簧，也可以是在室温下平坦并在加热到这样的温度时变得弯曲的双金属构件，或者原始形状是弯曲的并且在室温下弯曲平坦但回到其中的记忆合金 原来弯曲的形状加热到这样的温度。 使用粘合剂将去除构件粘合到要去除的芯片上，并且是固化后具有耐高温性的低温快速固化粘合剂。