公开(公告)号：US06414867B2

公开(公告)日：2002-07-02

申请号：US09784117

申请日：2001-02-16

申请人： Osamu Suzuki ,  Heikichi Kuwabara ,  Akio Yasukawa ,  Mitsuyuki Hombu ,  Hirohisa Yamamura ,  Sanshirou Obara ,  Kaname Sasaki

发明人： Osamu Suzuki ,  Heikichi Kuwabara ,  Akio Yasukawa ,  Mitsuyuki Hombu ,  Hirohisa Yamamura ,  Sanshirou Obara ,  Kaname Sasaki

IPC分类号： H02M100

CPC分类号： H02M7/003 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and lead from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inside or outside the second seal.

摘要翻译： 散热器或冷却箱具有冷却通道和形成为面对通道的一部分的至少一个开口。 第一密封件设置在至少一个开口的外部。 冷却箱具有位于第一密封件外部的凹槽。 孔分离地形成在凹槽中并从凹槽引导到冷却箱的外部。 第二密封件设置在凹槽外部。 构成电路壳体的散热板通过在第二密封件的内部或外部使用夹紧装置安装在散热器上。

公开(公告)号：US06271601B1

公开(公告)日：2001-08-07

申请号：US09305448

申请日：1999-05-06

申请人： Noriaki Yamamoto ,  Yukinori Taneda ,  Hirohisa Yamamura ,  Akio Yasukawa ,  Osamu Suzuki ,  Tatsuya Shigemura

发明人： Noriaki Yamamoto ,  Yukinori Taneda ,  Hirohisa Yamamura ,  Akio Yasukawa ,  Osamu Suzuki ,  Tatsuya Shigemura

IPC分类号： H01L2348

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19043 ,  H01L2924/2076 ,  H05K13/06 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.

摘要翻译： 引线接合方法和装置在其进料侧实现直径范围为100-600μm的线的接头部分的扁平较薄的塑性变形，并将扁平变形的线接头部分定位到目标接合表面 并用超声波焊丝机将带有振动的定位线接头部分压在接头表面上，并将其连接在一起。 基于该方案制造的大功率半导体器件具有长寿命的线接头。

公开(公告)号：US6166937A

公开(公告)日：2000-12-26

申请号：US315817

申请日：1999-05-21

申请人： Hirohisa Yamamura ,  Osamu Suzuki ,  Akio Yasukawa ,  Nobunori Matsudaira

发明人： Hirohisa Yamamura ,  Osamu Suzuki ,  Akio Yasukawa ,  Nobunori Matsudaira

IPC分类号： H01L23/473 ,  H01L25/16 ,  H02M1/00 ,  H02M7/5387 ,  H05K7/14 ,  H05K7/20

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L25/165 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： IGBT modules, bus bars and capacitors in an inverter main circuit are secured on the front face of a heat sink and at the back side of the heat sink a water cooling channel is formed to cool the IGBT modules. The bus bars and the capacitor, thereby the size of an inverter device used in an electric car is reduced and the duration thereof is prolonged.

摘要翻译： 逆变器主电路中的IGBT模块，母线和电容器固定在散热器的正面上，并且在散热器的背面形成水冷却通道以冷却IGBT模块。 汇流条和电容器，从而减小了在电动汽车中使用的逆变器装置的尺寸并延长其持续时间。

公开(公告)号：US5793106A

公开(公告)日：1998-08-11

申请号：US608565

申请日：1996-02-28

申请人： Akio Yasukawa ,  Hirohisa Yamamura ,  Shotaro Naito ,  Heikichi Kuwahara ,  Osamu Suzuki ,  Masanori Muso ,  Nobuo Fujieda

发明人： Akio Yasukawa ,  Hirohisa Yamamura ,  Shotaro Naito ,  Heikichi Kuwahara ,  Osamu Suzuki ,  Masanori Muso ,  Nobuo Fujieda

IPC分类号： H01L23/31 ,  H01L23/40 ,  H01L25/07 ,  H01L25/18 ,  H01L23/34 ,  H01L23/10 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3511

摘要： A semiconductor device, suitable for use in an invertor device for large currents in which IGBT chips are used and of which a high reliability is required, has an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in the space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein, for purposes of attaching the insulating plate to the heatsink, the resin case is used to press the insulating plate onto the heatsink. Some benefits of this construction are that is makes it possible to eliminate the problem of fatigue failure of a solder layer previously used for attaching the insulating plate to the heatsink by dispensing with that solder layer, while at the same time improving the transfer of heat from the insulating plate to the heatsink, and thereby improving the removal of heat from the device. The construction also makes it possible to reduce cracking of the insulating plate, reduce breakage of mounting portions of the resin case and to use the device to make a small, thin, light and highly reliable invertor device.

摘要翻译： 适用于其中使用IGBT芯片并且需要高可靠性的大电流的逆变器装置的半导体器件具有安装半导体芯片的绝缘板，封装半导体芯片的树脂壳体，填充物 树脂填充到树脂壳体中并覆盖半导体芯片并填充半导体芯片和树脂壳体之间的空间以及安装有绝缘板的散热器，其中为了将绝缘板连接到散热器， 树脂盒用于将绝缘板压在散热片上。 这种结构的一些好处在于，可以消除先前用于通过分配该焊料层将绝缘板附着到散热器上的焊料层的疲劳破坏的问题，同时改善来自 将绝缘板连接到散热器，从而改善从装置中除去热量。 该结构还可以减少绝缘板的开裂，减少树脂壳体的安装部分的破损，并且使用该装置来制造小型，薄型，高可靠性的逆变器装置。

公开(公告)号：US06410978B1

公开(公告)日：2002-06-25

申请号：US09370990

申请日：1999-08-10

申请人： Akio Yasukawa ,  Hirohisa Yamamura ,  Tatsuya Shigemura

发明人： Akio Yasukawa ,  Hirohisa Yamamura ,  Tatsuya Shigemura

IPC分类号： H01L2334

CPC分类号： H01L23/473 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09745 ,  H05K2201/10674 ,  H01L2924/00

摘要： A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.

摘要翻译： 提供了一种半导体装置，其中可以防止在其操作期间由于重复打开和关闭电源而发生安装在基座上的半导体芯片下方的焊料层的疲劳失效，即形成凹部 在半导体芯片下面的部分的基部中，以防止在基底中发生热膨胀。

公开(公告)号：US5936235A

公开(公告)日：1999-08-10

申请号：US30853

申请日：1998-02-26

申请人： Rintaro Minamitani ,  Akio Yasukawa ,  Shizuhisa Watanabe

发明人： Rintaro Minamitani ,  Akio Yasukawa ,  Shizuhisa Watanabe

IPC分类号： F02D35/00 ,  G01L9/00 ,  G01L11/00 ,  G01L23/06 ,  G01L23/16 ,  G01L23/22 ,  H01J5/16

CPC分类号： G01L23/16 ,  G01L23/221 ,  G01L9/0076

摘要： A cylinder pressure sensor is adapted to detect a cylinder pressure by detecting a change in the amount of light being transmitted through an optical fiber in an axial direction. Two support portions support the optical fiber at two points along the length thereof. A diaphragm in contact with the optical fiber causes bending of the optical fiber in dependence upon a change in the cylinder pressure. The position at which a force is applied against the optical fiber by the diaphragm is deviated from a center position between the two support portions. The resulting cylinder pressure sensor is capable of accurately measuring cylinder pressure and knocking over a long period of time with a low cost and reduced initial variations.

摘要翻译： 气缸压力传感器适于通过检测在轴向方向上透过光纤的光量的变化来检测气缸压力。 两个支撑部分沿其长度的两个点处支撑光纤。 与光纤接触的隔膜根据气缸压力的变化导致光纤弯曲。 通过隔膜向光纤施加力的位置偏离两个支撑部之间的中心位置。 所得到的气缸压力传感器能够以低成本和初始变化降低，精确地测量气缸压力和敲击长时间。

公开(公告)号：US4292618A

公开(公告)日：1981-09-29

申请号：US129195

申请日：1980-03-11

申请人： Masanori Tanabe ,  Satoshi Shimada ,  Akio Yasukawa ,  Motohisa Nishihara ,  Takeo Nagata

发明人： Masanori Tanabe ,  Satoshi Shimada ,  Akio Yasukawa ,  Motohisa Nishihara ,  Takeo Nagata

IPC分类号： G01B7/16 ,  G01L1/18 ,  H01L29/84 ,  G01L1/22

CPC分类号： H01L29/84 ,  G01L1/18

摘要： A semiconductor substrate has a major surface, another major surface on the opposite side of the first major surface, a strain gauge stripe formed in the central portion of the second major surface by diffusing an impurity therein, and electrodes connected to the strain gauge stripes. These strain gauge stripes are spaced from the peripheral edge of the second major surface by a distance greater than 1/3 of the length of the same major surface. The first major surface of the semiconductor substrate is bonded to an elastic metal load plate.

摘要翻译： 半导体衬底具有主表面，在第一主表面的相对侧上的另一个主表面，通过在其中扩散杂质而形成在第二主表面的中心部分中的应变计条，以及连接到应变计条纹的电极。 这些应变计条纹与第二主表面的周缘间隔大于同一主表面长度的1/3。 半导体基板的第一主表面与弹性金属负载板接合。

公开(公告)号：US07992435B2

公开(公告)日：2011-08-09

申请号：US12512512

申请日：2009-07-30

申请人： Rintaro Minamitani ,  Keiji Hanzawa ,  Akio Yasukawa

发明人： Rintaro Minamitani ,  Keiji Hanzawa ,  Akio Yasukawa

IPC分类号： G01F1/68

CPC分类号： G01F1/6845

摘要： In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.

摘要翻译： 在电绝缘膜的隔膜部分的周边部分被有机材料制成的保护膜覆盖的结构中，隔膜部分上的电阻器线与隔膜部分的周边部分交叉。 在电阻温度检测器等的细线与隔膜部的周边部分交叉的地方，保护膜比其他部分薄，防尘性降低。 在与加热电阻体连接的加热电阻线或与电阻温度检测体相连的电阻温度检测器线与隔膜部分的周边交叉的位置处，从电绝缘膜突出的膜部件并排配置， 电阻丝或电阻温度检测器线。

公开(公告)号：US07942053B2

公开(公告)日：2011-05-17

申请号：US12261700

申请日：2008-10-30

申请人： Naoki Saito ,  Takeshi Morino ,  Yuki Okamoto ,  Keiji Hanzawa ,  Hiromu Kikawa ,  Akio Yasukawa

发明人： Naoki Saito ,  Takeshi Morino ,  Yuki Okamoto ,  Keiji Hanzawa ,  Hiromu Kikawa ,  Akio Yasukawa

IPC分类号： G01F1/68

CPC分类号： G01F1/6845 ,  G01F5/00 ,  G01F15/12

摘要： An air flow measuring instrument, comprising: an auxiliary passage 8 arranged inside a main passage through which fluid flows, a tabular member 5 on which a pattern of a heating resistor for measuring an air flow is provided on one face 5a, the tabular member being disposed inside the auxiliary passage so that the one face 5a on which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage 8, a heating resistor pattern-side fluid passage 8a portion formed so that the fluid flows between the face 5a and a passage-forming surface 8d of the auxiliary passage, and a back-surface 8b side fluid passage portion formed so that fluid flows between a face 5b on a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portion 13 guiding dust that collides against the end portion to back-surface side fluid passage portion 8b side is provided on upstream-side end of tabular member.

摘要翻译： 一种气流测量仪器，包括：辅助通道8，布置在流体流过的主通道内部;平板状构件5，在一个面5a上设置有用于测量气流的加热电阻器的图案，平板状构件为 设置在辅助通道内部，使得设置有平板状构件的加热电阻体图形的一个面5a沿着辅助通道8内的流体流布置，形成的加热电阻器图案侧流体通道8a部分， 流体在表面5a和辅助通道的通道形成表面8d之间流动，并且后表面8b侧流体通道部分形成为使得流体在与板状构件的表面相对的一侧的表面5b和 辅助通道的通道形成表面。 引导部分13引导与端部至后表面侧流体通道部分8b侧碰撞的灰尘，该引导部分13设置在平板状部件的上游侧端部。

公开(公告)号：US07469582B2

公开(公告)日：2008-12-30

申请号：US11905490

申请日：2007-10-01

申请人： Naoki Saito ,  Masayuki Kozawa ,  Shinya Igarashi ,  Hiromu Kikawa ,  Akio Yasukawa ,  Akira Takasago

发明人： Naoki Saito ,  Masayuki Kozawa ,  Shinya Igarashi ,  Hiromu Kikawa ,  Akio Yasukawa ,  Akira Takasago

IPC分类号： G01F1/68

CPC分类号： G01F1/684 ,  F02D41/187 ,  G01F1/6842 ,  G01F1/688 ,  G01F1/69 ,  G01F5/00

摘要： A heating resistor type flow measuring device comprising a housing having a support part provided between a frame body and a connector and connected to the mounting part of a fluid passage, a flow rate detection element held on the frame body side of the housing, and an electronic circuit held on the housing and connected electrically to the flow rate detection element and the connector, wherein the electronic circuit is held on the frame body side of the housing and positioned in the fluid passage, a member with the rigidity higher than the material of the main structural member of the housing is formed integrally with the support part, the housing is fixed to the fluid passage through the member with high rigidity. A metal plate is inserted into the support part so as to increase rigidity. Further, a distance is provided between the support part and a metal plate forming a route for conducting the heat transferred to the metal base fixing an electronic circuit substrate by a plastic mold so as to form a structure obstructing a heat transfer, or a clearance is provided in a portion spaced by the plastic mold between the support part and the metal base so as to form a structure obstructing a heat transfer.

摘要翻译： 一种加热电阻器型流量测量装置，包括：壳体，其具有设置在框体和连接器之间的支撑部，并且连接到流体通道的安装部分;流量检测元件，其保持在壳体的框体侧;以及 电子电路保持在壳体上并与流量检测元件和连接器电连接，其中电子电路被保持在壳体的框架主体侧并且定位在流体通道中，刚性高于 壳体的主结构构件与支撑部一体地形成，壳体通过构件以高刚性固定到流体通道。 将金属板插入支撑部，以增加刚性。 此外，在支撑部分和金属板之间设置一个距离，该金属板形成用于传导通过塑料模具固定电子电路基板的传送到金属基座的热量的路线，以便形成阻碍热传递的结构，或者间隙是 设置在由塑料模具在支撑部分和金属基座之间间隔开的部分中，以形成阻碍热传递的结构。