REACTION APPARATUS, AND REACTION METHOD
    1.
    发明申请
    REACTION APPARATUS, AND REACTION METHOD 审中-公开
    反应装置和反应方法

    公开(公告)号:US20100022771A1

    公开(公告)日:2010-01-28

    申请号:US12441674

    申请日:2007-09-14

    摘要: The present invention is directed at obtaining a high yield of a target substance and simultaneously securing high productivity.A reaction apparatus 10 has: a main flow channel 12 having an inner diameter of 3 mm, in which a raw material M1 flows; an introduction flow channel 14 in which a raw material M2 that causes a chemical reaction with the raw material M1 flows; and five branch introduction flow channels 16a to 16e which are branched from the introduction flow channel 14 and introduce the raw material M2 to the main flow channel 12, at predetermined introduction points 12o to 12s in the main flow channel 12. Here, in the main flow channel 12, the flow channel lengths of the flow channels 12b to 12d between adjacent introduction points 12p to 12s are not longer than those of the flow channels 12a to 12c between the next previous adjacent introduction points 12o to 12r in a flow direction of the raw material M1. At least one length of the flow channels 12b to 12d between the adjacent introduction points 12p to 12s is shorter than lengths of the flow channels 12a to 12c between previous adjacent introduction points 12o to 12r in the flow direction of the raw material M1.

    摘要翻译: 本发明涉及获得高产率的目标物质并同时确保高生产率。 反应装置10具有:原料M1流过的内径为3mm的主流路12; 导入与原料M1发生化学反应的原料M2的导入流路14; 以及从导入流路14分支并将原料M2引入主流路12的五个分支导入流路16a〜16e,在主流路12中的预定的导入点12o〜12s。这里,主 在流路12中,相邻导入点12p〜12s之间的流路12b〜12d的流路长度不比前一相邻导入点12o〜12r之间的流路12a〜12c的流路长度在 原料M1。 在相邻的导入点12p〜12s之间的流路12b〜12d的至少一个长度比原料M1的流动方向的前一相邻导入点12o〜12r之间的流路12a〜12c的长度短。

    Method for producing fine powder and the fine powder produced by the same
    2.
    发明授权
    Method for producing fine powder and the fine powder produced by the same 有权
    微细粉末的制造方法及其制造的细粉末

    公开(公告)号:US09044758B2

    公开(公告)日:2015-06-02

    申请号:US13509573

    申请日:2010-11-12

    IPC分类号: A61J3/02 B02C19/18 B02C17/16

    CPC分类号: B02C19/186 B02C17/16

    摘要: Disclosed is a manufacturing method for a fine powder exhibiting improved solubility, little impurity contamination, and a high recovery rate. Material to be ground and a grinding medium are suspended and stirred in a liquefied inert gas dispersion medium such as dried ice, and the material to be ground is made into a sub-micron or nano-sized fine powder. A uniform fine powder can be obtained when the material to be ground is a mixture having two or more components. Impurity contamination can be reduced by using granular dry ice as the grinding medium.

    摘要翻译: 公开了一种表现出改进的溶解性,少量杂质污染和高回收率的细粉的制造方法。 要研磨的材料和研磨介质在液化的惰性气体分散介质如干冰中悬浮和搅拌,并将待研磨的材料制成亚微米或纳米级的细粉末。 当被研磨材料为具有两种或多种组分的混合物时,可获得均匀的细粉末。 通过使用颗粒状干冰作​​为研磨介质可以减少杂质污染。

    LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
    3.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
    发光装置和发光装置包装

    公开(公告)号:US20130056748A1

    公开(公告)日:2013-03-07

    申请号:US13601527

    申请日:2012-08-31

    IPC分类号: H01L33/32

    摘要: A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned to receive an emission wavelength from the light emitting layer, a convex pattern including a collection of a plurality of convex portions discretely arranged on a front surface of the substrate with a first pitch, an n type nitride semiconductor layer located on the front surface of the substrate to cover the convex pattern and a p type nitride semiconductor layer located on the light emitting layer. The light emitting layer is located on the n type semiconductor layer. Each of the convex portions includes a sub convex pattern comprising a plurality of fine convex portions discretely formed at the top of the convex portion with a second pitch smaller than the first pitch, and a base supporting the sub convex pattern.

    摘要翻译: 发光器件包括发光层,对于发光层的发射波长透明并且被定位成从发光层接收发光波长的衬底,包括多个凸起部分的离散集合的凸形图案 以第一间距布置在衬底的前表面上,位于衬底的前表面上的n型氮化物半导体层以覆盖位于发光层上的凸形图案和ap型氮化物半导体层。 发光层位于n型半导体层上。 每个凸起部分包括一个副凸起的图案,该凸出的凹凸图形包括多个微细凸起部分,该凹凸部分离开地形成在凸起部分的顶部,具有比第一间距小的第二间距,以及支撑该子凸形图案的基部。

    Light-emitting element
    4.
    发明授权
    Light-emitting element 有权
    发光元件

    公开(公告)号:US08653551B2

    公开(公告)日:2014-02-18

    申请号:US13350013

    申请日:2012-01-13

    IPC分类号: H01L33/00

    摘要: A light-emitting element, a light-emitting element unit and a light-emitting element package are provided, which are each reduced in reflection loss and intra-film light absorption by suppressing multiple light reflection in a transparent electrode layer and hence have higher luminance. The light-emitting element 1 includes a substrate 2, an n-type nitride semiconductor layer 3, a light-emitting layer 4, a p-type nitride semiconductor layer 5, a transparent electrode layer 6 and a reflective electrode layer 7, and the transparent electrode layer 6 has a thickness T satisfying the following expression (1): 3 ⁢ λ 4 ⁢ ⁢ n + 0.30 × ( λ 4 ⁢ ⁢ n ) ≤ T ≤ 3 ⁢ λ 4 ⁢ ⁢ n + 0.45 × ( λ 4 ⁢ ⁢ n ) ( 1 ) wherein λ is the light-emitting wavelength of the light-emitting element 4, and n is the refractive index of the transparent electrode layer 6.

    摘要翻译: 提供一种发光元件,发光元件单元和发光元件封装,其通过抑制透明电极层中的多个光反射而降低反射损失和膜内光吸收,因此具有较高的亮度 。 发光元件1包括基板2,n型氮化物半导体层3,发光层4,p型氮化物半导体层5,透明电极层6和反射电极层7,以及 透明电极层6的厚度T满足下面的表达式(1):3λ4·托恩n + 0.30×(λ4·托恩n)<= T <=3λ4·托恩+ 0.45×(λ 4⁢n)(1)其中,λ是发光元件4的发光波长,n是透明电极层6的折射率。

    NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR
    5.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR 审中-公开
    氮化物半导体发光元件和制造氮化物半导体的方法

    公开(公告)号:US20100133506A1

    公开(公告)日:2010-06-03

    申请号:US12452060

    申请日:2008-06-13

    IPC分类号: H01L33/00 H01L21/20

    摘要: Provided are a nitride semiconductor light emitting element having a nitride semiconductor layered on an AlN buffer layer with improved qualities such as crystal quality and with improved light emission output, and a method of manufacturing a nitride semiconductor. An AlN buffer layer (2) is formed on a sapphire substrate (1), and nitride semiconductors of an n-type AlGaN layer (3), an InGaN/GaN active layer (4) and a p-type GaN layer (5) are layered in sequence on the buffer layer (2). An n-electrode (7) is formed on a surface of the n-type AlGaN layer (3), and a p-electrode (6) is formed on the p-type GaN layer (5). The n-type AlGaN layer (3) serves as a cladding layer for confining light and carriers. The AlN buffer layer (2) is manufactured by alternately supplying an Al material and an N material at a growing temperature of 900° C. or higher.

    摘要翻译: 提供一种氮化物半导体发光元件,其具有层叠在AlN缓冲层上的氮化物半导体,其具有改善的质量,例如晶体质量和改善的发光输出,以及制造氮化物半导体的方法。 在蓝宝石衬底(1)上形成AlN缓冲层(2),并且n型AlGaN层(3),InGaN / GaN有源层(4)和p型GaN层(5)的氮化物半导体 在缓冲层(2)上依次分层。 在n型AlGaN层(3)的表面上形成n电极(7),在p型GaN层(5)上形成p电极(6)。 n型AlGaN层(3)用作限制光和载流子的包覆层。 AlN缓冲层(2)通过在900℃以上的生长温度下交替地供给Al材料和N材料来制造。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体发光器件及其制造方法

    公开(公告)号:US20100102341A1

    公开(公告)日:2010-04-29

    申请号:US12452049

    申请日:2008-06-03

    IPC分类号: H01L33/00 H01L21/302

    CPC分类号: H01L33/22 H01L33/20 H01L33/32

    摘要: A semiconductor light emitting device includes: a transparent substrate including a first principal surface and a second principal surface opposite with the first principal surface, in which side surfaces between the first principal surface and the second principal surface are rough surfaces; and a semiconductor light emitting element that is arranged on the first principal surface of the transparent substrate and is composed by stacking nitride semiconductors on each other.

    摘要翻译: 一种半导体发光器件包括:透明基板,包括第一主表面和与第一主表面相对的第二主表面,其中第一主表面和第二主表面之间的侧表面是粗糙表面; 以及半导体发光元件,其配置在透明基板的第一主面上,并且由氮化物半导体构成。

    Semiconductor light emitting device and fabrication method for the semiconductor light emitting device
    7.
    发明申请
    Semiconductor light emitting device and fabrication method for the semiconductor light emitting device 有权
    半导体发光元件及半导体发光元件的制造方法

    公开(公告)号:US20090179215A1

    公开(公告)日:2009-07-16

    申请号:US12318831

    申请日:2009-01-09

    IPC分类号: H01L33/00 H01L21/318

    CPC分类号: H01L33/40 H01L33/32 H01L33/42

    摘要: A semiconductor light emitting device includes a first metal layer placed on the p-type semiconductor layer on the substrate, and includes a first pattern width W1; a second metal layer on the first metal layer; a transparent electrode layer on the second metal layer and the p type semiconductor layer, and has an opening patterned with a second pattern width W2 on the second metal layer; an insulating film the transparent electrode layer and the second metal layer, and has an opening patterned with third pattern width W3 on the second metal layer; a reflective stacked film on the insulating film, and has an opening patterned with third pattern width W3 on the second metal layer; a third metal layer on the second metal layer of an opening patterned with the reflective stacked film and third pattern width W3; and a fourth metal layer on the third metal layer.

    摘要翻译: 半导体发光器件包括:第一金属层,设置在基板上的p型半导体层上,并且包括第一图案宽度W1; 第一金属层上的第二金属层; 在第二金属层和p型半导体层上的透明电极层,并且具有在第二金属层上以第二图案宽度W2图案化的开口; 绝缘膜,透明电极层和第二金属层,并且具有在第二金属层上以第三图案宽度W3图案化的开口; 绝缘膜上的反射层叠膜,并且在第二金属层上具有用第三图案宽度W3图案化的开口; 在反射层叠膜图案化的开口的第二金属层上的第三金属层和第三图案宽度W3; 以及第三金属层上的第四金属层。

    Light emitting element unit and method for manufacturing the same, light emitting element package and illuminating device
    10.
    发明授权
    Light emitting element unit and method for manufacturing the same, light emitting element package and illuminating device 有权
    发光元件单元及其制造方法,发光元件封装和照明装置

    公开(公告)号:US09082945B2

    公开(公告)日:2015-07-14

    申请号:US13339060

    申请日:2011-12-28

    IPC分类号: F21V1/00 H01L33/60 F21V7/00

    摘要: A light emitting element unit according to the present invention includes a semiconductor light emitting element that has a surface, a back surface, and a side surface, where the surface or the back surface is a light extracting surface from which light generated inside is emitted, a submount which has a bottom wall and a side wall, has a recess portion defined by the bottom wall and the side wall, and supports the semiconductor light emitting element by the bottom wall in a position in which the light extracting surface is directed upward at the recess portion, and has an inclined surface on the side wall, inclined at a predetermined angle with respect to the bottom wall so as to face the side surface of the semiconductor light emitting element, and a light reflecting film formed on the inclined surface of the submount.

    摘要翻译: 根据本发明的发光元件单元包括具有表面,后表面和侧表面的半导体发光元件,其中表面或背表面是从其发射的光的光提取表面, 具有底壁和侧壁的基座具有由底壁和侧壁限定的凹部,并且通过底壁将光提取表面向上指向的位置支撑半导体发光元件 所述凹部具有在所述侧壁上的倾斜面,相对于所述底壁以与所述半导体发光元件的侧面相对的方式倾斜预定角度,并且形成在所述倾斜面上的光反射膜 底座。