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公开(公告)号：US07602614B2
公开(公告)日：2009-10-13
申请号：US10562252
申请日：2004-06-04
申请人： Michael Bauer , Wolfram Eurskens , Rudolf Kerler , Heinz Pape , Peter Strobel , Stephan Stoeckl
发明人： Michael Bauer , Wolfram Eurskens , Rudolf Kerler , Heinz Pape , Peter Strobel , Stephan Stoeckl
IPC分类号： H05K7/00
CPC分类号： H05K1/184 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/15192 , H01L2924/15311 , H05K1/0284 , H05K3/105 , H05K3/46 , H05K2201/0215 , H05K2201/0257 , H05K2201/0919 , H05K2201/10446 , H05K2203/102 , H05K2203/108 , H05K2203/1131 , H05K2203/1136
摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
摘要翻译： 公开了电子模块及其制造方法。 在一个实施例中，电子模块具有布置在接线块上的多个部件。 布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。 接触垫电连接到部件的部件连接。
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2.发明授权公开(公告)号：US07276785B2
公开(公告)日：2007-10-02
申请号：US10934549
申请日：2004-09-07
申请人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
发明人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
IPC分类号： H01L23/02
CPC分类号： H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/48091 , H01L2224/48465 , H01L2224/92247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01068 , H01L2924/01075 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
摘要翻译： 本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接 ，其布置在组件层之间并连接到未覆盖区域。 此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。
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3.发明申请公开(公告)号：US20050052830A1
公开(公告)日：2005-03-10
申请号：US10934549
申请日：2004-09-07
申请人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
发明人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
IPC分类号： H01L25/065 , H01L25/16 , H05K5/00
CPC分类号： H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/48091 , H01L2224/48465 , H01L2224/92247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01068 , H01L2924/01075 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
摘要翻译： 本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接 ，其布置在组件层之间并连接到未覆盖区域。 此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。
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公开(公告)号：US20060250781A1
公开(公告)日：2006-11-09
申请号：US10562252
申请日：2004-06-04
申请人： Michael Bauer , Wolfram Eurskens , Rudolf Kerter , Heinz Pape , Peter Strobe , Stephan Stoeckl
发明人： Michael Bauer , Wolfram Eurskens , Rudolf Kerter , Heinz Pape , Peter Strobe , Stephan Stoeckl
IPC分类号： H05K1/09
CPC分类号： H05K1/184 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/15192 , H01L2924/15311 , H05K1/0284 , H05K3/105 , H05K3/46 , H05K2201/0215 , H05K2201/0257 , H05K2201/0919 , H05K2201/10446 , H05K2203/102 , H05K2203/108 , H05K2203/1131 , H05K2203/1136
摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
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公开(公告)号：US07709936B2
公开(公告)日：2010-05-04
申请号：US11613897
申请日：2006-12-20
申请人： Michael Bauer , Stephan Stoeckl
发明人： Michael Bauer , Stephan Stoeckl
IPC分类号： H01L21/00
CPC分类号： H01L23/60 , H01L23/495 , H01L23/49503 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.
摘要翻译： 本发明涉及一种模块，其包括在第一区域中具有比在第二区域中更低刚度或不同结构的载体元件，并且还包括施加到载体元件的部件。 部件和第一区域通过被材料覆盖的电线连接而彼此连接。
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公开(公告)号：US20080112141A1
公开(公告)日：2008-05-15
申请号：US11613897
申请日：2006-12-20
申请人： Michael Bauer , Stephan Stoeckl
发明人： Michael Bauer , Stephan Stoeckl
IPC分类号： H05K7/00
CPC分类号： H01L23/60 , H01L23/495 , H01L23/49503 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.
摘要翻译： 本发明涉及一种模块，其包括在第一区域中具有比在第二区域中更低刚度或不同结构的载体元件，并且还包括施加到载体元件的部件。 部件和第一区域通过被材料覆盖的电线连接而彼此连接。
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7.发明申请Electronic component with cavity fillers made from thermoplast and method for production thereof 审中-公开具有由热塑性塑料制成的腔体填料的电子部件及其制造方法公开(公告)号：US20060088954A1
公开(公告)日：2006-04-27
申请号：US10515517
申请日：2003-10-20
申请人： Michael Bauer , Christian Birzer , Gerald Ofner , Stephan Stoeckl
发明人： Michael Bauer , Christian Birzer , Gerald Ofner , Stephan Stoeckl
CPC分类号： H01L21/563 , H01L23/3128 , H01L2224/0401 , H01L2224/16227 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01004 , H01L2924/01068 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2224/16225 , H01L2924/00
摘要： An electronic component and a method for fabricating it is disclosed, where the component comprises a semiconductor chips which has flip-chip contacts. These contacts are fixed on a rewiring substrate, the interspace between the rewiring substrate and the semiconductor chip being filled with a thermoplastic. The glass transition temperature of the thermoplastic is above the highest operating test temperature of the component and below the melting temperature of the solder material for external contacts.
摘要翻译： 公开了一种电子部件及其制造方法，其中该部件包括具有倒装芯片触点的半导体芯片。 这些触点固定在再布线基板上，重新布线基板和半导体芯片之间的间隙被热塑性塑料填充。 热塑性塑料的玻璃化转变温度高于组件的最高工作试验温度，低于用于外部接触的焊料材料的熔化温度。
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8.发明授权Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module 有权具有具有柔性芯片触点的半导体芯片的电子模块以及用于制造电子模块的方法公开(公告)号：US06940156B2
公开(公告)日：2005-09-06
申请号：US10673968
申请日：2003-09-29
申请人： Michael Bauer , Christian Birzer , Gerald Ofner , Stephan Stoeckl
发明人： Michael Bauer , Christian Birzer , Gerald Ofner , Stephan Stoeckl
IPC分类号： H01L23/485 , H01L23/02
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/13 , H01L2224/13099 , H01L2224/45144 , H01L2924/00014 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.
摘要翻译： 电子模块包含具有柔性芯片触点的半导体芯片。 柔性芯片触点设置在最上面的金属化层上并且具有尺寸稳定的接触板，其通过弹性体嵌入化合物中的导电部件连接到最上面的金属化层上的接触表面。
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9.发明授权Semiconductor component with plastic housing, and process for producing the same 有权具有塑料外壳的半导体元件及其制造方法公开(公告)号：US07772105B2
公开(公告)日：2010-08-10
申请号：US11925117
申请日：2007-10-26
申请人： Ulrich Bachmaier , Michael Bauer , Robert Christian Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人： Ulrich Bachmaier , Michael Bauer , Robert Christian Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
IPC分类号： H01L21/44
CPC分类号： H01L25/50 , H01L23/3128 , H01L23/49811 , H01L24/48 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.
摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。
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10.发明授权公开(公告)号：US07662664B2
公开(公告)日：2010-02-16
申请号：US11780786
申请日：2007-07-20
申请人： Michael Bauer , Ludwig Heitzer , Jens Pohl , Peter Strobel , Christian Stuempfl
发明人： Michael Bauer , Ludwig Heitzer , Jens Pohl , Peter Strobel , Christian Stuempfl
CPC分类号： H05K1/141 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/8388 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19043 , H01L2924/3025 , H05K3/3436 , H05K2201/049 , H05K2201/10515 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/3512
摘要： An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.
摘要翻译： 封装在封装构造中的电子电路包括：具有第一电子元件的下部子组件，第一布线载体，具有第一再分布层的第一壳体和布置在第一再分布层上的焊球布置，以及上部 子组件具有安装在下部子组件上的第二电子元件。 一种封装在封装结构中的电子电路的制造方法，其特征在于，包括：通过辐射交联热塑性粘合剂将第一电子元件的上侧粘接到第一再分布层的下侧。
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