摘要:
A process for producing a resin having a high heat resistance with a high polymerization conversion by emulsion-polymerizing .alpha.-methylstyrene (AMS), methyl methacrylate (MMA) and acrylonitrile (AN), characterized in that the polymerization is conducted in two steps; A monomer mixture consisting of 60-85% by weight of AMS, 2-30% by weight of MMA and 5-20% by weight of AN is subjected to copolymerization in the first step until 25-85% by weight, based on the weight of the final copolymer, of a copolymer is formed, and in the second step, at least one monomer of the above three monomers is added to the polymerization system to adjust the composition ratio of the three monomers in the polymerization system so as to fall in the region surrounded by the lines connecting points A, B, C, D and E in the triangular coordinate graph indicating the quantitative relationship of the three monomers, and the resulting monomer mixture is subjected to polymerization conditions to complete the polymerization.
摘要:
A thermoplastic resin having an excellent thermal stability and a high heat resistance is prepared by initiating polymerization of 65-85 parts by weight of a monomer mixture (A) consisting of 50-85% by weight of .alpha.-methylstyrene, 3-20% by weight of methyl methacrylate, 2-20% by weight of acrylonitrile, and 0-25% by weight of an aromatic alkenyl compound other than .alpha.-methylstyrene, continuously or intermittently adding, on the way of the polymerization, 2-15 parts by weight of a monomer (B) consisting of acrylonitrile or a mixture thereof with an aromatic alkenyl compound other than .alpha.-methylstyrene to the polymerization system while continuing the polymerization, further adding to the polymerization system 5-25 parts by weight of a monomer (C) consisting of an aromatic alkenyl compound other than .alpha.-methylstyrene, or a mixture thereof with acrylonitrile, and continuing the polymerization to complete the polymerization, the total amount of monomers (A), (B), and (C) being 100 parts by weight. Further, a thermoplastic resin composition having an excellent thermal stability, a high heat resistance and a high impact strength is prepared by mixing the thermoplastic resin thus obtained with a graft copolymer obtained by grafting 60-30 parts by weight of a monomer mixture consisting of 65-80% by weight of an aromatic alkenyl compound and 35-20% by weight of acrylonitrile on 40-70 parts by weight of a diene rubbery polymer in such a proportion that the composition contains 10-30% by weight of the rubbery polymer.
摘要翻译:通过引发65-85重量份由50-85重量%的α-甲基苯乙烯,3-20重量%的α-甲基苯乙烯组成的单体混合物(A)的引发聚合来制备具有优异的热稳定性和高耐热性的热塑性树脂 重量的甲基丙烯酸甲酯,2-20重量%的丙烯腈和0-25重量%的除α-甲基苯乙烯之外的芳族烯基化合物,在聚合过程中连续或间歇地加入2-15重量份 由丙烯腈或其与α-甲基苯乙烯以外的芳族烯基化合物的混合物组成的单体(B),同时继续进行聚合,进一步向聚合体系中加入5-25重量份的单体(C) 由除α-甲基苯乙烯以外的芳族烯基化合物或其与丙烯腈的混合物组成,并继续聚合以完成聚合,单体(A),(B)和(C) ng 100重量份。 此外,通过将由此获得的热塑性树脂与通过接枝60-30重量份的由65重量份组成的单体混合物获得的接枝共聚物来制备具有优异的热稳定性,高耐热性和高冲击强度的热塑性树脂组合物 -80重量%的芳族链烯基化合物和35-20重量%的丙烯腈,40-70重量份的二烯橡胶状聚合物的比例为组合物含有10-30重量%的橡胶状聚合物。
摘要:
A heat resistant thermoplastic resin composition comprising (a) 5 to 99% by weight of a poly(phenylene ether), (b) 95 to 1% by weight of a thermoplastic resin which is obtained by polymerizing in the absence of a rubber-like polymer a resin constituent mixture comprising an aromatic alkenyl compound, an alkenyl cyanide compound, and, if necessary, other alkenyl monomers copolymerizable with said monomers, and (c) up to 94% by weight of other styrenic resins, said thermoplastic resin (b) comprising (A) 1-50% by weight of a polymer having an alkenyl cyanide compound content of 1% by weight or more but less than 10% by weight, (B) 1-70% by weight of a polymer having an alkenyl cyanide compound content of 10% by weight or more but less than 20% by weight, (C) 5-90% by weight of a polymer having an alkenyl cyanide compound content of 20% by weight or more but less than 40% by weight, and (D) up to 70% by weight of a polymer having an alkenyl cyanide compound content of 40% by weight or more, and having a total alkenyl cyanide compound content of 10 to 40% by weight and an intrinsic viscosity of preferably 0.1- 1.5 dl/g as measured in methyl ethyl ketone at 30.degree. C. The above thermoplastic resin composition is excellent in not only heat resistance but also impact resistance, thermal stability, painting, and surface gloss of molded article.
摘要:
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
摘要:
Disclosed herein is a magnetic head in which the sliding surface is constructed of a transducing gap, a pair of soft magnetic metal films opposite to each other through the transducing gap, and a substrate holding the soft magnetic metal film. The substrate is 20-200 times as wear-resistant as the soft magnetic metal film. The magnetic head has a gap depth of 1-5 .mu.m and produces an overall high head output.
摘要:
A rotary magnetic head device utilizes a thin film magnetic head or heads having small mutual influence to external magnetic field in combination with a bulk magnetic head or heads to reduce crosstalk between recording head and reproducing head to thereby improve S/N ratio.
摘要:
A grinding machine including a grinding wheel spindle motor for rotating a grinding wheel, a workpiece spindle motor for rotating a workpiece such as a gear to be ground in mesh with the grinding wheel, and a traverse motor for moving a table supporting the workpiece spindle motor. A power detector and a comparator are connected to a driver circuit for the grinding wheel spindle motor. When a load on the grinding wheel in mesh with the workpiece is increased, such a load increase is detected by the power detector and applied to a comparator. If the load signal is in excess of a reference level, then the application of a drive signal to the traverse motor is interrupted or a speed at which the workpiece is traversed relatively to the grinding wheel is reduced.
摘要:
Amorphous alloy for magnetic head core represented by the general formula, (Fe.sub.x Co.sub.1-x).sub.a Cr.sub.b Si.sub.c -B.sub.1-a-b-c, where the value of x is 0.04-0.07, the value of a is 0.73-0.75, the value of b is 0.005-0.03, and the value of c is 0.02-0.06. The present amorphous alloy has high permeability, high saturation flux density, low magnetostriction, and low magnetic after-effect at the same time, and has distinguished characteristics for magnetic head core.
摘要:
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
摘要:
A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the semiconductor chip and the external connection terminals. The substrate is provided with joining , parts made of metal on a second surface. The heat spreading plate and the substrate are joined together by welding the joining parts and the heat spreading plate.