公开(公告)号：US4993481A

公开(公告)日：1991-02-19

申请号：US412837

申请日：1989-09-26

申请人： Masayuki Kamimoto ,  Yoshiyuki Abe ,  Yoshio Takahashi ,  Ryuji Sakamoto ,  Kotaro Tanaka ,  Akira Negishi ,  Hidetoshi Yamauchi ,  Kiyotaka Tsukada ,  Yoshimi Ohashi

发明人： Masayuki Kamimoto ,  Yoshiyuki Abe ,  Yoshio Takahashi ,  Ryuji Sakamoto ,  Kotaro Tanaka ,  Akira Negishi ,  Hidetoshi Yamauchi ,  Kiyotaka Tsukada ,  Yoshimi Ohashi

IPC分类号： F28D20/00 ,  C04B38/00 ,  F28D20/02

CPC分类号： F28D20/02 ,  C04B38/0006 ,  F28D20/023 ,  Y02E60/145

摘要： A thermal storage unit has a thermal storage material which performs heat exchange through a fluid filled in a thermal storage body arranged within a vessel having an opening communicated to outside. The thermal storage body is a porous ceramic molding which contains the thermal storage medium.

摘要翻译： 热存储单元具有通过布置在具有与外部连通的开口的容器内的蓄热体中填充的流体进行热交换的蓄热材料。 储热体是含有热存储介质的多孔陶瓷模制件。

公开(公告)号：US09790850B2

公开(公告)日：2017-10-17

申请号：US13881319

申请日：2011-10-24

申请人： Isao Kitsukawa ,  Tomohiro Sugano ,  Yoshiyuki Abe ,  Haruyo Kimura ,  Akira Iijima ,  Naoki Ishibashi ,  Syougo Sakashita

发明人： Isao Kitsukawa ,  Tomohiro Sugano ,  Yoshiyuki Abe ,  Haruyo Kimura ,  Akira Iijima ,  Naoki Ishibashi ,  Syougo Sakashita

IPC分类号： F02B33/44 ,  F02B37/11 ,  F02B37/10 ,  F02B39/10 ,  F02D23/00

CPC分类号： F02B37/11 ,  F02B37/10 ,  F02B39/10 ,  F02D23/00 ,  F02D41/0007 ,  F02D41/062 ,  F02D2200/702 ,  Y02T10/144

摘要： A turbocharger system for simultaneously improving a fuel efficiency and obtaining a satisfactory hill start performance due to a downsized engine. The system includes an electric assist turbocharger which includes a turbine disposed in an exhaust passage of an engine and driven by exhaust gas, a compressor disposed in an intake passage and driven by a rotational torque of the turbine, and an electric motor assisting a driving force of the compressor and an electric motor control unit which drives the electric motor when detecting a start operation at a sloping road.

公开(公告)号：US09512843B2

公开(公告)日：2016-12-06

申请号：US13882065

申请日：2011-10-26

申请人： Isao Kitsukawa ,  Tomohiro Sugano ,  Yoshiyuki Abe ,  Haruyo Kimura ,  Akira Iijima ,  Naoki Ishibashi ,  Syougo Sakashita

发明人： Isao Kitsukawa ,  Tomohiro Sugano ,  Yoshiyuki Abe ,  Haruyo Kimura ,  Akira Iijima ,  Naoki Ishibashi ,  Syougo Sakashita

IPC分类号： F02B33/44 ,  F04D13/06 ,  F02B37/10 ,  F02B39/10 ,  F02D23/00

CPC分类号： F04D13/06 ,  F02B37/10 ,  F02B37/14 ,  F02B39/10 ,  F02D23/00 ,  F02D41/0007 ,  F02D2200/50 ,  F02M26/05 ,  F02M26/23 ,  Y02T10/121 ,  Y02T10/144

摘要： A turbocharger system for achieving both improvement of fuel efficiency by engine downsizing and excellent shock loading resistance. The system includes: a power-assisted turbocharger mounted on a vehicle having an accessory and including a turbine disposed on an exhaust passage of an engine and driven by exhaust, a compressor disposed on an intake passage and driven by a rotational torque of the turbine, and an electric motor that assists a drive force of the compressor; and an electric motor control unit that drives the electric motor when the accessory is being driven.

摘要翻译： 一种涡轮增压器系统，用于通过发动机小型化和优异的抗冲击负载能力来实现燃料效率的提高。 该系统包括：安装在具有附件并且包括设置在发动机的排气通道上并由排气驱动的涡轮机的车辆上的动力辅助涡轮增压器，设置在进气通道上并由涡轮的旋转扭矩驱动的压缩机， 以及辅助压缩机的驱动力的电动机; 以及当所述附件被驱动时驱动所述电动机的电动机控制单元。

公开(公告)号：US09334833B2

公开(公告)日：2016-05-10

申请号：US13881103

申请日：2011-10-24

申请人： Isao Kitsukawa ,  Tomohiro Sugano ,  Yoshiyuki Abe ,  Haruyo Kimura ,  Akira Iijima ,  Naoki Ishibashi ,  Syougo Sakashita

发明人： Isao Kitsukawa ,  Tomohiro Sugano ,  Yoshiyuki Abe ,  Haruyo Kimura ,  Akira Iijima ,  Naoki Ishibashi ,  Syougo Sakashita

IPC分类号： F02B33/44 ,  F02M25/07 ,  F02B37/013 ,  F02B37/10 ,  F02B39/10 ,  F02D21/08 ,  F02D23/00 ,  F02B37/00

CPC分类号： F02M26/03 ,  F02B37/004 ,  F02B37/013 ,  F02B37/10 ,  F02B39/10 ,  F02D21/08 ,  F02D23/00 ,  Y02T10/144

摘要： A turbocharger system for ensuring a sufficient exhaust gas recirculation (“EGR”) amount in all operating conditions, and reducing NOx emission from an engine. The system includes an EGR controller that re-circulates a part of exhaust gas discharged from the engine to an intake side. The turbocharger is a power-assisted turbocharger including an electric motor that assists a drive force of a compressor. The EGR controller controls an amount of exhaust gas recirculated to the intake side so as to inhibit the generation of NOx regardless of an amount of oxygen necessary for combustion of the engine. An electric motor control unit drives the electric motor, by the control of the EGR controller, when the amount of oxygen necessary for the combustion of the engine is deficient.

摘要翻译： 一种涡轮增压器系统，用于确保在所有操作条件下足够的废气再循环（“EGR”）量，并且减少来自发动机的NOx排放。 该系统包括EGR控制器，其将从发动机排出的废气的一部分重新循环到进气侧。 涡轮增压器是一种动力辅助涡轮增压器，其包括有助于压缩机的驱动力的电动机。 EGR控制器控制再循环到进气侧的废气量，以便与发动机燃烧所需的氧气量无关地抑制NOx的产生。 当发动机燃烧所需的氧气量不足时，电动机控制单元通过EGR控制器的控制来驱动电动机。

公开(公告)号：US09005487B2

公开(公告)日：2015-04-14

申请号：US13388798

申请日：2010-07-29

申请人： Tokuyuki Nakayama ,  Yoshiyuki Abe

发明人： Tokuyuki Nakayama ,  Yoshiyuki Abe

IPC分类号： H01B1/08 ,  C23C14/08 ,  C04B35/01 ,  C04B35/645 ,  C23C14/34

CPC分类号： H01J37/3429 ,  C04B35/01 ,  C04B35/645 ,  C04B2235/3229 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3256 ,  C04B2235/3258 ,  C04B2235/3284 ,  C04B2235/3286 ,  C04B2235/3293 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5472 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/6581 ,  C04B2235/6585 ,  C04B2235/6586 ,  C04B2235/668 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  C04B2235/963 ,  C23C14/08 ,  C23C14/3414 ,  H01B1/08 ,  H01J1/00 ,  H01L31/022466 ,  H01L33/42

摘要： A tablet for ion plating enables to attain high rate film-formation of a transparent conductive film suitable for a blue LED or a solar cell, and a noduleless film-formation not generating splash, an oxide sintered body most suitable for obtaining the same, and a production method thereof. A tablet for ion plating obtained by processing an oxide sintered body includes indium and cerium as oxides, and having a cerium content of 0.3 to 9% by atom, as an atomicity ratio of Ce/(In+Ce). The oxide sintered body has an In2O3 phase of a bixbyite structure as a main crystal phase, has a CeO2 phase of a fluorite-type structure finely dispersed as crystal grains having an average particle diameter of equal to or smaller than 3 μm, as a second phase. The oxide sintered body is produced by (a) mixing raw material powder consisting of indium oxide powder with an average particle diameter of equal to or smaller than 1.5 μm, then (b) molding the mixed powder, and sintering the molding by a normal pressure sintering method, or (b′) molding and sintering the mixed powder by a hot press method.

摘要翻译： 用于离子镀的片剂能够实现适合于蓝色LED或太阳能电池的透明导电膜的高速成膜和不产生飞溅的无节点成膜，最适合获得溅射的氧化物烧结体，以及 其制造方法。 通过加工氧化物烧结体获得的用于离子镀的片剂包括铟和铈作为氧化物，并且铈含量为0.3至9原子％，作为Ce /（In + Ce）的原子数比。 氧化物烧结体具有作为主晶相的二氧化硅结构的In2O3相，具有以平均粒径为3μm以下的晶粒微分散的萤石型结构的CeO 2相作为第二 相。 氧化物烧结体通过（a）将由氧化铟粉末组成的平均粒径为1.5μm以下的原料粉末混合，然后（b）成型混合粉末，并通过常压烧结成型体 烧结方法或（b'）通过热压法成型和烧结混合粉末。

公开(公告)号：US08840115B2

公开(公告)日：2014-09-23

申请号：US11684318

申请日：2007-03-09

申请人： Joel T. Johnson ,  Benjamin E. Westbrook ,  Noriyuki Matsui ,  Yoshiyuki Abe ,  Takeshi Wakana ,  Mathias Burkert

发明人： Joel T. Johnson ,  Benjamin E. Westbrook ,  Noriyuki Matsui ,  Yoshiyuki Abe ,  Takeshi Wakana ,  Mathias Burkert

IPC分类号： F16J15/32 ,  F16J15/00 ,  F16J15/56

CPC分类号： F16J15/56 ,  F16J15/002

摘要： A seal system for a reciprocating cylinder includes a buffer seal, a rod seal, and a wiper seal. The buffer seal includes a dynamic seal lip and a static lip extending from a hinge portion. The hinge portion of the static lip allows fluid to escape past the outer diameter of the seal when the rod is retracted thereby releasing any pressure build-up between the rod seal and buffer seal. The axial face portion of the dynamic seal lip includes axially extending notches therein. The notches prevent the buffer seal from sticking to the axial wall of the groove and provide a consistent path for the fluid to energize the annular groove between the static and dynamic lips during the extension phase which is necessary for the function of the seal. The back-up ring is an integrated part of the buffer seal, used to provide superior extrusion resistance. The rod seal includes an annular seal body having a dynamic seal lip angularly extending radially inwardly and axially from the seal body, and a static lip angularly extending radially outwardly and axially from the seal body. An axial face portion of the dynamic seal lip and the static lip each include radially extending notches therein. The notches prevent the seal from sticking to the axial walls of the groove the rod seal is installed in and provides a consistent path for the fluid to energize the annular groove created by the static and dynamic lip during the extension phase. The back-up ring is an integrated part of the rod seal, used to provide superior extrusion resistance.

摘要翻译： 用于往复式气缸的密封系统包括缓冲密封件，杆密封件和擦拭器密封件。 缓冲密封件包括动态密封唇缘和从铰链部分延伸的静态唇缘。 当杆缩回时，静态唇缘的铰链部分允许流体逃离密封件的外径，从而释放杆密封件和缓冲密封件之间的任何压力积聚。 动态密封唇的轴向面部分包括其中轴向延伸的凹口。 凹口防止缓冲密封件粘附到凹槽的轴向壁上，并提供一致的路径，用于在密封功能所需的延伸阶段期间使流体在静态和动态唇缘之间激励环形凹槽。 备用环是缓冲密封件的集成部件，用于提供优异的挤出阻力。 杆密封件包括环形密封体，其具有从密封体径向向内和轴向成角度地延伸的动态密封唇，以及从密封体径向向外并且轴向地成角度地延伸的静态唇缘。 动态密封唇缘和静态唇缘的轴向面部各自包括径向延伸的凹口。 凹口防止密封件粘附到凹槽的轴向壁上，杆密封件安装在该轴向壁中，并且提供一致的路径，以使流体在延伸阶段期间由静态和动态唇缘产生的环形凹槽通电。 支撑环是杆密封件的集成部件，用于提供优异的挤压阻力。

公开(公告)号：US08729698B2

公开(公告)日：2014-05-20

申请号：US12872966

申请日：2010-08-31

申请人： Tadahiro Morifuji ,  Haruo Shimamoto ,  Chuichi Miyazaki ,  Toshihide Uematsu ,  Yoshiyuki Abe

发明人： Tadahiro Morifuji ,  Haruo Shimamoto ,  Chuichi Miyazaki ,  Toshihide Uematsu ,  Yoshiyuki Abe

IPC分类号： H01L23/488

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/13025 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/9202 ,  H01L2224/95143 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00

摘要： Grooves are formed on the front surfaces of first and second semiconductor wafers each including an aggregate of a plurality of semiconductor chips. The grooves each extend on a dicing line set between the semiconductor chips and to have a larger width than the dicing line. Thereafter the first and second semiconductor wafers are arranged so that the front surfaces thereof are opposed to each other, and the space between the first semiconductor wafer and the second semiconductor wafer is sealed with underfill. Thereafter the rear surfaces of the first and second semiconductor wafers are polished until at least the grooves are exposed, and a structure including the first and second semiconductor wafers and the underfill is cut on the dicing line.

公开(公告)号：US08633046B2

公开(公告)日：2014-01-21

申请号：US13494249

申请日：2012-06-12

申请人： Tokuyuki Nakayama ,  Yoshiyuki Abe

发明人： Tokuyuki Nakayama ,  Yoshiyuki Abe

IPC分类号： H01L21/00

CPC分类号： H01L33/42 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

摘要： Provided are a semiconductor light-emitting element that is capable of efficiently outputting blue color or ultraviolet light, and a lamp using the semiconductor light-emitting element.The semiconductor light-emitting element is obtained by a manufacturing method that, when manufacturing the semiconductor light-emitting element that comprises a compound semiconductor layer that includes at least a p-type semiconductor layer, and a transparent electrode that is provided on the p-type semiconductor layer, includes a step of forming a film comprising an oxide of indium and gallium, or forming a film comprising an oxide of indium, gallium and tin, in an amorphous state on the p-type semiconductor layer, so as to form a transparent conductive film, followed by a step of performing an annealing process on the transparent conductive film at a temperature of 200° C. to 480° C.

摘要翻译： 提供能够有效地输出蓝色或紫外光的半导体发光元件和使用该半导体发光元件的灯。 半导体发光元件是通过以下制造方法获得的：当制造包括至少包含p型半导体层的化合物半导体层的半导体发光元件和设置在p型半导体层上的透明电极时， 型半导体层包括形成包含铟和镓的氧化物的膜或在p型半导体层上形成非晶状态的包含铟，镓和锡的氧化物的膜的步骤，以形成 透明导电膜，然后在200℃至480℃的温度下对透明导电膜进行退火处理的步骤。

公开(公告)号：US08561999B2

公开(公告)日：2013-10-22

申请号：US12518794

申请日：2007-12-14

申请人： Toshiyuki Maeda ,  Yoshiyuki Abe

发明人： Toshiyuki Maeda ,  Yoshiyuki Abe

IPC分类号： F16J9/12

CPC分类号： F16J15/3208 ,  F15B15/1452 ,  F15B15/1461

摘要： A sealing device is provided which is capable of reducing its sliding resistance. In a sealing device 1 which is fitted into an annular groove formed in one of a housing with a shaft hole and a shaft inserted into said shaft hole and serves to seal an annular gap between these two members, and which includes a seal ring 2 made of a resin that is in sliding contact with the other of the two members, and an elastic ring 3 that is fitted between the seal ring 2 and the annular groove, the seal ring has a plurality of concave portions 22 formed on its sliding surface 20 which is in sliding contact with the other member.

摘要翻译： 提供能够降低其滑动阻力的密封装置。 在密封装置1中，该密封装置1装配到形成在具有轴孔的壳体中的环形槽中，并且轴插入到所述轴孔中，并且用于密封这两个构件之间的环形间隙，并且包括形成的密封环2 与两个构件中的另一个滑动接触的树脂，以及装配在密封环2和环形槽之间的弹性环3，密封环具有形成在其滑动表面20上的多个凹部22 其与另一个构件滑动接触。

公开(公告)号：US08546244B2

公开(公告)日：2013-10-01

申请号：US13346716

申请日：2012-01-09

申请人： Yoshiyuki Abe ,  Chuichi Miyazaki ,  Toshihide Uematsu ,  Haruo Shimamoto

发明人： Yoshiyuki Abe ,  Chuichi Miyazaki ,  Toshihide Uematsu ,  Haruo Shimamoto

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05582 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/3512

摘要： A method includes the steps of: (a) fixing a front surface of a wafer (semiconductor wafer) having the front surface, a plurality of chip regions formed on the front surface, a dicing region formed between the chip regions, and a rear surface opposite to the front surface to the supporting member; (b) in a state of having the wafer fixed to the supporting member, grinding the rear surface of the wafer to expose the rear surface; (c) in a state of having the wafer fixed to the supporting member, dividing the wafer into the chip regions; (d) etching side surfaces of the chip regions to remove crushed layers formed in the step (c) on the side surfaces and obtain a plurality of semiconductor chips. After the steps (e) and (d), the plurality of divided chip regions are peeled off from the supporting member to obtain a plurality of semiconductor chips.

摘要翻译： 一种方法包括以下步骤：（a）固定具有前表面的晶片（半导体晶片）的前表面，形成在前表面上的多个芯片区域，形成在芯片区域之间的切割区域和后表面 与支撑构件的前表面相对; （b）在将晶片固定在支撑构件上的状态下，研磨晶片的后表面以暴露后表面; （c）在将晶片固定在支撑部件上的状态下，将晶片分割成芯片区域; （d）蚀刻芯片区域的侧表面以去除侧表面上的步骤（c）中形成的破碎层，并获得多个半导体芯片。 在步骤（e）和（d）之后，将多个分割的芯片区域从支撑构件剥离以获得多个半导体芯片。