公开(公告)号：US20020038509A1

公开(公告)日：2002-04-04

申请号：US09837423

申请日：2001-04-19

Applicant: NEC Corporation

Inventor： Koji Soejima ,  Naoji Senba

IPC: H05K003/36 ,  H05K003/34

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1111 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract translation: 公开了一种凸块结构，其具有中空体，用于电连接第一构件和第二构件。 还公开了一种制造凸块结构的方法，其具有以下步骤：制备具有凹模的模制板以模制凸块形成构件; 形成导电薄膜，以在模板的凹模中形成预定的空腔; 准备要传输导电薄膜的基板; 以及将形成在所述成型板上的导电性薄膜转移到所述基板。

公开(公告)号：US20020042164A1

公开(公告)日：2002-04-11

申请号：US09995722

申请日：2001-11-29

Applicant: NEC CORPORATION

Inventor： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

IPC: H01L021/48

CPC classification number: H05K3/284 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompress ion at the same time between two electronic devices. This may be repeated between three or more electronic device.

Abstract translation: 公开了一种用于密集安装电子设备的电子设备组件和连接电子设备的方法。 由金属凸块和由粘合密封树脂实现的密封部分实现的导电部分在两个电子器件之间同时通过热压相连。 这可以在三个或更多个电子设备之间重复。

公开(公告)号：US20020056922A1

公开(公告)日：2002-05-16

申请号：US10014074

申请日：2001-11-13

Applicant: NEC Corporation

Inventor： Takuo Funaya ,  Naoji Senba ,  Nobuaki Takahashi ,  Sakae Kitajyo ,  Yuzo Shimada

IPC: H01L023/48 ,  H01L021/44

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A metal layer is formed on each surface of topside substrate electrodes on a substrate. Another metal layer is formed on each surface of chip electrodes on a function element chip. Both ends of vertical coil springs are connected to the topside substrate electrodes and the chip electrodes through the metal layers, respectively. In this way, the topside substrate electrodes are connected to the chip electrodes through the vertical coil springs by means of flip hip bonding. Thereby, there is provided a semiconductor device having flip chip bonding structure, a production method thereof, a coil spring cutting jig and a coil spring guiding jig applied thereto, wherein: it is possible to prevent faulty connection caused by the thermal expansion difference between a function element device and a substrate; after a function element device and a substrate that are connected through a connection formation is separated from each other because a faulty point has been found in an electrical inspection after the tentative connection, it is possible to easily reconnect the function element device and the substrate; the configuration is simple and the packaging cost is low; and even if a high-power-consumption-type function element device is applied, it is possible to realize low thermal resistibility and high reliability of connection.

Abstract translation: 在基板上的上侧基板电极的各表面上形成金属层。 在功能元件芯片上的芯片电极的每个表面上形成另一金属层。 垂直螺旋弹簧的两端分别通过金属层连接到顶侧基板电极和芯片电极。 以这种方式，顶侧基板电极通过臀部接合通过垂直螺旋弹簧连接到芯片电极。 因此，提供了一种具有倒装芯片接合结构的半导体器件，其制造方法，螺旋弹簧切割夹具和施加在其上的螺旋弹簧引导夹具，其中：可以防止由于热膨胀差异导致的错误连接 功能元件装置和基板; 在通过连接形式连接的功能元件装置和基板彼此分离之后，由于在暂时连接之后的电气检查中发现了故障点，所以可以容易地重新连接功能元件装置和基板; 配置简单，包装成本低; 并且即使应用了高功率消耗型功能元件装置，也可以实现低耐热性和高连接可靠性。

公开(公告)号：US20010054762A1

公开(公告)日：2001-12-27

申请号：US09863077

申请日：2001-05-23

Applicant: NEC Corporation

Inventor： Takao Yamazaki ,  Naoji Senba ,  Yuzo Shimada

IPC: H01L023/34

CPC classification number: H01L23/4951 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes (a) a semiconductor chip, (b) a patterned lead composed of an electrical conductor and formed on the semiconductor chip in electrical contact with the semiconductor chip, and (c) a resin film sealing a main surface of the semiconductor chip therewith. The lead has a portion projecting beyond the main surface of the semiconductor chip.

Abstract translation: 半导体器件包括：（a）半导体芯片，（b）由电导体构成并形成在与半导体芯片电接触的半导体芯片上的图案化引线，（c）密封半导体主表面的树脂膜 与其一起。 引线具有突出超过半导体芯片的主表面的部分。