公开(公告)号：US06861013B2

公开(公告)日：2005-03-01

申请号：US10239721

申请日：2001-04-09

申请人： Nobuki Tanaka ,  Hikaru Okubo ,  Ryuichi Murayama ,  Kazuto Onami ,  Tomohiro Kagimoto

发明人： Nobuki Tanaka ,  Hikaru Okubo ,  Ryuichi Murayama ,  Kazuto Onami ,  Tomohiro Kagimoto

IPC分类号： C08F2/44 ,  C08F279/02 ,  C08F283/12 ,  C08F290/06 ,  C08L51/04 ,  C09J4/00 ,  C09J151/04 ,  H01L21/56 ,  H01L23/48 ,  C08L63/00

CPC分类号： C09J4/00 ,  C08F2/44 ,  C08F279/02 ,  C08F283/12 ,  C08F290/06 ,  C08L51/04 ,  C08L2666/02 ,  C08L2666/04 ,  C09J151/04 ,  H01L21/563 ,  H01L24/29 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/351 ,  C08F220/00 ,  H01L2924/00

摘要： The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components: (A) a hydrocarbon having a number-average molecular weight of 500 to 5,000 and at least one double bond in the molecule, or its derivative, (B) a reactive diluent, (C) a radical polymerization catalyst, and (D) a filler.

摘要翻译： 本发明提供一种用于半导体芯片的接合的焊料耐龟裂性优异的管芯贴附膏。 本发明涉及包含作为必要成分的芯片贴附膏体：（A）数均分子量为500〜5000且分子中至少有一个双键的烃或其衍生物，（B）反应性 稀释剂，（C）自由基聚合催化剂和（D）填料。

公开(公告)号：US20130158188A1

公开(公告)日：2013-06-20

申请号：US13820627

申请日：2011-09-07

申请人： Takashi Kawana ,  Naoya Kanamori ,  Ryuichi Murayama

发明人： Takashi Kawana ,  Naoya Kanamori ,  Ryuichi Murayama

IPC分类号： H01L23/29 ,  C08F32/04

CPC分类号： H01L23/295 ,  C08F32/04 ,  C08F222/40 ,  C09D4/00 ,  C09D135/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00 ,  C08F2222/404 ,  C08F222/26

摘要： A resin composition of the present invention includes a maleimide derivative (A) represented by a general formula (1) and a bis-maleimide compound (B) represented by a general formula (2). In the general formula (1), R1 represents a straight chain or branched alkylene group having 1 or more carbon atoms, R2 represents a straight chain or branched alkyl group having 5 or more carbon atoms, and the sum of carbon atoms of R1 and R2 is 10 or less. In the general formula (2), X1 represents —O—, —COO—, or -—OCOO—R3, represents a straight chain or branched alkylene group having 1 to 5 carbon atoms, R4 represents a straight chain or branched alkylene group having 3 to 6 carbon atoms, and m is an integer of 1 or more and 50 or less.

摘要翻译： 本发明的树脂组合物包括由通式（1）表示的马来酰亚胺衍生物（A）和由通式（2）表示的双马来酰亚胺化合物（B）。 在通式（1）中，R 1表示具有1个以上碳原子的直链或支链亚烷基，R2表示碳原子数为5以上的直链或支链烷基，R1和R2的碳原子数之和 为10以下。 在通式（2）中，X 1表示-O - ， - COO-或-OCOO-R 3，表示具有1〜5个碳原子的直链或支链亚烷基，R4表示直链或支链亚烷基， 3〜6个碳原子，m为1以上且50以下的整数。

公开(公告)号：US08754178B2

公开(公告)日：2014-06-17

申请号：US13820627

申请日：2011-09-07

申请人： Takashi Kawana ,  Naoya Kanamori ,  Ryuichi Murayama

发明人： Takashi Kawana ,  Naoya Kanamori ,  Ryuichi Murayama

IPC分类号： C08F220/70 ,  C08F222/40

CPC分类号： H01L23/295 ,  C08F32/04 ,  C08F222/40 ,  C09D4/00 ,  C09D135/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00 ,  C08F2222/404 ,  C08F222/26

摘要： A resin composition of the present invention includes a maleimide derivative (A) represented by a general formula (1) and a bis-maleimide compound (B) represented by a general formula (2). In the general formula (1), R1 represents a straight chain or branched alkylene group having 1 or more carbon atoms, R2 represents a straight chain or branched alkyl group having 5 or more carbon atoms, and the sum of carbon atoms of R1 and R2 is 10 or less. In the general formula (2), X1 represents —O—, —COO—, or —OCOO—, R3 represents a straight chain or branched alkylene group having 1 to 5 carbon atoms, R4 represents a straight chain or branched alkylene group having 3 to 6 carbon atoms, and m is an integer of 1 or more and 50 or less.

摘要翻译： 本发明的树脂组合物包括由通式（1）表示的马来酰亚胺衍生物（A）和由通式（2）表示的双马来酰亚胺化合物（B）。 在通式（1）中，R 1表示具有1个以上碳原子的直链或支链亚烷基，R2表示碳原子数为5以上的直链或支链烷基，R1和R2的碳原子数之和 为10以下。 在通式（2）中，X 1表示-O-，-COO-或-OCOO-，R 3表示碳原子数1〜5的直链或支链亚烷基，R 4表示具有3个碳原子的直链或支链亚烷基 至6个碳原子，m为1以上且50以下的整数。

公开(公告)号：US20140183715A1

公开(公告)日：2014-07-03

申请号：US14119259

申请日：2012-05-29

申请人： Naoya Kanamori ,  Takahiro Harada ,  Chiaki Aoki ,  Ryuichi Murayama

发明人： Naoya Kanamori ,  Takahiro Harada ,  Chiaki Aoki ,  Ryuichi Murayama

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L23/49513 ,  C09J7/35 ,  C09J11/04 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to the present invention, a semiconductor device having superior electrical conductivity is provided. The semiconductor device of the present invention is provided with a base material, a semiconductor element, and an adhesive layer that adheres the base material and the semiconductor element while interposed there between. In the adhesive layer of the semiconductor device, a metal particle and an insulating particle are dispersed, and the metal particle has flaked shape or ellipsoidal/spherical shape. As the content percentage by volume of the metal particle in the adhesive layer is a and the content percentage by volume of the insulating particles in the adhesive layer is b, the content percentage (a+b) by volume of fillers in the adhesive layer is 0.20 or more and 0.50 or less and the content percentage a/(a+b) by volume of the metal particles in the fillers is 0.03 or more and 0.70 or less.

摘要翻译： 根据本发明，提供了具有优异导电性的半导体器件。 本发明的半导体器件设置有基底材料，半导体元件和粘合层，所述基底材料和半导体元件在其之间插入其间。 在半导体器件的粘合剂层中，分散有金属粒子和绝缘粒子，金属粒子呈片状或椭圆形/球形。 由于粘合剂层中的金属粒子的含有率为a，粘合剂层中的绝缘粒子的含有量的体积百分比为b，所以粘合剂层中的填料的含有率（a + b） 0.20以上且0.50以下，填料中的金属粒子的体积比a /（a + b）为0.03以上且0.70以下。

公开(公告)号：US20130289166A1

公开(公告)日：2013-10-31

申请号：US13976546

申请日：2012-01-31

申请人： Kouji Makihara ,  Ryuichi Murayama

发明人： Kouji Makihara ,  Ryuichi Murayama

IPC分类号： H01L23/00

CPC分类号： H01L24/04 ,  C08K2003/0812 ,  C08L9/00 ,  C08L13/00 ,  C08L15/00 ,  H01L23/293 ,  H01L23/3737 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  C08L33/068

摘要： The invention provides a resin composition that is excellent in terms of coating workability and can supply reliability, including the soldering reflow resistance, to a semiconductor device when being used as a die attach material or an adhesive for a heat dissipation member. The resin composition of the invention contains a polymer or copolymer of a conjugated diene compound having at least one functional group, a thermosetting resin and a (meth)acryl polymer or copolymer having a reactive functional group that can react with other reactive groups.

摘要翻译： 本发明提供一种树脂组合物，其在涂布加工性方面优异，并且当用作芯片附着材料或用于散热构件的粘合剂时，可以向半导体器件提供包括耐焊接回流电阻的可靠性。 本发明的树脂组合物含有具有至少一个官能团的共轭二烯化合物的聚合物或共聚物，热固性树脂和具有可与其它反应性基团反应的反应性官能团的（甲基）丙烯酸聚合物或共聚物。

公开(公告)号：US20130143983A1

公开(公告)日：2013-06-06

申请号：US13817351

申请日：2011-09-27

申请人： Kouji Makihara ,  Ryuichi Murayama

发明人： Kouji Makihara ,  Ryuichi Murayama

IPC分类号： C09J163/00 ,  C09J151/00

CPC分类号： C09J163/00 ,  C08F8/14 ,  C08F20/10 ,  C08F220/18 ,  C08F285/00 ,  C08F290/046 ,  C08F2220/1875 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2230/085 ,  C08L51/04 ,  C08L2203/20 ,  C08L2312/00 ,  C08L2312/08 ,  C09J133/08 ,  C09J133/10 ,  C09J133/14 ,  C09J151/003 ,  C23C18/1233 ,  C23C18/1639 ,  H01L23/291 ,  H01L23/293 ,  H01L2924/0002 ,  C08F2220/1808 ,  C08F2220/1858 ,  C08F220/06 ,  C08F222/1006 ,  C08F230/08 ,  H01L2924/00

摘要： According to the invention, a liquid resin composition which has favorable wet spreadability after mounting of a chip and exhibits excellent solder cracking resistance even in a high-temperature solder reflow process at about 260° C., i.e., even when being used in lead-free solder, and a semiconductor package using the liquid resin composition are provided. In the liquid resin composition of the invention, an acrylic copolymer having a radical polymerizable functional group contains alkyl(meth)acrylate as a constituent monomer having a linear or branched alkyl group having 6 to 9 carbon atoms in an amount of 10 wt % to 40 wt % of the entire constituent monomers.

摘要翻译： 根据本发明，液晶树脂组合物在芯片安装之后具有良好的湿扩散性，并且即使在高温焊料回流工艺中也能在约260℃下即使在铅 - 提供了无铅焊料和使用液态树脂组合物的半导体封装。 在本发明的液状树脂组合物中，具有自由基聚合性官能团的丙烯酸共聚物含有（甲基）丙烯酸烷基酯作为具有6〜9个碳原子的直链或支链烷基的构成单体，其量为10重量％〜40 wt％的整个构成单体。

公开(公告)号：US09379051B2

公开(公告)日：2016-06-28

申请号：US14119732

申请日：2012-05-24

申请人： Yasuo Shimobe ,  Ryuichi Murayama ,  Keiji Mitote

发明人： Yasuo Shimobe ,  Ryuichi Murayama ,  Keiji Mitote

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  C09J9/00 ,  C09J11/04 ,  H01L23/367 ,  H01L23/498 ,  C08K3/08 ,  H01L23/373 ,  H01L21/683

CPC分类号： H01L23/49579 ,  C08K3/08 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/49513 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29386 ,  H01L2224/29439 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/32245 ,  H01L2224/3226 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2924/01014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device (10) of the present invention includes: a base material (die pad) (2), a semiconductor element (3), and an adhesive layer (1) intervening the space between the base material and the semiconductor element (3) to adhere the base material and the semiconductor element. Thermal conductive filler (8) is contained in the adhesive layer (1), and when the content of the thermal conductive filler dispersed in the whole of the adhesive layer is expressed as C, the content of the thermal conductive filler in the region 1 ranging from the interface of the adhesive layer at the side of the semiconductor element to the depth by 2 μm is expressed as C1, and the content of the thermal conductive filler in the region 2 ranging from the interface of the adhesive layer at the side of the base material to the depth by 2 μm is expressed as C2, the following formulae are satisfied: C1

摘要翻译： 根据本发明，提供了具有良好产率的半导体。 本发明的半导体器件（10）包括：基材（芯片焊盘）（2），半导体元件（3）和介于基材和半导体元件（3）之间的空间的粘合剂层（1） ）以粘附基材和半导体元件。 导热填料（8）包含在粘合剂层（1）中，并且当分散在整个粘合剂层中的导热填料的含量表示为C时，区域1中的导热填料的含量范围 从半导体元件侧的粘合剂层的界面到深度为2μm的面积表示为C1，并且区域2中的导热填料的含量在粘合层的界面处 基底材料深度为2μm，表示为C2，满足下列公式：C1

公开(公告)号：US20150194376A1

公开(公告)日：2015-07-09

申请号：US14119732

申请日：2012-05-24

申请人： Yasuo Shimobe ,  Ryuichi Murayama ,  Keiji Mitote

发明人： Yasuo Shimobe ,  Ryuichi Murayama ,  Keiji Mitote

IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L23/367

CPC分类号： H01L23/49579 ,  C08K3/08 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/49513 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29386 ,  H01L2224/29439 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/32245 ,  H01L2224/3226 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2924/01014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device (10) of the present invention includes: a base material (die pad) (2), a semiconductor element(3), and an adhesive layer(1) intervening the space between the base material and the semiconductor element (3) to adhere the base material and the semiconductor element. Thermal conductive filler (8) is contained in the adhesive layer (1), and when the content of the thermal conductive filler dispersed in the whole of the adhesive layer is expressed as C, the content of the thermal conductive filler in the region 1 ranging from the interface of the adhesive layer at the side of the semiconductor element to the depth by 2 μm is expressed as C1, and the content of the thermal conductive filler in the region 2 ranging from the interface of the adhesive layer at the side of the base material to the depth by 2 μm is expressed as C2, the following formulae are satisfied: C1

摘要翻译： 根据本发明，提供了具有良好产率的半导体。 本发明的半导体器件（10）包括：基材（芯片焊盘）（2），半导体元件（3）和介于基材和半导体元件（3）之间的空间的粘合剂层（1） ）以粘附基材和半导体元件。 导热填料（8）包含在粘合剂层（1）中，并且当分散在整个粘合剂层中的导热填料的含量表示为C时，区域1中的导热填料的含量范围 从半导体元件侧的粘合剂层的界面到深度为2μm的面积表示为C1，并且区域2中的导热填料的含量在粘合层的界面处 基底材料深度为2μm，表示为C2，满足下列公式：C1

公开(公告)号：US20140341242A1

公开(公告)日：2014-11-20

申请号：US14117258

申请日：2012-05-28

申请人： Ryuichi Murayama ,  Yasuo Shimobe ,  Naoya Kanamori

发明人： Ryuichi Murayama ,  Yasuo Shimobe ,  Naoya Kanamori

IPC分类号： C09J9/02 ,  C09J11/04 ,  H01S5/022 ,  H01L33/62 ,  H01L33/64

CPC分类号： C09J9/02 ,  C08K3/10 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15747 ,  H01S5/0226 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d95 in the volume-based particle size distribution of the metal particles as determined with a flow-type particle image analyzer is 10 μm or less. In other words, the volume ratio of metal particles having a particle diameter that exceeds 10 μm is less than 5%. Here, d95 indicates the particle diameter at which the cumulative volume ratio thereof is 95%.

摘要翻译： 根据本发明，提供了具有优异的加工性的树脂组合物。 本发明的糊状树脂组合物粘附半导体元件和基材，并且含有（A）热固性树脂和（B）金属颗粒。 以流动型粒子图像分析仪测定的金属粒子的体积粒径分布中的d95为10μm以下。 换句话说，粒径超过10μm的金属粒子的体积比小于5％。 这里，d95表示其累积体积比为95％的粒径。

公开(公告)号：US08722768B2

公开(公告)日：2014-05-13

申请号：US13817351

申请日：2011-09-26

申请人： Kouji Makihara ,  Ryuichi Murayama

发明人： Kouji Makihara ,  Ryuichi Murayama

IPC分类号： C09J163/00 ,  C08F20/10 ,  H01L21/52 ,  C08J5/12 ,  C09J133/08 ,  C23C18/00 ,  C09J151/00 ,  C23C18/12 ,  C23C18/16 ,  C09J133/10

CPC分类号： C09J163/00 ,  C08F8/14 ,  C08F20/10 ,  C08F220/18 ,  C08F285/00 ,  C08F290/046 ,  C08F2220/1875 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2230/085 ,  C08L51/04 ,  C08L2203/20 ,  C08L2312/00 ,  C08L2312/08 ,  C09J133/08 ,  C09J133/10 ,  C09J133/14 ,  C09J151/003 ,  C23C18/1233 ,  C23C18/1639 ,  H01L23/291 ,  H01L23/293 ,  H01L2924/0002 ,  C08F2220/1808 ,  C08F2220/1858 ,  C08F220/06 ,  C08F222/1006 ,  C08F230/08 ,  H01L2924/00

摘要： According to the invention, a liquid resin composition which has favorable wet spreadability after mounting of a chip and exhibits excellent solder cracking resistance even in a high-temperature solder reflow process at about 260° C., i.e., even when being used in lead-free solder, and a semiconductor package using the liquid resin composition are provided. In the liquid resin composition of the invention, an acrylic copolymer having a radical polymerizable functional group contains alkyl(meth)acrylate as a constituent monomer having a linear or branched alkyl group having 6 to 9 carbon atoms in an amount of 10 wt % to 40 wt % of the entire constituent monomers.

摘要翻译： 根据本发明，液晶树脂组合物在芯片安装之后具有良好的湿扩散性，并且即使在高温焊料回流工艺中也能在约260℃下即使在铅 - 提供了无铅焊料和使用液态树脂组合物的半导体封装。 在本发明的液状树脂组合物中，具有自由基聚合性官能团的丙烯酸共聚物含有（甲基）丙烯酸烷基酯作为具有6〜9个碳原子的直链或支链烷基的构成单体，其量为10重量％〜40 wt％的整个构成单体。