公开(公告)号：US09312213B2

公开(公告)日：2016-04-12

申请号：US14014300

申请日：2013-08-29

申请人： Moon Gi Cho ,  Young Lyong Kim ,  Sun-Hee Park ,  Hwan-Sik Lim

发明人： Moon Gi Cho ,  Young Lyong Kim ,  Sun-Hee Park ,  Hwan-Sik Lim

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49811 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/02331 ,  H01L2224/02351 ,  H01L2224/02372 ,  H01L2224/0345 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05025 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13008 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/14133 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05552 ,  H01L2924/00

摘要： A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion.

摘要翻译： 凸块结构可以包括与设置在基板上的焊盘间隔开的主体部分和从主体部分的侧面延伸到焊盘上的第一延伸部。 第二延伸部从主体部分的另一侧延伸。

公开(公告)号：US08497569B2

公开(公告)日：2013-07-30

申请号：US13042855

申请日：2011-03-08

申请人： Jin-Woo Park ,  Hwan-Sik Lim ,  Eunchul Ahn

发明人： Jin-Woo Park ,  Hwan-Sik Lim ,  Eunchul Ahn

IPC分类号： H01L21/311

CPC分类号： H01L21/50 ,  H01L21/563 ,  H01L23/48 ,  H01L23/58 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2924/00012

摘要： A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.

摘要翻译： 封装基板，具有该封装基板的半导体封装以及半导体封装的制造方法。 半导体封装包括半导体芯片，封装基板和模制层。 封装衬底提供安装有半导体芯片的区域。 模制层被配置成模制半导体芯片。 封装基板包括第一开口部分，该第一开口部分提供与半导体芯片电连接的开放区域，并且延伸超过半导体芯片的两侧以与半导体芯片电连接。

公开(公告)号：US20110215444A1

公开(公告)日：2011-09-08

申请号：US13042855

申请日：2011-03-08

申请人： Jin-Woo PARK ,  Hwan-Sik Lim ,  Eunchul Ahn

发明人： Jin-Woo PARK ,  Hwan-Sik Lim ,  Eunchul Ahn

IPC分类号： H01L23/58 ,  H01L23/48

CPC分类号： H01L21/50 ,  H01L21/563 ,  H01L23/48 ,  H01L23/58 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2924/00012

摘要： A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.

摘要翻译： 封装基板，具有该封装基板的半导体封装以及半导体封装的制造方法。 半导体封装包括半导体芯片，封装基板和模制层。 封装衬底提供安装有半导体芯片的区域。 模制层被配置成模制半导体芯片。 封装基板包括第一开口部分，该第一开口部分提供与半导体芯片电连接的开放区域，并且延伸超过半导体芯片的两侧以与半导体芯片电连接。

公开(公告)号：US08680685B2

公开(公告)日：2014-03-25

申请号：US12788901

申请日：2010-05-27

申请人： Hwan-Sik Lim ,  Sunwon Kang ,  Jongho Lee

发明人： Hwan-Sik Lim ,  Sunwon Kang ,  Jongho Lee

IPC分类号： H01L23/48

CPC分类号： H01L24/14 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/0603 ,  H01L2224/06515 ,  H01L2224/13025 ,  H01L2224/13028 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern.