公开(公告)号：US06881611B1

公开(公告)日：2005-04-19

申请号：US09635124

申请日：2000-08-08

申请人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

发明人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

IPC分类号： B29C43/18 ,  H01L21/301 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L29/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  B29C43/18 ,  B29C2043/3444 ,  B29C2043/3628 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/566 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/0657 ,  H01L2221/68377 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1005 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

摘要翻译： 一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得 形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序 与树脂层13一起切割基板16，使得半导体元件11彼此分离。

公开(公告)号：US5747874A

公开(公告)日：1998-05-05

申请号：US529784

申请日：1995-09-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/02

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装有半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US6022759A

公开(公告)日：2000-02-08

申请号：US25327

申请日：1998-02-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L21/44 ,  H01L21/58

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US5703398A

公开(公告)日：1997-12-30

申请号：US667326

申请日：1996-06-20

申请人： Michio Sono ,  Kazuto Tsuji ,  Hideharu Sakoda ,  Yoshimi Suzuki ,  Masao Sakuma

发明人： Michio Sono ,  Kazuto Tsuji ,  Hideharu Sakoda ,  Yoshimi Suzuki ,  Masao Sakuma

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/433 ,  H01L23/50 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181

摘要： A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.

摘要翻译： 一种半导体集成电路器件，包括：半导体芯片，其由半导体芯片电连接的引线，与半导体芯片电连接的引线，设置在半导体芯片的第一和第二侧上的第一和第二散热构件，以及完全密封半导体芯片的树脂封装体， 部分地密封引线和第一和第二散热构件。

公开(公告)号：US4392024A

公开(公告)日：1983-07-05

申请号：US328451

申请日：1981-12-08

申请人： Tsuyoshi Shinoi ,  Keisuke Mochizuki ,  Yoshimi Suzuki ,  Masaru Kudoh ,  Wataru Hashimoto

发明人： Tsuyoshi Shinoi ,  Keisuke Mochizuki ,  Yoshimi Suzuki ,  Masaru Kudoh ,  Wataru Hashimoto

IPC分类号： H04Q3/58 ,  H04M9/00 ,  H04M1/23 ,  H04M1/72

CPC分类号： H04M9/007

摘要： An electronic key telephone set in an electronic key telephone system which is connected to the office line during the power failure by a power failure detecting relay in the key service unit having a common selection signal sender is provided with a circuit for detecting power failure to the key telephone system, additional contacts to respective keys of the key dial and a selection signal generator coupled with the additional contacts. The selection signal generator is connected to the voice signal pair line by a transistor which is turned on by a signal from the power failure detecting circuit during the power failure, and receives a D.C. power on the office line to be operable, so that a call may be generated from the key telephone set even during the power failure to the key telephone system. The signal from the power failure detecting circuit is fed to the transistor through a photo-coupler element.

摘要翻译： 在具有公共选择信号发送器的密钥服务单元中的电源故障检测中继电源故障期间连接到办公室线路的电子钥匙电话机设置有用于检测电力故障的电路 钥匙电话系统，按键拨盘的相应键的附加触点和与附加触点耦合的选择信号发生器。 选择信号发生器通过晶体管连接到语音信号对线路，该晶体管在电源故障期间由来自电源故障检测电路的信号接通，并且在办公室线路上接收可操作的DC电力，使得呼叫 即使在关机电话系统的电源故障期间也可以从密钥电话机生成。 来自电源故障检测电路的信号通过光电耦合器元件馈送到晶体管。

公开(公告)号：US08862018B2

公开(公告)日：2014-10-14

申请号：US13400925

申请日：2012-02-21

申请人： Kazushi Suzuki ,  Yoshimi Suzuki

发明人： Kazushi Suzuki ,  Yoshimi Suzuki

IPC分类号： G03G15/16

CPC分类号： G03G15/161 ,  G03G2215/1661

摘要： An image forming apparatus includes an image bearing drum for carrying a toner image; an intermediary transfer member; a primary transfer device for primary transfer of a toner image from the drum onto the intermediary member; a secondary transfer device for secondary transfer of the toner image from the intermediary member onto a sheet; and a cleaning unit for removing the toner on the intermediary member. The cleaning unit includes a scraping member for removing the toner deposited on the intermediary member, an accommodating portion for the removed toner, a discharging member, provided downstream of the scraping member with respect to a moving direction of the intermediary member, for moving the toner in the accommodating portion to the intermediary member by application of a voltage, and a regulating member contacted to the discharging member to regulate an amount of the toner deposited on the discharging member.

摘要翻译： 图像形成装置包括用于承载调色剂图像的图像承载滚筒; 中介转让成员; 用于将调色剂图像从滚筒初次转印到中间构件上的一次转印装置; 用于将调色剂图像从中间构件二次转印到片材上的二次转印装置; 以及用于去除中间构件上的调色剂的清洁单元。 清洁单元包括用于去除沉积在中间构件上的调色剂的刮擦构件，用于除去的调色剂的容纳部分，相对于中间构件的移动方向设置在刮擦构件的下游的排出构件，用于移动调色剂 在通过施加电压的中间构件的容纳部分中，以及与排出构件接触的调节构件，以调节沉积在排出构件上的调色剂的量。

公开(公告)号：US4884148A

公开(公告)日：1989-11-28

申请号：US264710

申请日：1988-10-31

申请人： Osamu Ishikawa ,  Mikihiko Sone ,  Yoshimi Suzuki

发明人： Osamu Ishikawa ,  Mikihiko Sone ,  Yoshimi Suzuki

IPC分类号： H04N1/403

CPC分类号： H04N1/403

摘要： A circuit for converting a video signal into binary signals comprising a line image sensor for performing photoelectric conversion of an object to be read thereby producing pixel signals. Means are also provided for setting reference levels for respective sections of the line image sensor, the sections being divisions of the entire length of the line image sensor. A comparator compares each pixel signal with the reference level for the section to which the pixel signal in question belongs, to produce a binary signal. An interpolator is further provided for receiving the digital reference level data as is a D/A converter for converting the output of the interpolator to an analog reference level signal and supplying it to the comparator.

摘要翻译： 一种用于将视频信号转换为二进制信号的电路，包括用于执行要读取的对象的光电转换的线形图像传感器，从而产生像素信号。 还提供了用于设置线状图像传感器的各个部分的基准电平的装置，这些部分是线形图像传感器的整个长度的分割。 比较器将每个像素信号与所讨论的像素信号所属的部分的参考电平进行比较，以产生二进制信号。 进一步提供一个用于接收数字参考电平数据的内插器，如D / A转换器，用于将内插器的输出转换为模拟参考电平信号并将其提供给比较器。

公开(公告)号：US5772352A

公开(公告)日：1998-06-30

申请号：US642061

申请日：1996-05-06

申请人： Yasutaka Fukumoto ,  Junichi Kato ,  Yukio Okamura ,  Yasuhiro Ishikawa ,  Tetsuo Kondo ,  Yoshimi Suzuki ,  Hidetomi Nagai

发明人： Yasutaka Fukumoto ,  Junichi Kato ,  Yukio Okamura ,  Yasuhiro Ishikawa ,  Tetsuo Kondo ,  Yoshimi Suzuki ,  Hidetomi Nagai

IPC分类号： B60G3/20 ,  B60G7/00 ,  B62D7/16 ,  F16C11/06 ,  F16C11/00

CPC分类号： F16C11/0647 ,  B60G3/20 ,  B60G7/005 ,  B62D7/16 ,  Y10T403/32745 ,  Y10T403/32762 ,  Y10T403/32803 ,  Y10T403/32811

摘要： A ball joint generates play when wear of a ball sheet reaches a predetermined allowable amount so that the end of service life of the ball joint can be recognized by a simple inspection. A spherical portion of a ball stud is interposed between an upper sheet and a lower sheet. The upper sheet is displaced toward the lower sheet when the upper sheet or the lower sheet has been worn due to sliding of the spherical portion. The displacement of the upper sheet is restricted so that the upper sheet is supported at a predetermined position relative to the lower sheet.

摘要翻译： 当球片的磨损达到预定的允许量时，球接头产生打击，从而可以通过简单的检查来识别球窝接头的使用寿命的结束。 球杆的球形部分插入在上片和下片之间。 当上片或下片由于球形部分的滑动而磨损时，上片向下片移位。 限制上片的位移，使得上片相对于下片被支撑在预定位置。

公开(公告)号：US4867299A

公开(公告)日：1989-09-19

申请号：US218678

申请日：1988-07-13

申请人： Yoshioki Fukuoka ,  Kazuo Hamajima ,  Michioki Takaba ,  Yoshimi Suzuki ,  Shinpei Seki ,  Katsunori Kinoshita ,  Akihiro Mizuno

发明人： Yoshioki Fukuoka ,  Kazuo Hamajima ,  Michioki Takaba ,  Yoshimi Suzuki ,  Shinpei Seki ,  Katsunori Kinoshita ,  Akihiro Mizuno

IPC分类号： B65H29/60 ,  B65G47/64 ,  B65G47/71 ,  F26B3/20 ,  F26B25/00

CPC分类号： B65G47/71 ,  B65G47/643 ,  F26B25/004 ,  F26B3/20

摘要： Apparatus for distributing veneer sheets comprises a pair of vertically-movable upper and lower relay conveyors for receiving veneer sheets from a veneer conveyor and supplying the sheets to different treating sections of different heights of a veneer treating system, such as a veneer drying system. When receiving the sheet from the veneer conveyor, each relay conveyor is horizontally aligned with the veneer conveyor. When supplying the sheet to the treating section, each relay conveyor is in a position adjacent to the section. Each relay conveyor may receive a veneer sheet while the other conveyor is supplying the sheet to the treating section.

摘要翻译： 用于分配薄板片的装置包括一对垂直可移动的上和下继电器输送机，用于从单板输送机接收单板，并将薄片供应到单板处理系统例如单板干燥系统的不同高度的不同处理部分。 当从单板输送机接收纸张时，每个中继输送机与胶合板输送机水平对齐。 当将片材供应到处理部分时，每个中继输送机处于与该部分相邻的位置。 每个继电器输送机可以接收单板，而另一个输送机将片材供应到处理部分。

公开(公告)号：US20120219315A1

公开(公告)日：2012-08-30

申请号：US13400925

申请日：2012-02-21

申请人： Kazushi Suzuki ,  Yoshimi Suzuki

发明人： Kazushi Suzuki ,  Yoshimi Suzuki

IPC分类号： G03G15/16

CPC分类号： G03G15/161 ,  G03G2215/1661

摘要： An image forming apparatus includes an image bearing drum for carrying a toner image; an intermediary transfer member; a primary transfer device for primary transfer of a toner image from the drum onto the intermediary member; a secondary transfer device for secondary transfer of the toner image from the intermediary member onto a sheet; and a cleaning unit for removing the toner on the intermediary member. The cleaning unit includes a scraping member for removing the toner deposited on the intermediary member, an accommodating portion for the removed toner, a discharging member, provided downstream of the scraping member with respect to a moving direction of the intermediary member, for moving the toner in the accommodating portion to the intermediary member by application of a voltage, and a regulating member contacted to the discharging member to regulate an amount of the toner deposited on the discharging member.

摘要翻译： 图像形成装置包括用于承载调色剂图像的图像承载滚筒; 中介转让成员; 用于将调色剂图像从滚筒初次转印到中间构件上的一次转印装置; 用于将调色剂图像从中间构件二次转印到片材上的二次转印装置; 以及用于去除中间构件上的调色剂的清洁单元。 清洁单元包括用于去除沉积在中间构件上的调色剂的刮擦构件，用于除去的调色剂的容纳部分，相对于中间构件的移动方向设置在刮擦构件的下游的排出构件，用于移动调色剂 在通过施加电压的中间构件的容纳部分中，以及与排出构件接触的调节构件，以调节沉积在排出构件上的调色剂的量。