Formation of devices by epitaxial layer overgrowth
    9.
    发明授权
    Formation of devices by epitaxial layer overgrowth 有权
    通过外延层过度生长形成器件

    公开(公告)号:US08034697B2

    公开(公告)日:2011-10-11

    申请号:US12680872

    申请日:2009-09-18

    IPC分类号: H01L21/20 H01L21/36

    摘要: Methods and structures are provided for formation of devices, e.g., solar cells, on substrates including, e.g., lattice-mismatched materials, by the use of aspect ratio trapping (ART) and epitaxial layer overgrowth (ELO). In general, in a first aspect, embodiments of the invention may include a method of forming a structure. The method includes forming a first opening in a masking layer disposed over a substrate that includes a first semiconductor material. A first layer, which includes a second semi-conductor material lattice-mismatched to the first semiconductor material, is formed within the first opening. The first layer has a thickness sufficient to extend above a top surface of the masking layer. A second layer, which includes the second semiconductor material, is formed on the first layer and over at least a portion of the masking layer. A vertical growth rate of the first layer is greater than a lateral growth rate of the first layer and a lateral growth rate of the second layer is greater than a vertical growth rate of the second layer.

    摘要翻译: 提供了用于通过使用纵横比捕获(ART)和外延层过度生长(ELO)在基底上形成诸如晶格失配的材料的器件(例如太阳能电池)的方法和结构。 通常,在第一方面中,本发明的实施例可以包括形成结构的方法。 该方法包括在设置在包括第一半导体材料的衬底之上的掩模层中形成第一开口。 包括与第一半导体材料晶格失配的第二半导体材料的第一层形成在第一开口内。 第一层具有足以在掩模层的顶表面上方延伸的厚度。 包括第二半导体材料的第二层形成在第一层上并且在掩模层的至少一部分之上。 第一层的垂直生长速率大于第一层的横向生长速率,第二层的横向生长速率大于第二层的垂直生长速率。

    Formation of Devices by Epitaxial Layer Overgrowth
    10.
    发明申请
    Formation of Devices by Epitaxial Layer Overgrowth 有权
    通过外延层生长形成器件

    公开(公告)号:US20100216277A1

    公开(公告)日:2010-08-26

    申请号:US12680872

    申请日:2009-09-18

    摘要: Methods and structures are provided for formation of devices, e.g., solar cells, on substrates including, e.g., lattice-mismatched materials, by the use of aspect ratio trapping (ART) and epitaxial layer overgrowth (ELO). In general, in a first aspect, embodiments of the invention may include a method of forming a structure. The method includes forming a first opening in a masking layer disposed over a substrate that includes a first semiconductor material. A first layer, which includes a second semi-conductor material lattice-mismatched to the first semiconductor material, is formed within the first opening. The first layer has a thickness sufficient to extend above a top surface of the masking layer. A second layer, which includes the second semiconductor material, is formed on the first layer and over at least a portion of the masking layer. A vertical growth rate of the first layer is greater than a lateral growth rate of the first layer and a lateral growth rate of the second layer is greater than a vertical growth rate of the second layer.

    摘要翻译: 提供了用于通过使用纵横比捕获(ART)和外延层过度生长(ELO)在基底上形成诸如晶格失配的材料的器件(例如太阳能电池)的方法和结构。 通常,在第一方面中,本发明的实施例可以包括形成结构的方法。 该方法包括在设置在包括第一半导体材料的衬底之上的掩模层中形成第一开口。 包括与第一半导体材料晶格失配的第二半导体材料的第一层形成在第一开口内。 第一层具有足以在掩模层的顶表面上方延伸的厚度。 包括第二半导体材料的第二层形成在第一层上并且在掩模层的至少一部分之上。 第一层的垂直生长速率大于第一层的横向生长速率,第二层的横向生长速率大于第二层的垂直生长速率。