公开(公告)号：US07212091B2

公开(公告)日：2007-05-01

申请号：US11053732

申请日：2005-02-08

申请人： Panayotis Constantinou Andricacos ,  L. Paivikki Buchwalter ,  Hariklia Deligianni ,  Robert A. Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Michael Meixner ,  David Earle Seeger ,  Timothy D. Sullivan ,  Ping-Chuan Wang

发明人： Panayotis Constantinou Andricacos ,  L. Paivikki Buchwalter ,  Hariklia Deligianni ,  Robert A. Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Michael Meixner ,  David Earle Seeger ,  Timothy D. Sullivan ,  Ping-Chuan Wang

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H2001/0078

摘要： A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.

摘要翻译： 一种微机电开关，包括：至少一对致动器电极; 分别输入和输出射频信号的至少一个输入电极和至少一个输出电极; 以及可由所述至少一对致动器电极之间的吸引部移动的光束，所述可移动光束具有至少一部分电连接到所述至少一个输入电极，并且当所述至少一个输入电极在所述至少一个输入电极之间被所述吸引力移动时， 至少一对致动器电极，用于在所述至少一个输入和输出电极之间形成电连接; 其中所述至少一对致动器电极与所述至少一个输入和输出电极中的每一个电隔离。 微机电开关可以配置为单极或多极和/或单掷或多掷。

公开(公告)号：US06876282B2

公开(公告)日：2005-04-05

申请号：US10150285

申请日：2002-05-17

申请人： Panayotis Constantinou Andricacos ,  L. Paivikki Buchwalter ,  Hariklia Deligianni ,  Robert A. Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Michael Meixner ,  David Earle Seeger ,  Timothy D. Sullivan ,  Ping-Chuan Wang

发明人： Panayotis Constantinou Andricacos ,  L. Paivikki Buchwalter ,  Hariklia Deligianni ,  Robert A. Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Michael Meixner ,  David Earle Seeger ,  Timothy D. Sullivan ,  Ping-Chuan Wang

IPC分类号： H01H59/00 ,  H01H51/22

CPC分类号： H01H59/0009 ,  H01H2001/0078

摘要： A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.

摘要翻译： 一种微机电开关，包括：至少一对致动器电极; 分别输入和输出射频信号的至少一个输入电极和至少一个输出电极; 以及可由所述至少一对致动器电极之间的吸引部移动的光束，所述可移动光束具有至少一部分电连接到所述至少一个输入电极，并且当所述至少一个输入电极在所述至少一个输入电极之间被所述吸引力移动时， 至少一对致动器电极，用于在所述至少一个输入和输出电极之间形成电连接; 其中所述至少一对致动器电极与所述至少一个输入和输出电极中的每一个电隔离。 微机电开关可以配置为单极或多极和/或单掷或多掷。

公开(公告)号：US06639488B2

公开(公告)日：2003-10-28

申请号：US09948478

申请日：2001-09-07

申请人： Hariklia Deligianni ,  Robert Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Panayotis Andricacos ,  John Cotte ,  L. Paivikki Buchwalter ,  David Seeger ,  Raul E. Acosta

发明人： Hariklia Deligianni ,  Robert Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Panayotis Andricacos ,  John Cotte ,  L. Paivikki Buchwalter ,  David Seeger ,  Raul E. Acosta

IPC分类号： H01P110

CPC分类号： H01P1/12 ,  H01H59/0009 ,  H01H2059/0036

摘要： Disclosed is a capacitive electrostatic MEMS RF switch comprised of a lower electrode that acts as both a transmission line and as an actuation electrode. Also, there is an array of one or more fixed beams above the lower electrode that is connected to ground. The lower electrode transmits the RF signal when the top beam or beams are up and when the upper beams are actuated and bent down, the transmission line is shunted to ground ending the RF transmission. A high dielectric constant material is used in the capacitive portion of the switch to achieve a high capacitance per unit area thus reducing the required chip area and enhancing the insertion loss characteristics in the non-actuated state. A gap between beam and lower electrode of less than 1 &mgr;m is incorporated in order to minimize the electrostatic potential (pull-in voltage) required to actuate the switch.

摘要翻译： 公开了一种电容静电MEMS RF开关，其由作为传输线和致动电极两者的下电极组成。 此外，在下电极上方有一个或多个连接到地面的固定梁的阵列。 当顶部梁或梁向上时，下部电极发射RF信号，并且当上部梁被致动并向下弯曲时，传输线被分流到结束RF传输的地面。 在开关的电容部分中使用高介电常数材料以实现每单位面积的高电容，从而在非致动状态下减少所需的芯片面积并增强插入损耗特性。 引入小于1um的光束和下电极之间的间隙以便使致动开关所需的静电电位（拉入电压）最小化。

公开(公告)号：US07581314B2

公开(公告)日：2009-09-01

申请号：US11358823

申请日：2006-02-21

申请人： Hariklia Deligianni ,  Panayotis Andricacos ,  L. Paivikki Buchwalter ,  John M. Cotte ,  Christopher Jahnes ,  Mahadevaiyer Krishnan ,  John H. Magerlein ,  Kenneth Stein ,  Richard P. Volant ,  James A. Tornello ,  Jennifer Lund

发明人： Hariklia Deligianni ,  Panayotis Andricacos ,  L. Paivikki Buchwalter ,  John M. Cotte ,  Christopher Jahnes ,  Mahadevaiyer Krishnan ,  John H. Magerlein ,  Kenneth Stein ,  Richard P. Volant ,  James A. Tornello ,  Jennifer Lund

IPC分类号： H01K3/10

CPC分类号： H01H59/0009 ,  H01H2001/0052 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49204

摘要： A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.

摘要翻译： 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统（MEMS）开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术，材料和工艺完全兼容铜芯片金属化工艺，通常是低成本和低温工艺（低于400℃）。 MEMS开关包括：在空腔内的可移动光束，可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极，其嵌入在所述空腔的壁中并且面向所述第一电极，其中所述第一和第二电极分别被所述贵金属接触物覆盖。

公开(公告)号：US07202764B2

公开(公告)日：2007-04-10

申请号：US10604278

申请日：2003-07-08

申请人： Hariklia Deligianni ,  Panayotis Andricacos ,  L. Paivikki Buchwalter ,  John M. Cotte ,  Christopher Jahnes ,  Mahadevaiyer Krishnan ,  John H. Magerlein ,  Kenneth Stein ,  Richard P. Volant ,  James A. Tornello ,  Jennifer Lund

发明人： Hariklia Deligianni ,  Panayotis Andricacos ,  L. Paivikki Buchwalter ,  John M. Cotte ,  Christopher Jahnes ,  Mahadevaiyer Krishnan ,  John H. Magerlein ,  Kenneth Stein ,  Richard P. Volant ,  James A. Tornello ,  Jennifer Lund

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H2001/0052 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49204

摘要： A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.

摘要翻译： 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统（MEMS）开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术，材料和工艺完全兼容铜芯片金属化工艺，通常是低成本和低温工艺（低于400℃）。 MEMS开关包括：在空腔内的可移动光束，可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极，其嵌入在所述空腔的壁中并且面向所述第一电极，其中所述第一和第二电极分别被所述贵金属接触物覆盖。

公开(公告)号：US20060164194A1

公开(公告)日：2006-07-27

申请号：US11358823

申请日：2006-02-21

申请人： Hariklia Deligianni ,  Panayotis Andricacos ,  L. Paivikki Buchwalter ,  John Cotte ,  Christopher Jahnes ,  Mahadevaiyer Krishnan ,  John Magerlein ,  Kenneth Stein ,  Richard Volant ,  James Tornello ,  Jennifer Lund

发明人： Hariklia Deligianni ,  Panayotis Andricacos ,  L. Paivikki Buchwalter ,  John Cotte ,  Christopher Jahnes ,  Mahadevaiyer Krishnan ,  John Magerlein ,  Kenneth Stein ,  Richard Volant ,  James Tornello ,  Jennifer Lund

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H2001/0052 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49204

摘要： A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.

摘要翻译： 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统（MEMS）开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术，材料和工艺完全兼容铜芯片金属化工艺，通常是低成本和低温工艺（低于400℃）。 MEMS开关包括：在空腔内的可移动光束，可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极，其嵌入在所述空腔的壁中并且面向所述第一电极，其中所述第一和第二电极分别被所述贵金属接触物覆盖。

公开(公告)号：US20080179755A1

公开(公告)日：2008-07-31

申请号：US11669924

申请日：2007-01-31

申请人： Paul S. Andry ,  L. Paivikki Buchwalter ,  Anurag Jain ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Michelle L. Steen ,  Cornelia K. Tsang

发明人： Paul S. Andry ,  L. Paivikki Buchwalter ,  Anurag Jain ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Michelle L. Steen ,  Cornelia K. Tsang

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process and structure for enabling the creation of reliable electrical through-via connections in a semiconductor substrate and a process for filling vias. Problems associated with under etch, over etch and flaring of deep Si RIE etched through-vias are mitigated, thereby vastly improving the integrity of the insulation and metallization layers used to convert the through-vias into highly conductive pathways across the Si wafer thickness. By using an insulating collar structure in the substrate in one case and by filling the via in accordance with the invention in another case, whole wafer yield of electrically conductive through vias is greatly enhanced.

摘要翻译： 一种用于在半导体衬底中创建可靠的电通孔连接的工艺和结构以及用于填充过孔的工艺。 与深蚀刻Si RIE蚀刻通孔相切的蚀刻，过蚀刻和扩散相关的问题得到缓解，从而大大提高了用于将通孔转换成穿过Si晶片厚度的高导电通路的绝缘层和金属化层的完整性。 通过在一种情况下通过在衬底中使用绝缘套环结构，并且在另一种情况下通过填充根据本发明的通孔，大大增强了导电通孔的整个晶片产量。

公开(公告)号：US06372081B1

公开(公告)日：2002-04-16

申请号：US09225572

申请日：1999-01-05

申请人： Cyprian E. Uzoh ,  L. Paivikki Buchwalter

发明人： Cyprian E. Uzoh ,  L. Paivikki Buchwalter

IPC分类号： C23F102

CPC分类号： H01L21/6708 ,  C23F1/18 ,  H01L21/32134 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process for removing material from a substrate. The material is exposed to an aqueous solution comprising about 4% to about 30% of at least one acid and at least one surfactant.

摘要翻译： 一种从基材中除去材料的方法。 该材料暴露于包含约4％至约30％的至少一种酸和至少一种表面活性剂的水溶液中。