公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

摘要翻译： 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

申请人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

发明人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC分类号： C09J500

CPC分类号： H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

公开(公告)号：US5690837A

公开(公告)日：1997-11-25

申请号：US576488

申请日：1995-12-21

申请人： Akishi Nakaso ,  Koichi Tsuyama ,  Kazuhisa Otsuka ,  Haruo Ogino ,  Yoshihiro Tamura ,  Teiichi Inada ,  Kazunori Yamamoto ,  Akinari Kida ,  Atsushi Takahashi ,  Yoshiyuki Tsuru ,  Shigeharu Arike

发明人： Akishi Nakaso ,  Koichi Tsuyama ,  Kazuhisa Otsuka ,  Haruo Ogino ,  Yoshihiro Tamura ,  Teiichi Inada ,  Kazunori Yamamoto ,  Akinari Kida ,  Atsushi Takahashi ,  Yoshiyuki Tsuru ,  Shigeharu Arike

IPC分类号： H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/4652 ,  H05K3/0055 ,  H05K2201/0209 ,  H05K2203/063 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K3/025 ,  H05K3/381

摘要： In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.

摘要翻译： 在制造多层印刷电路板的方法中，该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔，将所得薄膜材料层叠在内层电路基板上，电连接 具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时，或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料 进一步层压在内层电路基板和膜材料的层压体上，提高了电连接的可靠性，并且通过简单的步骤可以提高电路密度。

公开(公告)号：US20090274581A1

公开(公告)日：2009-11-05

申请号：US12501056

申请日：2009-07-10

申请人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

发明人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

IPC分类号： B01L3/00

CPC分类号： B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

摘要： A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

公开(公告)号：US20080010819A1

公开(公告)日：2008-01-17

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/30

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US08865090B2

公开(公告)日：2014-10-21

申请号：US12501078

申请日：2009-07-10

申请人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

发明人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

IPC分类号： B01L3/00 ,  B01L99/00 ,  B01J19/00 ,  B81C1/00

CPC分类号： B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

摘要： A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

公开(公告)号：US20080289868A1

公开(公告)日：2008-11-27

申请号：US12182908

申请日：2008-07-30

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K1/11 ,  H05K1/16

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

公开(公告)号：US20060162956A1

公开(公告)日：2006-07-27

申请号：US10500119

申请日：2002-12-24

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsduya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsduya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US08889084B2

公开(公告)日：2014-11-18

申请号：US12496212

申请日：2009-07-01

申请人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

发明人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

IPC分类号： B01L3/00 ,  B01L99/00 ,  B01J19/00 ,  B81C1/00

CPC分类号： B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

摘要： A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

摘要翻译： 用于微流体系统的支撑单元包括第一支撑件; 设置在所述第一支撑体的表面上的第一粘合剂层; 以及放置在第一粘合剂层的表面上以具有任意形状并用作微流体系统的流路层的中空丝。

公开(公告)号：US08028402B2

公开(公告)日：2011-10-04

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/36 ,  H01R9/00 ,  H01K3/10

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

摘要翻译： 公开了一种多层布线板的制造方法，该方法包括：准备连接板，连接板分别具有绝缘树脂组合物层，形成为穿过绝缘树脂组合物层的连接导体和导体电路 形成在绝缘树脂组合物层上并连接到连接导体; 对准连接板; 并且通过加热和压制层叠对准的连接板，使得连接导体或连接导体和导体电路彼此导电连接，并且连接板通过绝缘树脂组合物层彼此机械连接。 连接板通过特定的加工形成，包括使用三层复合金属层。