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1.发明授权
公开(公告)号：US5879568A
公开(公告)日：1999-03-09
申请号：US870379
申请日：1997-06-06
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
CPC分类号： H05K3/4655 , H05K3/0035 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H05K2201/0209 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , H05K2203/0554 , H05K3/0094 , H05K3/025 , H05K3/4652 , H05K3/4676
摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.
摘要翻译： 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。
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公开(公告)号：US5690837A
公开(公告)日：1997-11-25
申请号：US576488
申请日：1995-12-21
申请人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
发明人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
CPC分类号： H05K3/4652 , H05K3/0055 , H05K2201/0209 , H05K2203/063 , H05K2203/0773 , H05K2203/0789 , H05K2203/0793 , H05K2203/0796 , H05K3/025 , H05K3/381
摘要： In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
摘要翻译： 在制造多层印刷电路板的方法中，该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔，将所得薄膜材料层叠在内层电路基板上，电连接 具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时，或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料 进一步层压在内层电路基板和膜材料的层压体上，提高了电连接的可靠性，并且通过简单的步骤可以提高电路密度。
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公开(公告)号：US06281450B1
公开(公告)日：2001-08-28
申请号：US09446674
申请日：1999-12-27
IPC分类号： H01R909
CPC分类号： H01L24/32 , H01L21/563 , H01L23/49838 , H01L23/49894 , H01L23/5386 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/12042 , H01L2924/15192 , H05K1/114 , H05K1/189 , H05K3/28 , H05K3/323 , H05K2201/09509 , H05K2201/10674 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.
摘要翻译： 用于使用粘合剂安装具有凸块的半导体芯片的基板，所述基板例如设置有在半导体芯片安装区域中具有开口的绝缘涂层，使得布线导体将不会暴露于靠近基板表面的基板表面 半导体芯片安装面积的边界在连接可靠性方面提高，并且具有高的批量生产率。
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公开(公告)号：US06184577B2
公开(公告)日：2001-02-06
申请号：US09308525
申请日：1999-08-30
申请人： Kenzo Takemura , Itsuo Watanabe , Akira Nagai , Osamu Watanabe , Kazuyoshi Kojima , Akishi Nakaso , Kazunori Yamamoto , Yoshiyuki Tsuru , Teiichi Inada , Yasushi Shimada
发明人： Kenzo Takemura , Itsuo Watanabe , Akira Nagai , Osamu Watanabe , Kazuyoshi Kojima , Akishi Nakaso , Kazunori Yamamoto , Yoshiyuki Tsuru , Teiichi Inada , Yasushi Shimada
IPC分类号： H01L2363
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/145 , H01L23/5383 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07811 , H01L2924/1301 , H01L2924/13034 , H05K3/323 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0133 , H05K2201/068 , H05K2201/10674 , H01L2924/00 , H01L2924/00014
摘要： In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.
摘要翻译： 对于其上安装有半导体芯片的封装基板，双面覆铜玻璃环氧树脂层压片的表面铜箔进行电路形成和内层结合，然后将具有铜的环氧树脂粘合膜 箔通过压力叠层结合到内层电路的表面，并且通过片形成通孔，接着进行无电镀铜，通过减法处理形成外层电路，并获得焊料涂层以获得封装基板 。 半导体芯片的凸起电极和封装基板通过粘合膜连接。
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公开(公告)号：US4548644A
公开(公告)日：1985-10-22
申请号：US535057
申请日：1983-09-23
CPC分类号： C23C18/40
摘要： An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.
摘要翻译： 一种无电解铜沉积溶液，其包含（a）铜离子，铜离子络合剂，还原剂和pH调节剂，（b）聚氧乙烯醚和（c）至少一种选自无机 氰化物和α，α'-二吡啶基可以产生具有高伸长率的沉积膜。
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公开(公告)号：US6042685A
公开(公告)日：2000-03-28
申请号：US192213
申请日：1998-11-16
IPC分类号： C09J163/00 , C09J179/08 , H05K1/00 , H05K3/10 , H05K3/38 , H05K3/42 , H05K3/46 , H05K3/00
CPC分类号： H05K3/4626 , H05K3/429 , H05K2201/0154 , H05K2201/09536 , H05K2201/10287 , H05K3/103 , H05K3/386 , H05K3/4623 , H05K3/4676 , Y10S428/901 , Y10T29/49144 , Y10T428/24322 , Y10T428/24843 , Y10T428/2495 , Y10T428/287 , Y10T428/2887
摘要： A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.
摘要翻译： 包括印刷导体电路层的多线印刷电路板，具有嵌入并固定其中的绝缘涂层的线的粘合剂层，绝缘层和形成在连接处的连接通孔，其中导体电路层与其它绝缘层绝缘 电路导体，并且每个粘合剂层和相邻的绝缘层之间的玻璃化转变点的差异在60℃的范围内，尽管热历史施加到板上仍然没有剥离和空隙，并且能够高密度 布线，电路层的乘法和制造步骤的数量的减少。
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公开(公告)号：US5562971A
公开(公告)日：1996-10-08
申请号：US418443
申请日：1995-04-07
IPC分类号： H01L21/48 , H01L23/14 , H01L23/498 , H01L23/538 , H05K1/00 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4688 , H01L21/4857 , H01L23/145 , H01L23/49822 , H01L23/5383 , H01L24/49 , H05K3/4623 , H05K3/4626 , H05K3/4697 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1579 , H05K2201/0154 , H05K3/4676
摘要： A multilayer printed wiring board comprising a plurality of interlaminar insulating layers, a plurality of insulating circuit boards having circuits formed on the insulating substrates, and via holes for making electrical connection between two or more layers of circuits, wherein the difference between the glass transition point of an interlaminar insulating layer and that of the adjoining insulating substrate is not greater than 60.degree. C., is proof against exfoliation due to heat history of the board and has high reliability of insulation and through-hole connection.
摘要翻译： 一种多层印刷电路板，包括多个层间绝缘层，多个绝缘电路板，其上形成有绝缘基板上的电路，以及用于在两层或多层电路之间进行电连接的通孔，其中玻璃化转变点 的层间绝缘层和相邻绝缘基板的绝缘层不大于60℃，防止由于板的热历史而导致的剥离，并且具有高的绝缘和通孔连接的可靠性。
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公开(公告)号：US5928757A
公开(公告)日：1999-07-27
申请号：US653468
申请日：1996-05-24
IPC分类号： C09J163/00 , C09J179/08 , H05K1/00 , H05K3/10 , H05K3/38 , H05K3/42 , H05K3/46 , B32B3/10
CPC分类号： H05K3/4626 , H05K3/429 , H05K2201/0154 , H05K2201/09536 , H05K2201/10287 , H05K3/103 , H05K3/386 , H05K3/4623 , H05K3/4676 , Y10S428/901 , Y10T29/49144 , Y10T428/24322 , Y10T428/24843 , Y10T428/2495 , Y10T428/287 , Y10T428/2887
摘要： A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.
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公开(公告)号：US5688408A
公开(公告)日：1997-11-18
申请号：US674876
申请日：1996-07-02
IPC分类号： H01L21/48 , H01L23/14 , H01L23/498 , H01L23/538 , H05K1/00 , H05K3/46 , B44C1/22
CPC分类号： H05K3/4688 , H01L21/4857 , H01L23/145 , H01L23/49822 , H01L23/5383 , H01L24/49 , H05K3/4623 , H05K3/4626 , H05K3/4697 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1579 , H05K2201/0154 , H05K3/4676
摘要： A process for forming a multilayer printed wiring board comprising integrally laminating a plurality of insulating circuit boards having circuits formed on insulating substrates and interlaminar insulating layers sandwiched between adjacent insulating circuit boards, and forming via holes for making electrical connection between two or more layers of circuits. Where the difference between the glass transition point of an interlaminar insulating layer and that of the adjoining insulating substrate is not greater than 60.degree. C., proof against exfoliation due to heat history of the board and high reliability of insulation and through-hole connection is achieved. The interlaminar insulating layers desirably are B-staged and have a B-stage resin flow of less than 1%.
摘要翻译： 一种多层印刷电路板的制造方法，其特征在于，在绝缘性基板上形成有多个绝缘电路基板和夹在相邻的绝缘电路基板之间的层间绝缘层的绝缘电路基板一体层叠，形成用于在两层以上电路之间进行电连接的通孔 。 当层间绝缘层的玻璃化转变点与相邻的绝缘基板的玻璃化转变点之间的差不大于60℃时，由于板的热历史和由于绝缘和通孔连接的高可靠性而导致的剥离， 实现了 层间绝缘层理想地为B阶段，B阶树脂流量小于1％。
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公开(公告)号：US20060127832A1
公开(公告)日：2006-06-15
申请号：US10540508
申请日：2003-11-21
IPC分类号： F23D3/40
CPC分类号： F23C13/00 , F23C2900/9901 , F23D14/58
摘要： A hydrogen combustion device includes a casing 30, a hydrogen source, a hydrogen pipe 39 to supply hydrogen gas from the hydrogen source into the casing 30, a mixer 10 on the downstream side of the pipe 39, for stirring a mixed gas and a combustion catalyst 20. The hydrogen pipe 39 has a hydrogen pipe body 40 and a hydrogen ejecting part 41 with hydrogen ejecting orifices 42. In the hydrogen combustion device, the hydrogen ejecting part 41 is positioned at a substantial center in the cross section of an air passage in the casing 30, extending along the flowing direction of the airflow in the air passage. The hydrogen ejecting orifices 40 are arranged so that their axes extend in the radial direction of the hydrogen ejecting part 41, substantially perpendicularly to the flowing direction of the airflow.
摘要翻译： 氢燃烧装置包括壳体30，氢源，从氢源向壳体30供给氢气的氢管39，在管39的下游侧的混合器10，用于搅拌混合气体和燃烧 催化剂20。 氢管39具有氢管主体40和具有氢喷射孔42的氢喷射部41。 在氢燃烧装置中，氢气喷射部41位于壳体30的空气通路的截面中的大致中央，沿空气通路内的气流的流动方向延伸。 氢喷射孔40被布置成使得它们的轴线大致垂直于气流的流动方向在氢喷射部分41的径向方向上延伸。
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