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1.发明授权
公开(公告)号：US5879568A
公开(公告)日：1999-03-09
申请号：US870379
申请日：1997-06-06
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
CPC分类号： H05K3/4655 , H05K3/0035 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H05K2201/0209 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , H05K2203/0554 , H05K3/0094 , H05K3/025 , H05K3/4652 , H05K3/4676
摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.
摘要翻译： 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。
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2.发明授权Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效使用这些清漆生产绝缘清漆和多层印刷电路板公开(公告)号：US06197149B1
公开(公告)日：2001-03-06
申请号：US09057522
申请日：1998-04-09
申请人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
发明人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
IPC分类号： C09J500
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。
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公开(公告)号：US07816430B2
公开(公告)日：2010-10-19
申请号：US10529738
申请日：2003-09-29
IPC分类号： C08K5/01 , C08K5/07 , C08L63/00 , C08L101/02
CPC分类号： C08G73/0655 , B32B15/08 , B32B2363/00 , C08G59/4014 , C08L63/00 , C08L79/04 , H05K1/0353 , C08L2666/20
摘要： The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 本发明提供一种用于工作频率超过1GHz的电子设备的印刷线路板用树脂组合物，以及使用该树脂组合物的清漆，预浸料坯和金属包覆层压板。 本发明的一个发明是含有分子中具有2个以上氰酸酯基的氰酸酯化合物和/或其预聚物的印刷线路板用树脂组合物，含有至少一种环氧树脂的环氧树脂，具有联苯 分子中的结构，以及清漆，预浸料和使用其的金属包覆层压板。
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4.发明申请Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same 有权用于印刷线路板的树脂组合物，以及使用其的消失的预浸料和覆金属层压板公开(公告)号：US20060167189A1
公开(公告)日：2006-07-27
申请号：US10529738
申请日：2003-09-29
CPC分类号： C08G73/0655 , B32B15/08 , B32B2363/00 , C08G59/4014 , C08L63/00 , C08L79/04 , H05K1/0353 , C08L2666/20
摘要： The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 本发明提供一种用于工作频率超过1GHz的电子设备的印刷线路板用树脂组合物，以及使用该树脂组合物的清漆，预浸料坯和金属包覆层压板。 本发明的一个发明是含有分子中具有2个以上氰酸酯基的氰酸酯化合物和/或其预聚物的印刷线路板用树脂组合物，含有至少一种环氧树脂的环氧树脂，具有联苯 分子中的结构，以及清漆，预浸料和使用其的金属包覆层压板。
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公开(公告)号：US06667107B2
公开(公告)日：2003-12-23
申请号：US10058919
申请日：2002-01-30
IPC分类号： B32B2730
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R2 represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1表示氢，卤素 ，或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数，（2）每分子具有至少2个氰酸酯基的氰酸酯树脂。 提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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公开(公告)号：US07078106B2
公开(公告)日：2006-07-18
申请号：US10697116
申请日：2003-10-31
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含：（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1， >表示氢，卤素或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数; 和（2）每分子具有至少两个氰酸酯基团的氰酸酯树脂; 用于提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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7.发明申请PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME 审中-公开用于电镀工艺的电镀层，用于电路板的层压板及其生产方法，以及多层电路板及其制造方法公开(公告)号：US20140151091A1
公开(公告)日：2014-06-05
申请号：US14123140
申请日：2012-05-29
申请人： Daisuke Fujimoto , Kunpei Yamada , Nobuyuki Ogawa , Hikari Murai
发明人： Daisuke Fujimoto , Kunpei Yamada , Nobuyuki Ogawa , Hikari Murai
CPC分类号： H05K1/0366 , C08L63/00 , C09D5/002 , C23C18/1653 , C23C18/1844 , C25D5/34 , C25D7/0614 , H05K1/0298 , H05K1/0373 , H05K3/007 , H05K3/4676 , H05K2201/0209 , Y10T156/1043 , Y10T428/249921
摘要： Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. Specifically disclosed are a primer layer for plating process formed of a resin composition for primer layer including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B); a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof.
摘要翻译： 公开了一种对化学镀铜表现出高粘合性且能够应对半导体封装的高密度布线的电镀工艺的底漆层; 用于具有底漆层的布线板的层压板及其制造方法; 以及具有底涂层的多层布线板及其制造方法。 具体公开了由（A）多官能环氧树脂，（B）环氧树脂固化剂和（C）含酚羟基的聚丁二烯改性的聚酰胺树脂（A）形成的用于底漆层的树脂组合物形成的电镀工艺的底漆层 具有规定的结构单元，其中，相对于成分（A）和成分（B）的总和100质量份，成分（C）的配合比例为5质量份以上且小于25质量份 ）; 用于具有底漆层的布线板的层压板及其制造方法; 以及具有底涂层的多层布线板及其制造方法。
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8.发明申请Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish 审中-公开介电性能优异的树脂组合物，其制造方法，使用该树脂组合物的清漆，使用该树脂组合物和清漆的预浸料坯和覆金属层压板公开(公告)号：US20070207326A1
公开(公告)日：2007-09-06
申请号：US11647598
申请日：2006-12-29
CPC分类号： B32B15/14 , B32B27/18 , B32B2311/12 , C08G73/0655 , C08K5/13 , C08K5/315 , C08K5/5419 , C08L79/04 , C08L83/04 , H05K1/0353 , Y10T428/31663 , C08L2666/02
摘要： A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
摘要翻译： 一种树脂组合物，其包含分子中具有2个以上的氰基的氰酸酯化合物（A） 苯酚化合物（B）; 具有选自由式RSiO 3/2 2表示的三官能硅氧烷单元和由SiO
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9.发明授权Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包覆层压板公开(公告)号：US08568891B2
公开(公告)日：2013-10-29
申请号：US13463541
申请日：2012-05-03
IPC分类号： B32B15/08
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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10.发明授权Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包覆层压板公开(公告)号：US08277948B2
公开(公告)日：2012-10-02
申请号：US12279571
申请日：2007-02-14
IPC分类号： B32B15/08
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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