公开(公告)号：US20130069224A1

公开(公告)日：2013-03-21

申请号：US13235135

申请日：2011-09-16

申请人： Oh Han Kim ,  Ki Youn Jang ,  DaeSik Choi ,  DongSoo Moon

发明人： Oh Han Kim ,  Ki Youn Jang ,  DaeSik Choi ,  DongSoo Moon

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73209 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/82

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a routable layer having a column; mounting an integrated circuit structure in direct contact with the column; and forming a gamma connector to electrically connect the column to the integrated circuit structure.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有列的可布线层; 安装与柱直接接触的集成电路结构; 以及形成伽马连接器以将该列电连接到集成电路结构。

公开(公告)号：US08513057B2

公开(公告)日：2013-08-20

申请号：US13235135

申请日：2011-09-16

申请人： Oh Han Kim ,  Ki Youn Jang ,  DaeSik Choi ,  DongSoo Moon

发明人： Oh Han Kim ,  Ki Youn Jang ,  DaeSik Choi ,  DongSoo Moon

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73209 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/82

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a routable layer having a column; mounting an integrated circuit structure in direct contact with the column; and forming a gamma connector to electrically connect the column to the integrated circuit structure.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有列的可布线层; 安装与柱直接接触的集成电路结构; 以及形成伽马连接器以将该列电连接到集成电路结构。

公开(公告)号：US08772916B2

公开(公告)日：2014-07-08

申请号：US13536382

申请日：2012-06-28

申请人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

发明人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

IPC分类号： H01L23/31

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.

摘要翻译： 一种集成电路封装系统，包括：包括电触点的支撑结构; 在支撑结构上的焊料掩模，焊接掩模包括焊接掩模法兰，焊接掩模法兰直接在支撑结构的第一表面上; 在支撑结构上的集成电路; 以及封装在集成电路上并与焊盘法兰接触。 一种模具系统，其包括具有沿着第一模具底面的突起的第一模具，所述突起在第一腔和凹部之间。

公开(公告)号：US08471394B2

公开(公告)日：2013-06-25

申请号：US13269442

申请日：2011-10-07

申请人： Ki Youn Jang ,  HeeJo Chi ,  NamJu Cho

发明人： Ki Youn Jang ,  HeeJo Chi ,  NamJu Cho

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an encapsulation system having a mold chase with a buffer layer attached thereto; forming a base integrated circuit package including: providing a base substrate, connecting an exposed interconnect to the base substrate, a portion of the exposed interconnect having the buffer layer attached thereon, mounting a base component over the base substrate, and forming a base encapsulation over the base substrate and the exposed interconnect using the encapsulation system; and releasing the encapsulation system providing the portion of the exposed interconnect exposed from the base encapsulation, the exposed interconnect having characteristics of the buffer layer removed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有连接有缓冲层的模具追踪的封装系统; 形成基底集成电路封装，其包括：提供基底基板，将暴露的互连件连接到基底基板，暴露的互连件的一部分具有附着在其上的缓冲层，将基底部件安装在基底基板上，以及形成基底封装 基底和暴露的互连使用封装系统; 以及释放所述封装系统，其提供从所述基底封装暴露的暴露的互连部分，所述暴露的互连具有去除所述缓冲层的特征。

公开(公告)号：US20120025398A1

公开(公告)日：2012-02-02

申请号：US13269442

申请日：2011-10-07

申请人： Ki Youn Jang ,  HeeJo Chi ,  NamJu Cho

发明人： Ki Youn Jang ,  HeeJo Chi ,  NamJu Cho

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an encapsulation system having a mold chase with a buffer layer attached thereto; forming a base integrated circuit package including: providing a base substrate, connecting an exposed interconnect to the base substrate, a portion of the exposed interconnect having the buffer layer attached thereon, mounting a base component over the base substrate, and forming a base encapsulation over the base substrate and the exposed interconnect using the encapsulation system; and releasing the encapsulation system providing the portion of the exposed interconnect exposed from the base encapsulation, the exposed interconnect having characteristics of the buffer layer removed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有连接有缓冲层的模具追踪的封装系统; 形成基底集成电路封装，其包括：提供基底基板，将暴露的互连件连接到基底基板，暴露的互连件的一部分具有附着在其上的缓冲层，将基底部件安装在基底基板上，以及形成基底封装 基底和暴露的互连使用封装系统; 以及释放所述封装系统，其提供从所述基底封装暴露的暴露的互连部分，所述暴露的互连具有去除所述缓冲层的特征。

公开(公告)号：US20110285000A1

公开(公告)日：2011-11-24

申请号：US13194874

申请日：2011-07-29

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/4952 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/48471 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.

摘要翻译： 半导体封装系统及其制造方法包括：具有接触焊盘的电气基板; 在其上具有引线指的支撑结构; 铅笔上的凸起，凸块夹在引线指的顶部和侧面并与接触垫相连; 以及在引线指和电基底上的密封剂。

公开(公告)号：US07909233B2

公开(公告)日：2011-03-22

申请号：US12767670

申请日：2010-04-26

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： B23K31/00 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch and each having a trapezoidal cross-section; attaching a plurality of bumps to the plurality of lead fingers, the plurality of bumps on the tops, extending beyond the widths of the trapezoidal cross-sections, and clamping down on the two sides of each of the plurality of lead fingers; attaching a plurality of bond wires to the plurality of contact pads; attaching the plurality of bond wires to the plurality of bumps; and forming an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

摘要翻译： 一种制造半导体封装系统的方法，包括：提供具有多个接触焊盘的裸片; 形成具有预定长度的平坦顶部的多个引线指引的引线框架，所述多个引线指具有细间距并且各自具有梯形横截面; 将多个凸起附接到所述多个引线指，所述顶部上的所述多个凸块延伸超过所述梯形横截面的宽度，并且夹紧在所述多个引线中的每一个的两侧; 将多个接合线附接到所述多个接触垫; 将所述多个接合线附接到所述多个凸起; 以及在所述多个引线指，所述管芯和所述多个接合线上形成密封剂，所述密封剂暴露于所述多个引线的下表面。

公开(公告)号：US20070001296A1

公开(公告)日：2007-01-04

申请号：US11469307

申请日：2006-08-31

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang ,  Keon Teak Kang ,  Hyung Jun Jeon

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang ,  Keon Teak Kang ,  Hyung Jun Jeon

IPC分类号： H01L23/34

CPC分类号： H01L25/0657 ,  H01L23/562 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package system is provided including forming a support platform, mounting a first device over the support platform, forming a bump on the support platform, and mounting a second device on the first device and the bump.

摘要翻译： 提供了一种半导体封装系统，包括形成支撑平台，将第一装置安装在支撑平台上，在支撑平台上形成凸块，以及将第二装置安装在第一装置和凸块上。

公开(公告)号：US08703541B2

公开(公告)日：2014-04-22

申请号：US13441550

申请日：2012-04-06

申请人： Haengcheol Choi ,  Ki Youn Jang ,  Taewoo Kang ,  Il Kwon Shim

发明人： Haengcheol Choi ,  Ki Youn Jang ,  Taewoo Kang ,  Il Kwon Shim

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/0603 ,  H01L2224/06142 ,  H01L2224/1403 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09227 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/4913

摘要： An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, and aligning the external interconnect with the radiating patterned pad.

摘要翻译： 提供了一种电子系统，包括形成具有辐射图案化垫的衬底，将具有外部互连的电气装置安装在辐射图案化焊盘上，其中外部互连偏离辐射图案化衬垫，并将外部互连与辐射图案化衬垫对准。

公开(公告)号：US20130154121A1

公开(公告)日：2013-06-20

申请号：US13327091

申请日：2011-12-15

申请人： JaeHyun Lee ,  Ki Youn Jang ,  DokOk Yu

发明人： JaeHyun Lee ,  Ki Youn Jang ,  DokOk Yu

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/566 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/18161

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate, the integrated circuit having an inactive side and a non-horizontal side; mounting a mold chase having a buffer layer over the integrated circuit; forming an encapsulation between the substrate and the buffer; and removing the mold chase, leaving the encapsulation having a recess exposing a portion of the non-horizontal side.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在衬底上安装集成电路，集成电路具有非活动侧和非水平侧; 在所述集成电路上安装具有缓冲层的模具追逐; 在衬底和缓冲器之间形成封装; 并且移除模具追逐，留下具有暴露非水平侧部分的凹部的封装。