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1.发明授权Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board 失效可以通过加热或照射光，薄膜，层压板和多层布线板的生产而固化的树脂组合物
公开(公告)号：US6156870A
公开(公告)日：2000-12-05
申请号：US124016
申请日：1998-07-29
CPC分类号： C08G73/0688 , H05K3/4661 , H05K2201/0133 , H05K3/0023
摘要： A resin composition which can be cured by application of heat or irradiation of light, comprising (A) a bismaleimide compound, (C) an acridine compound represented by the formula (1) or (2) as an thermosetting accelerator or a photo-polymerization initiator, and (B) an optional resin ingredient other than (A); a film and laminate produced by using the resin composition; and a method of producing a multilayer wiring board by using the resin composition as a material of insulating layers: ##STR1## wherein R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.7, R.sub.8 and R.sub.9 are hydrogen, a halogen, an alkyl or alkoxy group, R.sub.1 is an alkyl group, and R.sub.10 is an alkylene group.
摘要翻译： 包含（A）双马来酰亚胺化合物，（C）由式（1）或（2）表示的吖啶化合物作为热固性促进剂或光聚合的可通过加热或照射光使其固化的树脂组合物 引发剂，和（B）除（A）以外的任选的树脂成分; 通过使用该树脂组合物制造的膜和层压体; 以及通过使用该树脂组合物作为绝缘层的材料制造多层布线板的方法：其中R2，R3，R4，R5，R7，R8和R9为氢，卤素，烷基或烷氧基，R1为 烷基，R 10为亚烷基。
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2.发明授权
公开(公告)号：US5532105A
公开(公告)日：1996-07-02
申请号：US103873
申请日：1993-08-09
CPC分类号： G03F7/095 , H05K3/4676 , H05K2201/0209 , H05K3/0023
摘要： A photolithographically viahole-forming photosensitive element is formed of a light-transmitting base material and a photosensitive resin composition laminated as a layer on the light-transmitting base material. The photosensitive resin composition comprises:(a) 100 parts by weight of a mixture comprising:(a-1) 10 to 90 parts by weight of a rubber,(a-2) 5 to 40 parts by weight of a phenol resin, and(a-3) 10 to 80 parts by weight of an epoxy resin;(b) 1 to 10 parts by weight of an epoxy resin photoinitiator; and(c) 1 to 10 parts by weight of an aromatic polyazide compound.
摘要翻译： 光刻通孔形成用光敏元件由透光性基材和感光性树脂组合物形成，该感光性树脂组合物作为透光性基材层叠。 感光性树脂组合物包含：（a）100重量份的混合物，其包含：（a-1）10至90重量份的橡胶，（a-2）5至40重量份的酚醛树脂，和 （a-3）10〜80重量份的环氧树脂; （b）1〜10重量份的环氧树脂光引发剂; 和（c）1至10重量份的芳族聚叠氮化合物。
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公开(公告)号：US07758951B2
公开(公告)日：2010-07-20
申请号：US10591696
申请日：2005-03-04
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。
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4.发明申请RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL WITH RESIN, ADHESIVE FILM, AND METAL-CLAD LAMINATE 有权树脂组合物，使用相同的PREPREG，带树脂的金属箔，胶粘膜和金属层压板公开(公告)号：US20120244332A1
公开(公告)日：2012-09-27
申请号：US13498712
申请日：2010-09-28
申请人： Kazumasa Takeuchi
发明人： Kazumasa Takeuchi
IPC分类号： B32B5/02 , B32B17/04 , B32B15/088 , C08L77/00 , C09J163/00
CPC分类号： B32B15/08 , B32B17/04 , B32B27/04 , B32B27/34 , C08G73/1035 , C08G73/105 , C08G73/106 , C08G73/14 , C08G77/455 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K1/0346 , Y10T428/264 , Y10T428/31681
摘要： A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain.
摘要翻译： 一种树脂组合物，其包含聚酰胺酰亚胺和多官能缩水甘油基化合物，所述聚酰胺酰亚胺在分子链的至少一端具有2个或更多个羧基。
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公开(公告)号：US20100270059A1
公开(公告)日：2010-10-28
申请号：US11915097
申请日：2006-05-19
IPC分类号： H05K1/02
CPC分类号： H05K1/0281 , H05K1/0265 , H05K1/056 , H05K2201/0352 , H05K2201/09736
摘要： It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 μm, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 μm.
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的印刷电路板。 根据本发明的优选实施例的印刷电路板（40）具有基底（1），形成在柔性区域（36）中的导体（7）和形成为非柔性的导体（8,9）的结构 地区（46）。 形成在柔性区域（36）中的导体（7）的总厚度为1-30μm，形成在非柔性区域（46）中的导体（8,9）的总厚度为30-150μm 。
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公开(公告)号：US20100065313A1
公开(公告)日：2010-03-18
申请号：US11916090
申请日：2006-05-26
IPC分类号： H05K1/14
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/0366 , H05K3/281 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2203/0571 , H05K2203/063
摘要： It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的多层电路板。 根据本发明的优选实施例，多层电路板（12）具有其中非柔性印刷电路板（6）通过盖板（10）层叠到柔性印刷电路板（1）的两侧上的结构。 在多层电路板（12）中，盖板（10）保护印刷电路板（6）不在其上的印刷电路板（1）的区域，同时还用作粘合层（11），用于与 印刷电路板（6）。 换句话说，相同的层用作多层电路板（12）中的覆盖层（10）和粘合剂层（11）。
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7.发明授权Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet 有权底漆，带树脂的导体箔，层叠片及其制造方法公开(公告)号：US07648770B2
公开(公告)日：2010-01-19
申请号：US10557728
申请日：2004-05-21
IPC分类号： B32B15/08
CPC分类号： B32B27/36 , B32B7/04 , B32B15/08 , B32B25/08 , B32B25/14 , B32B27/08 , B32B27/281 , B32B27/322 , B32B2307/202 , B32B2307/206 , B32B2307/748 , B32B2457/00 , C08G73/14 , H05K3/386 , H05K2201/0358 , Y10T156/10 , Y10T428/24355 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.
摘要翻译： 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。
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公开(公告)号：US4696704A
公开(公告)日：1987-09-29
申请号：US867440
申请日：1986-05-28
IPC分类号： H01L23/48 , C22C9/06 , C22F1/00 , C22F1/08 , H01L23/495
CPC分类号： H01L23/49579 , C22C9/06 , H01L2924/0002
摘要： An excellent material for lead frames is provided which is economical and easily punched out to produce lead frames without bending or breakage, and has both superior tensile strength and high electrical conductivity, as well as splendid heat dissipation properties and good soldering properties.
摘要翻译： 提供了一种优良的引线框架材料，经济实惠，易于冲压，无弯曲或断裂，并具有优异的拉伸强度和高导电性，以及出色的散热性能和良好的焊接性能。
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公开(公告)号：US4270845A
公开(公告)日：1981-06-02
申请号：US703744
申请日：1976-07-09
CPC分类号： B23K26/10 , A61B18/201 , H01S3/03 , H01S3/041
摘要： A laser apparatus for operations comprises a power case containing a power supply, etc., a laser tube container head located over the power case, means for supporting the laser tube container head so as to permit rotation in a horizontal plane and in a manner to enable seesaw motion in a vertical plane, a longitudinally telescoping light guide tube attached longitudinally to the laser tube container head, mirror joints connected with the light guide tube, and a manipulator connected detachably with the mirror joints.A forced-oil cooled laser apparatus comprises mirror holder electrodes which hold an inner glass tube and an outer transparent pipe coaxially in an airtight manner, and an intermediate electrode, the mirror holder electrodes being provided with discharge gas intake and outlet ports and with cooling oil intake and outlet ports, the discharge gas intake and outlet ports being connected with a vacuum pump and a discharge gas cylinder, the cooling oil intake and outlet ports being connected with a cooler and a compressor.
摘要翻译： 一种用于操作的激光装置包括一个包含电源的电源盒等，位于电源盒上方的激光管容器头，用于支撑激光管容器头以允许在水平面上旋转的装置， 使得在垂直平面中的跷跷板运动，纵向伸缩的导光管纵向连接到激光管容器头部，与导光管连接的镜面接头以及与镜接头可拆卸地连接的操纵器。 强制油冷激光装置包括以气密方式同时保持内玻璃管和外透明管的镜保持器电极和中间电极，反射镜保持器电极设置有放电气体进出口和冷却油 进出口，排气进出口与真空泵和排气气瓶连接，冷却油进出口与冷却器和压缩机连接。
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公开(公告)号：US08196915B2
公开(公告)日：2012-06-12
申请号：US12923298
申请日：2010-09-14
申请人： Takeshi Hirabayashi , Shigefumi Soga , Terumitsu Azuma , Kentaro Fukami , Shinji Tanoue , Hiroki Yoshida , Toshikazu Satoh , Daishi Watanabe , Kazumasa Takeuchi
发明人： Takeshi Hirabayashi , Shigefumi Soga , Terumitsu Azuma , Kentaro Fukami , Shinji Tanoue , Hiroki Yoshida , Toshikazu Satoh , Daishi Watanabe , Kazumasa Takeuchi
IPC分类号： B65H37/04
CPC分类号： B42C1/125 , B65H29/52 , B65H31/36 , B65H37/04 , B65H2404/693 , B65H2801/27 , G03G15/6544 , G03G2215/00827
摘要： A sheet processing apparatus includes: a staple tray on which sheets are stacked temporarily and stapled after being aligned together and from which the stapled sheets are discharged to a discharge tray; a discharger to discharge the sheets to the staple tray; a rear end reference against which rear ends of the sheets are abutted to be aligned together; a returner to return the sheets discharged by the discharger and to align the sheets together in a conveying direction based on the rear end reference fence; a lifter to lift and lower the returner with respect to a sheet; and a guide configured to guide the sheets toward the rear end reference fence when the sheets are returned and to be lifted and lowered in synchronization with the lifting and lowering by the lifter.
摘要翻译： 片材处理装置包括：订书钉托盘，在其上临时堆叠片材并在被对齐在一起之后装订，并且装订的片材从该订书钉托盘排出到排出托盘; 排出器，用于将片材排出到订书钉托盘; 后端基准，所述片的后端与所述后端基准抵接以对齐在一起; 返回器，用于返回由放电器排出的片材，并且基于后端参考栅栏沿着输送方向将片材对准; 升降机，以相对于片材提升和降低回缩器; 以及引导件，其构造成当片材返回时引导片材朝向后端基准栅栏，并且通过升降机的升降同步地升高和降低。
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