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    Semiconductor package including heat diffusion portion
    3.
    发明授权
    Semiconductor package including heat diffusion portion 失效
    包括热扩散部分的半导体封装

    公开(公告)号：US06350952B1

    公开(公告)日：2002-02-26

    申请号：US09402400

    申请日：1999-10-05

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

    IPC分类号： H01L2328

    CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

    摘要： Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.

    摘要翻译： 公开了一种半导体塑料封装，其结构是将印刷电路板的尺寸几乎相等的金属板设置在印刷电路板的厚度方向上的中央部分。 印刷电路板的表面上的金属片和信号传导导电电路用热固性树脂组合物彼此绝缘。 印刷电路板表面上的导电电路连接到形成在印刷线路板的相对表面上的导电电路，或连接到形成为与具有导电通孔的焊球相连的导电电路板。 半导体芯片，导线和焊盘用树脂封装。 半导体塑料封装具有在相对表面上形成的至少一个盲通孔，以便直接连接到金属片。 盲孔通孔具有导热的内壁。 印刷电路板在半导体芯片安装侧设置有升高的金属部分，多个金属突起，每个金属突起均具有棱锥体或锥体的截头体形状，或至少一个通孔，其具有内部 壁呈导热性。 还公开了用于制造用于上述塑料封装的印刷电路板的方法。

    Bank note processing machine with temporary storage portion
    8.
    发明授权
    Bank note processing machine with temporary storage portion 有权
    银行票据处理机具有临时存储部分

    公开(公告)号：US07455183B2

    公开(公告)日：2008-11-25

    申请号：US11354167

    申请日：2006-02-15

    申请人： Mitsuo Nishida ,  Toshihiko Kobayashi ,  Tsuguo Mizoro ,  Toyoshige Kuroiwa ,  Kosaku Fukuda

    发明人： Mitsuo Nishida ,  Toshihiko Kobayashi ,  Tsuguo Mizoro ,  Toyoshige Kuroiwa ,  Kosaku Fukuda

    IPC分类号： B07C5/00

    CPC分类号： B65H83/025 ,  B65H31/10 ,  B65H31/20 ,  B65H31/26 ,  B65H31/36 ,  B65H2301/4223 ,  B65H2404/1114 ,  B65H2511/11 ,  B65H2701/1912 ,  G07D11/0021 ,  G07D11/0084

    摘要： An accumulating device is capable of securely accumulating sheets or the like having dimensional differences on the basis of the rear ends in the taking-in direction thereof. In this device, a stopper advances from above to an advanced position between the tip end regulating wall and the rear end regulating wall and stops the tip ends in the taking-in direction of the sheets to be taken in, whose length in the taking-in direction is shorter than a maximum length. The stopper is supported movably in the vertical direction with respect to the advancing and retreating mechanism which causes the stopper to advance and retreat between the advanced position and the retreated position, and presses the sheets in the downward direction. The stopper stops the tip ends in the taking-in direction of the sheets having dimensional differences and allows the device to accumulate those sheets.

    摘要翻译： 蓄积装置能够基于其取入方向的后端，可靠地积存具有尺寸差异的片材等。 在该装置中，止动件从上方延伸到前端限制壁和后端限制壁之间的前进位置，并且将末端沿待取入的片材的取入方向停止， 方向短于最大长度。 止动件相对于前进和后退机构在垂直方向上可移动地支撑，这使得止动件在前进位置和退避位置之间前进和后退，并且沿着向下的方向按压片材。 止动器使具有尺寸差异的片材的取入方向停止前端，并允许装置积聚这些片材。

    Developing solution for producing printed circuit boards and a process for producing printed circuit boards wherein the developing solution comprises a quaternary ammonium hydroxide and a quaternary ammonium carbonate
    10.
    发明授权
    Developing solution for producing printed circuit boards and a process for producing printed circuit boards wherein the developing solution comprises a quaternary ammonium hydroxide and a quaternary ammonium carbonate 失效
    用于生产印刷电路板的开发解决方案和用于生产印刷电路板的方法，其中显影液包含季铵氢氧化物和碳酸季铵

    公开(公告)号：US5538832A

    公开(公告)日：1996-07-23

    申请号：US347889

    申请日：1994-12-01

    申请人： Tetsuo Aoyama ,  Takeshi Nagasaka ,  Toshihiko Kobayashi ,  Naohito Yoshimura ,  Takashi Nakata ,  Youichi Takizawa

    发明人： Tetsuo Aoyama ,  Takeshi Nagasaka ,  Toshihiko Kobayashi ,  Naohito Yoshimura ,  Takashi Nakata ,  Youichi Takizawa

    IPC分类号： G03F7/32 ,  H05K3/10 ,  G03F7/30

    CPC分类号： G03F7/322 ,  H05K3/108 ,  H05K2203/122

    摘要： A developing solution comprising a specific amount of a quaternary ammonium hydroxide represented by the general formula [(R.sup.1).sub.3 N--R].sup.+ .multidot.OH.sup.- (R indicates an alkyl group having 1 to 3 carbon atoms or a hydroxy-substituted alkyl group having 1 to 3 carbon atoms, and R.sup.1 indicates an alkyl group having 1 to 3 carbon atoms) and, if necessary, a quaternary ammonium hydrogen carbonate represented by the general formula [(R.sup.1).sub.3 N--R].sup.+ .multidot.HCO.sub.3.sup.- (R and R.sup.1 are the same as the above) and having a pH in the range of 9 to 13, and a process for producing printed circuit boards using an organic alkali solution, are provided. The developing solution needs no defoaming agent because it causes little foaming. Printed circuit boards produced by using the developing solution have excellent finished accuracy. Therefore, fine circuits of printed circuit networks can be produced with stability.

    摘要翻译： 包含特定量的由通式[（R1）3N-R] + xOH-（R表示具有1至3个碳原子的烷基或具有1至3个碳原子的羟基取代的烷基）表示的季铵氢氧化物的显影液 3个碳原子，R1表示碳原子数1〜3的烷基），根据需要，由通式[（R1）3N-R] + xHCO3-（R和R1相同）表示的季铵碳酸氢盐 如上所述），pH为9〜13的范围，以及使用有机碱溶液的印刷电路板的制造方法。 开发溶液不需要消泡剂，因为它几乎不起泡。 使用显影液生产的印刷电路板具有优异的成品精度。 因此，可以稳定地制造印刷电路网络的精细电路。