公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

摘要翻译： 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

申请人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

发明人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC分类号： C09J500

CPC分类号： H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

公开(公告)号：US5689879A

公开(公告)日：1997-11-25

申请号：US357734

申请日：1994-12-16

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC分类号： H05K3/02 ,  H05K3/06 ,  H05K3/38

CPC分类号： H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

摘要翻译： 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

公开(公告)号：US5638598A

公开(公告)日：1997-06-17

申请号：US462853

申请日：1995-06-05

申请人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

发明人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC分类号： H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/0055 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.

摘要翻译： 制造布线板的方法包括在未完全固化的绝缘基板的两侧层压金属箔，然后加热压制; 在所得的层压板中钻孔以在其中连接电路; 在孔周围的狭窄区域中去除金属箔的部分，以在金属箔中形成中空部分; 并在孔和中空部分填充可流动的导电物质。

公开(公告)号：US5444189A

公开(公告)日：1995-08-22

申请号：US77722

申请日：1993-06-17

申请人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

发明人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC分类号： H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K1/00

CPC分类号： H05K1/116 ,  H05K3/0055 ,  H05K3/062 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652

摘要： A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

摘要翻译： 一种布线板，包括一个或多个内层电路基板和由所述晚餐层电路基板两侧的金属箔层经由预浸料形成的外部电路层，所述内层电路基板包括绝缘层和金属箔层， 所述绝缘层，至少一个内层电路基板或所述外电路层或两者在金属箔层中具有填充有导电物质的中空部分，所述布线板至少在中空部分中具有一个或多个通孔，并填充 与导电物质具有高可靠性和高布线密度。

公开(公告)号：US5403672A

公开(公告)日：1995-04-04

申请号：US59658

申请日：1993-05-12

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC分类号： H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  B32B15/20 ,  B32B3/30

CPC分类号： H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

摘要翻译： 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

公开(公告)号：US06281450B1

公开(公告)日：2001-08-28

申请号：US09446674

申请日：1999-12-27

申请人： Naoyuki Urasaki ,  Yasusi Simada ,  Yoshiyuki Tsuru ,  Akishi Nakaso ,  Itsuo Watanabe

发明人： Naoyuki Urasaki ,  Yasusi Simada ,  Yoshiyuki Tsuru ,  Akishi Nakaso ,  Itsuo Watanabe

IPC分类号： H01R909

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5386 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H05K1/114 ,  H05K1/189 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/09509 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.

摘要翻译： 用于使用粘合剂安装具有凸块的半导体芯片的基板，所述基板例如设置有在半导体芯片安装区域中具有开口的绝缘涂层，使得布线导体将不会暴露于靠近基板表面的基板表面 半导体芯片安装面积的边界在连接可靠性方面提高，并且具有高的批量生产率。

公开(公告)号：US08212271B2

公开(公告)日：2012-07-03

申请号：US12209544

申请日：2008-09-12

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/0753 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

摘要： A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening portion which penetrates the insulating layer and reaches the wiring circuits; and an optical reflection member, which is provided on the upper face of the base substrate, and which forms at least one depressed portion serving as an area for mounting an optical semiconductor element.

摘要翻译： 提供了一种用于安装光学半导体元件的基板，包括：具有绝缘层的基底基板和形成在绝缘层的上表面上的多个布线电路，并具有穿过绝缘层的至少一个外部连接端子形成开口部分 并到达布线电路; 以及光反射构件，其设置在基底基板的上表面上，并且形成用作安装光半导体元件的区域的至少一个凹部。

公开(公告)号：US08637593B2

公开(公告)日：2014-01-28

申请号：US12805445

申请日：2010-07-30

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： B29C35/02 ,  B29C39/36 ,  B29C39/38 ,  C08G63/00 ,  C08K3/22 ,  C08K7/28 ,  C08L63/00 ,  C08L63/06 ,  H01L23/06 ,  F21V7/22

CPC分类号： C07D307/89 ,  C07D307/77 ,  C08G59/4246 ,  C08G69/26 ,  C08K3/013 ,  C08K3/18 ,  C08K3/2279 ,  C08K3/38 ,  C08K7/26 ,  C08K7/28 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08L63/00 ,  C08L63/04 ,  C08L63/06 ,  C08L67/02 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  C08L2666/18 ,  C08L2666/22 ,  H01L2924/00014

摘要： The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

摘要翻译： 本发明的环氧树脂成型材料包含（A）环氧树脂和（B）固化剂，其中（B）固化剂含有多价羧酸缩合物。 本发明的热固性树脂组合物包含（A）环氧树脂和（B）固化剂，其中（B）固化剂在150℃下的粘度为1.0-1000mPa·s，用ICI 锥板布鲁克菲尔德粘度计。

公开(公告)号：US08585272B2

公开(公告)日：2013-11-19

申请号：US12735355

申请日：2009-01-09

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： C08G63/00 ,  C08K3/22 ,  C08K7/28 ,  C08L63/00 ,  C08L63/06 ,  F21V7/22 ,  H01L23/06 ,  B29C35/02 ,  B29C39/36 ,  B29C39/38

CPC分类号： C08G59/4215 ,  C08L63/00 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.