摘要:
A light emitting device which includes at least one of a laser light source (1), wiring (9), a lens for excitation (2), a luminous body (4), a laser cut filter (6), a half parabolic mirror (5P), and a base (5h), in which a part of the wiring (9) is installed at a portion in which a breakage easily occurs due to at least one deformation of the laser light source (1), the lens for excitation (2), the luminous body (4), the laser cut filter (6), the half parabolic mirror (5P), and the base (5h), or a change in an installation position thereof.
摘要:
A light emitting device which includes at least one of a laser light source (1), wiring (9), a lens for excitation (2), a luminous body (4), a laser cut filter (6), a half parabolic mirror (5P), and a base (5h), in which a part of the wiring (9) is installed at a portion in which a breakage easily occurs due to at least one deformation of the laser light source (1), the lens for excitation (2), the luminous body (4), the laser cut filter (6), the half parabolic mirror (5P), and the base (5h), or a change in an installation position thereof.
摘要:
In order to offer a power supply circuit that can minimize the drop in efficiency by reducing losses during voltage conversion, in an improved-power factor circuit, a control circuit performs a step-up operation in which a control signal for turning on a first switching element (Tr1) and switching a second switching element (Tr2) is output, and a step-down operation in which a control signal for turning off the second switching element (Tr2) and switching the first switching element (Tr1) is output.
摘要:
In order to offer a power supply circuit that can minimize the drop in efficiency by reducing losses during voltage conversion, in an improved-power factor circuit, a control circuit performs a step-up operation in which a control signal for turning on a first switching element (Tr1) and switching a second switching element (Tr2) is output, and a step-down operation in which a control signal for turning off the second switching element (Tr2) and switching the first switching element (Tr1) is output.
摘要:
This DC/DC converter includes a first DC/DC converter, and a second DC/DC converter for carrying out a DC/DC conversion of voltage supplied from the first DC/DC converter. One of either the first DC/DC converter or the second DC/DC converter is a fixed-factor DC/DC converter, and the other of either the first DC/DC converter or the second DC/DC converter is a variable-factor DC/DC converter.
摘要:
A push-pull circuit comprising: a push-pull first switching element and second switching element; a first rectifier element; a third switching element for switching a pathway between conductance and cutoff, the pathway leading from a connection point between the first switching element and an inductive load via the first rectifier element to a connection point between a DC power source and a center tap of the inductive load; a second rectifier element; and a fourth switching element for switching a pathway between conductance and cutoff, the pathway leading from a connection point between the second switching element and the inductive load via the second rectifier element to a connection point between the DC power source and the center tap of the inductive load.
摘要:
A light-emitting element includes a first conductivity type semiconductor base, a plurality of first conductivity type protrusion-shaped semiconductors formed on the semiconductor base, and a second conductivity type semiconductor layer that covers the protrusion-shaped semiconductors.
摘要:
A light-emitting element includes a first conductivity type semiconductor base, a plurality of first conductivity type protrusion-shaped semiconductors formed on the semiconductor base, and a second conductivity type semiconductor layer that covers the protrusion-shaped semiconductors.
摘要:
This method for disposing fine objects, in a substrate preparing step, prepares a substrate having specified positions where fine objects (120) are to be disposed in an area where a first electrode (111) and a second electrode (112) face each other, and in a fluid introducing step, a fluid (121) is introduced on the substrate (110). The fluid (121) contains a plurality of the fine objects (120). The fine objects (120) are diode elements, each of which has, as an alignment structure, a front side layer (130) composed of a dielectric material, and a rear side layer (131) composed of a semiconductor. In the fine object disposing step, by applying an AC voltage to between the first electrode (111) and the second electrode (112), the fine objects (120) are disposed by dielectrophoresis with the front side layer (130) facing up at the predetermined positions in the area (A) where the first electrode (111) and the second electrode (112) face each other.
摘要:
This method for disposing fine objects, in a substrate preparing step, prepares a substrate having specified positions where fine objects (120) are to be disposed in an area where a first electrode (111) and a second electrode (112) face each other, and in a fluid introducing step, a fluid (121) is introduced on the substrate (110). The fluid (121) contains a plurality of the fine objects (120). The fine objects (120) are diode elements, each of which has, as an alignment structure, a front side layer (130) composed of a dielectric material, and a rear side layer (131) composed of a semiconductor. In the fine object disposing step, by applying an AC voltage to between the first electrode (111) and the second electrode (112), the fine objects (120) are disposed by dielectrophoresis with the front side layer (130) facing up at the predetermined positions in the area (A) where the first electrode (111) and the second electrode (112) face each other.