公开(公告)号：US06881611B1

公开(公告)日：2005-04-19

申请号：US09635124

申请日：2000-08-08

申请人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

发明人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

IPC分类号： B29C43/18 ,  H01L21/301 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L29/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  B29C43/18 ,  B29C2043/3444 ,  B29C2043/3628 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/566 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/0657 ,  H01L2221/68377 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1005 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

摘要翻译： 一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得 形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序 与树脂层13一起切割基板16，使得半导体元件11彼此分离。

公开(公告)号：US06472744B2

公开(公告)日：2002-10-29

申请号：US09084097

申请日：1998-05-26

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2500

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可分离地保持半导体器件的插座。

公开(公告)号：US06696754B2

公开(公告)日：2004-02-24

申请号：US10214306

申请日：2002-08-08

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2334

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可拆卸地保持半导体器件的插座。

公开(公告)号：US06511620B1

公开(公告)日：2003-01-28

申请号：US09511496

申请日：2000-02-23

申请人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

发明人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

IPC分类号： B29C3318

CPC分类号： B29C33/0055 ,  B29C33/68 ,  B29C43/18 ,  B29C43/36 ,  B29C43/3642 ,  B29C43/56 ,  H01L21/566 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.

摘要翻译： 一种制造半导体器件的方法，其在树脂封装之后与金属模具具有优异的可分离性，因此不需要清洁金属模具。 还提供了用于制造这种半导体器件的金属模具。 根据本发明的方法，首先打开金属模具，并且在包括第一金属模具和第二金属模具的空腔形成表面的分割表面上设置两个分离片。 然后将基板放置在一个分离片上，其半导体芯片形成表面面向第二金属模具。 在放置在一个分离片上的基板上设置封装树脂。 将处于加热状态的金属模封闭并压制以形成用于封装形成在基板上的电极的树脂层。 再次打开金属模具，将树脂封装的基板从金属模具中取出。 在分离片被去除之后，将衬底分成单独的半导体器件。

公开(公告)号：US06469370B1

公开(公告)日：2002-10-22

申请号：US09495332

申请日：2000-02-01

申请人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

发明人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/731 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In a semiconductor device of the present invention and a production method thereof, an electronic circuit is provided in a semiconductor substrate, the electronic circuit having terminals. An internal wiring pattern is provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals. A protective layer is provided on the substrate, the protective layer covering the substrate. Vias are provided on the substrate so as to project from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate. An external wiring pattern is provided on the protective layer, the external wiring pattern being connected to the vias. Projection electrodes are connected to the external wiring pattern, the projection electrodes having a predetermined height above the external wiring pattern. An enclosure layer of a resin material is provided on the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.

摘要翻译： 在本发明的半导体器件及其制造方法中，电子电路设置在半导体衬底中，该电子电路具有端子。 内部布线图案设置在基板中，内部布线图案连接到电子电路端子。 保护层设置在基板上，保护层覆盖基板。 在基板上设置通孔，从保护层突出，通孔在基板的任意位置连接到内部布线图案。 外部布线图案设置在保护层上，外部布线图形与通孔相连。 投射电极连接到外部布线图案，突起电极在外部布线图案上方具有预定的高度。 树脂材料的外壳层设置在保护层上，外壳层覆盖突起电极的侧面和外部布线图案的外表面。

公开(公告)号：US5804467A

公开(公告)日：1998-09-08

申请号：US855647

申请日：1997-05-13

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US06379997B1

公开(公告)日：2002-04-30

申请号：US09593658

申请日：2000-06-13

申请人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiquro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

发明人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiquro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/53483 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

摘要翻译： 半导体器件包括半导体元件，保持半导体元件的保持基板，设置在保持基板上以围绕半导体元件并具有与保持基板和框体之间形成的空间连通的孔的框体，以及 框架体和保持基板形成壳体，多个引线具有连接到半导体元件的内部引线部分和在框架主体外部延伸的外部引线部分，以及填充该空间并将半导体元件和内部引线部分封装的树脂 。 所有外部引线部分从壳体的一侧延伸到壳体外部。

公开(公告)号：US6034428A

公开(公告)日：2000-03-07

申请号：US745203

申请日：1996-11-08

申请人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K3/40 ,  H01L23/053

CPC分类号： H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/49 ,  H05K3/4084 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/0394 ,  H05K2203/0195 ,  H05K2203/063

摘要： A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

摘要翻译： 半导体器件包括半导体芯片和连接到半导体芯片的多层构件。 多层构件包括交替堆叠的一个或多个布线层和一个或多个绝缘层。 一个或多个绝缘层具有孔。 多层构件具有电极部件，其包括通过所述孔使上述一个或多个布线层变形而获得的上述一个或多个布线层的变形部分。

公开(公告)号：US6111306A

公开(公告)日：2000-08-29

申请号：US944511

申请日：1997-10-06

申请人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

发明人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02 ,  H01L23/15

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/53483

摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

公开(公告)号：US5679978A

公开(公告)日：1997-10-21

申请号：US330848

申请日：1994-10-24

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。