公开(公告)号：US20200050676A1

公开(公告)日：2020-02-13

申请号：US16058724

申请日：2018-08-08

申请人： Peijie Li ,  Yu Gu ,  Hongqin Song

发明人： Peijie Li ,  Yu Gu ,  Hongqin Song

IPC分类号： G06F17/30 ,  G06F12/126 ,  G06F12/0875

摘要： A data system may dynamically prioritize and ingest data so that, regardless of the memory size of the dataset hosted by the data system, it may process and analyze the hosted dataset in constant time. The system and method may implement a first space-efficient probabilistic data structure on the dataset, wherein the dataset includes a plurality of profile data. It may then receive update data corresponding to some of the plurality of profile data and implement a second space-efficient probabilistic data structure on the dataset including the update data. The system and method may then determine a set of non-shared profile data of the second space-efficient probabilistic data structure and prioritize the set of non-shared profile data of the second space-efficient probabilistic data structure over other profile data of the dataset for caching.

公开(公告)号：US09082780B2

公开(公告)日：2015-07-14

申请号：US13428439

申请日：2012-03-23

申请人： Yaojian Lin ,  Kang Chen ,  Yu Gu

发明人： Yaojian Lin ,  Kang Chen ,  Yu Gu

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/538

CPC分类号： H01L21/563 ,  H01L21/568 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/19 ,  H01L2924/00012 ,  H01L2224/03

摘要： A semiconductor device has a semiconductor die. An encapsulant is deposited around the semiconductor die. An interconnect structure having a conductive bump is formed over the encapsulant and semiconductor die. A mechanical support layer is formed over the interconnect structure and around the conductive bump. The mechanical support layer is formed over a corner of the semiconductor die and over a corner of the interconnect structure. An opening is formed through the encapsulant that extends to the interconnect structure. A conductive material is deposited within the opening to form a conductive through encapsulant via (TEV) that is electrically connected to the interconnect structure. A semiconductor device is mounted to the TEV and over the semiconductor die to form a package-on-package (PoP) device. A warpage balance layer is formed over the encapsulant opposite the interconnect structure.

摘要翻译： 半导体器件具有半导体管芯。 围绕半导体管芯沉积密封剂。 具有导电凸块的互连结构形成在密封剂和半导体管芯上。 机械支撑层形成在互连结构上并且围绕导电凸块。 机械支撑层形成在半导体管芯的拐角上并且在互连结构的拐角上。 通过延伸到互连结构的密封剂形成开口。 导电材料沉积在开口内以形成导电的通过密封剂通过（TEV）电连接到互连结构。 将半导体器件安装到TEV并在半导体管芯上方形成封装封装（PoP）器件。 在与互连结构相对的密封剂上形成翘曲平衡层。

公开(公告)号：US20130249115A1

公开(公告)日：2013-09-26

申请号：US13429119

申请日：2012-03-23

申请人： Yaojian Lin ,  Pandi Chelvam Marimuthu ,  Kang Chen ,  Yu Gu

发明人： Yaojian Lin ,  Pandi Chelvam Marimuthu ,  Kang Chen ,  Yu Gu

IPC分类号： H01L23/52 ,  H01L21/56

CPC分类号： H01L23/481 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L23/28 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5283 ,  H01L23/5389 ,  H01L24/10 ,  H01L24/19 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24155 ,  H01L2224/24195 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/00012

摘要： A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted to the die attach area with a back surface opposite the carrier. A modular interconnect unit is mounted over the carrier and around or in a peripheral region around the semiconductor die such that the modular interconnect unit is offset from the back surface of the semiconductor die. An encapsulant is deposited over the carrier, semiconductor die, and modular interconnect unit. A first portion of the encapsulant is removed to expose the semiconductor die and a second portion is removed to expose the modular interconnect unit. The carrier is removed. An interconnect structure is formed over the semiconductor die and modular interconnect unit. The modular interconnect unit includes a vertical interconnect structures or bumps through the semiconductor device. The modular interconnect unit forms part of an interlocking pattern around the semiconductor die.

摘要翻译： 半导体器件具有带有裸片附着区域的载体。 半导体管芯安装到具有与载体相对的后表面的管芯附着区域。 模块化互连单元安装在载体上并且围绕半导体管芯周围或周围区域安装，使得模块化互连单元偏离半导体管芯的后表面。 密封剂沉积在载体，半导体管芯和模块化互连单元上。 去除密封剂的第一部分以暴露半导体管芯，并且移除第二部分以露出模块化互连单元。 载体被移除。 在半导体管芯和模块化互连单元上形成互连结构。 模块化互连单元包括通过半导体器件的垂直互连结构或凸块。 模块化互连单元形成围绕半导体管芯的互锁图案的一部分。

公开(公告)号：US20120187584A1

公开(公告)日：2012-07-26

申请号：US13164015

申请日：2011-06-20

申请人： Yaojian Lin ,  Kang Chen ,  Yu Gu ,  Wei Meng ,  Chee Siang Ong

发明人： Yaojian Lin ,  Kang Chen ,  Yu Gu ,  Wei Meng ,  Chee Siang Ong

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/562 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/29 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. A first insulating layer is formed over the die and encapsulant. The first insulating layer is cured with multiple dwell cycles to enhance adhesion to the die and encapsulant. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. The second insulating layer is cured with multiple dwell cycles to enhance adhesion to the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. The first, second, and third insulating layers have different CTE. The second insulating layer or third insulating layer is cured to a dense state to block moisture.

摘要翻译： 半导体器件具有沉积在半导体管芯上的半导体管芯和密封剂。 在管芯和密封剂上形成第一绝缘层。 第一绝缘层通过多个停留周期固化，以增强与管芯和密封剂的粘合性。 在第一绝缘层上形成第一导电层。 在第一绝缘层和第一导电层上形成第二绝缘层。 第二绝缘层通过多个停留循环固化，以增强与第一绝缘层和第一导电层的粘合性。 在第二绝缘层和第一导电层上形成第二导电层。 在第二绝缘层和第二导电层上形成第三绝缘层。 第一，第二和第三绝缘层具有不同的CTE。 第二绝缘层或第三绝缘层固化至致密状态以阻止水分。

公开(公告)号：US20120112340A1

公开(公告)日：2012-05-10

申请号：US13333739

申请日：2011-12-21

申请人： Yaojian Lin ,  Pandi C. Marimuthu ,  Kang Chen ,  Hin Hwa Goh ,  Yu Gu ,  Il Kwon Shim ,  Rui Huang ,  Seng Guan Chow ,  Jianmin Fang ,  Xia Feng

发明人： Yaojian Lin ,  Pandi C. Marimuthu ,  Kang Chen ,  Hin Hwa Goh ,  Yu Gu ,  Il Kwon Shim ,  Rui Huang ,  Seng Guan Chow ,  Jianmin Fang ,  Xia Feng

IPC分类号： H01L23/52 ,  H01L21/56 ,  H01L21/78

CPC分类号： H01L23/3114 ,  H01L21/31 ,  H01L21/56 ,  H01L21/568 ,  H01L21/768 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/522 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/19 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/214

摘要： A semiconductor device has a semiconductor die and conductive layer formed over a surface of the semiconductor die. A first channel can be formed in the semiconductor die. An encapsulant is deposited over the semiconductor die. A second channel can be formed in the encapsulant. A first insulating layer is formed over the semiconductor die and first conductive layer and into the first channel. The first insulating layer extends into the second channel. The first insulating layer has characteristics of tensile strength greater than 150 MPa, elongation between 35-150%, and thickness of 2-30 micrometers. A second insulating layer can be formed over the semiconductor die prior to forming the first insulating layer. An interconnect structure is formed over the semiconductor die and encapsulant. The interconnect structure is electrically connected to the first conductive layer. The first insulating layer provides stress relief during formation of the interconnect structure.

摘要翻译： 半导体器件具有形成在半导体管芯的表面上的半导体管芯和导电层。 可以在半导体管芯中形成第一通道。 密封剂沉积在半导体管芯上。 可以在密封剂中形成第二通道。 在半导体管芯和第一导电层上形成第一绝缘层并进入第一沟道。 第一绝缘层延伸到第二通道中。 第一绝缘层的拉伸强度大于150MPa，伸长率在35-150％之间，厚度为2-30微米。 在形成第一绝缘层之前，可以在半导体管芯上方形成第二绝缘层。 在半导体管芯和密封剂上形成互连结构。 互连结构电连接到第一导电层。 第一绝缘层在形成互连结构期间提供应力释放。

公开(公告)号：US20100157840A1

公开(公告)日：2010-06-24

申请号：US12317420

申请日：2008-12-22

申请人： Subhabrata Sen ,  Lee Breslau ,  Nicholas Duffield ,  Yu Gu

发明人： Subhabrata Sen ,  Lee Breslau ,  Nicholas Duffield ,  Yu Gu

IPC分类号： G06F11/30

CPC分类号： H04L43/0835 ,  H04L41/0213 ,  H04L41/142 ,  H04L41/5009 ,  H04L43/026 ,  H04L43/103 ,  Y02D50/30

摘要： A packet loss estimation technique is disclosed that utilizes the sampled flow level statistics that are routinely collected in operational networks, thereby obviating the need for any new router features or measurement infrastructure. The technique is specifically designed to handle the challenges of sampled flow-level aggregation such as information loss resulting from packet sampling, and generally comprises: receiving a first record of sampled packets for a flow from a first network element; receiving a second record of sampled packets for the flow from a second network element communicating with the first network element; correlating sampled packets from the flow at the first network element and the second network element to a measurement interval; and estimating the packet loss using a count of the sampled packets correlated to the measurement interval.

摘要翻译： 公开了一种利用在操作网络中常规收集的采样流量统计信息的分组丢失估计技术，从而避免了对任何新的路由器特征或测量基础设施的需要。 该技术专门设计用于处理采样流级聚合的挑战，例如由分组采样导致的信息丢失，并且通常包括：从第一网络元件接收流的第一采样分组记录; 从与第一网络元件通信的第二网络元件接收用于流的采样分组的第二记录; 将来自第一网元和第二网元的流的采样分组相关联到测量间隔; 以及使用与测量间隔相关联的采样分组的计数来估计分组丢失。

公开(公告)号：US20100118715A1

公开(公告)日：2010-05-13

申请号：US12478030

申请日：2009-06-04

申请人： Yu Gu ,  Geoff Jiang ,  Vishal Singh ,  Yueping Zhang

发明人： Yu Gu ,  Geoff Jiang ,  Vishal Singh ,  Yueping Zhang

IPC分类号： H04L12/26

CPC分类号： H04L41/142 ,  H04L43/0835 ,  H04L43/0858 ,  H04L43/50

摘要： Systems and methods are disclosed to probe a network includes generating a set of probing pairs from a network topology for unicast network delay tomography; probing the network using monitoring hosts in the network; and determining network performance from the probing results.

摘要翻译： 披露系统和方法来探测网络包括从用于单播网络延迟断层摄影的网络拓扑生成一组探测对; 使用网络中的监控主机探测网络; 并根据探测结果确定网络性能。

公开(公告)号：US20090190487A1

公开(公告)日：2009-07-30

申请号：US12022733

申请日：2008-01-30

申请人： Lee Breslau ,  Nicholas Duffield ,  Yu Gu ,  Subhabrata Sen

发明人： Lee Breslau ,  Nicholas Duffield ,  Yu Gu ,  Subhabrata Sen

IPC分类号： H04L12/26

CPC分类号： H04L12/4633 ,  H04L43/0864

摘要： A method and apparatus for providing performance measurements on network tunnels in packet networks are disclosed. For example, the method establishes two tunnels between a first measurement host and a first router, and establishes a tunnel between the first router and a second measurement host. The method also establishes a multicast group having a plurality of members, and sends one or more packets addressed to the multicast group from the first measurement host. The method measures the frequencies of directly and/or indirectly received responses from the plurality of members of the multicast group, and provides a plurality of estimated values for a plurality of packet transmission rates from measurement of the frequencies for one or more of said tunnels.

摘要翻译： 公开了一种用于在分组网络中的网络隧道上提供性能测量的方法和装置。 例如，该方法在第一测量主机和第一路由器之间建立两个隧道，并在第一路由器和第二测量主机之间建立隧道。 该方法还建立具有多个成员的多播组，并且从第一测量主机发送寻址到多播组的一个或多个分组。 该方法测量来自多播组的多个成员的直接和/或间接接收的响应的频率，并从测量一个或多个所述隧道的频率提供多个分组传输速率的多个估计值。

公开(公告)号：US20080024501A1

公开(公告)日：2008-01-31

申请号：US11825095

申请日：2007-07-03

申请人： Hitoshi Yamakado ,  Yu Gu ,  Atsushi Nagahara

发明人： Hitoshi Yamakado ,  Yu Gu ,  Atsushi Nagahara

IPC分类号： G06T11/20

CPC分类号： G06F17/211 ,  G06F17/24

摘要： A document editing support device includes: an object obtaining unit that obtains at least one object as data representing at least one of a text and an image included in a document as a target to be edited; a split ratio storage unit that stores a predetermined split ratio; a reference line setting unit that extracts two lines from at least one of a circumscribed polygon and a boundary and sets the extracted lines as reference lines, the circumscribed polygon being of an object other than a target object, a location of which is to be determined relative to at least one object obtained by the object obtaining unit, and the boundary being of a layout area where objects are to be located in the document; a virtual line generation unit that generates a virtual line that splits an interval between the two reference lines set by the reference line setting unit, at a split ratio stored in the split ratio storage unit; and a location unit that determines a location of the target object, the location of which is to be determined, along the virtual line generated by the virtual line generation unit, within the layout area.

摘要翻译： 文件编辑支援装置包括：对象获取单元，其将至少一个对象作为表示作为要编辑的对象的文档中包含的文本和图像中的至少一个的数据; 分割比率存储单元，其存储预定分割比; 参考线设置单元，从外接多边形和边界中的至少一个提取两行，并将所提取的线设置为参考线，所述外接多边形是除目标对象之外的对象，其位置将被确定 相对于由对象获取单元获得的至少一个对象，并且边界是其中对象将位于文档中的布局区域; 虚拟线生成单元，以存储在分割比率存储单元中的分割比率生成分割由基准线设定单元设定的两个基准线之间的间隔的虚拟线; 以及位置单元，其沿着虚拟线生成单元生成的虚拟线路在布局区域内确定要确定其位置的目标对象的位置。

公开(公告)号：US07308650B2

公开(公告)日：2007-12-11

申请号：US10924812

申请日：2004-08-25

申请人： Hitoshi Yamakado ,  Yu Gu ,  Toru Miyamoto

发明人： Hitoshi Yamakado ,  Yu Gu ,  Toru Miyamoto

IPC分类号： G06N3/00

CPC分类号： G06F17/211 ,  G06F3/0481 ,  G06T11/60

摘要： Aspects of the invention can relate to an image layout device and an image layout method. The image layout device of the invention can be a device that automatically arranges a plurality of images within a particular area, and can include a layout angle determining device that determines the layout angle for each of the images based on an angle that is an integer multiple of a golden angle, and a layout position determining device that determines the layout position for each of the images depending on the overlap between each of the images due to the angle determined by the layout angle determining device.

摘要翻译： 本发明的方面可以涉及图像布局设备和图像布局方法。 本发明的图像布局装置可以是在特定区域内自动布置多个图像的装置，并且可以包括布局角度确定装置，其基于作为整数倍的角度来确定每个图像的布局角度 以及布局位置确定装置，其根据由布局角度确定装置确定的角度的每个图像之间的重叠来确定每个图像的布局位置。