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公开(公告)号：US20070152310A1
公开(公告)日：2007-07-05
申请号：US11321856
申请日：2005-12-29
申请人： Philip Osborn , Teck-Gyu Kang , Ilyas Mohammed
发明人： Philip Osborn , Teck-Gyu Kang , Ilyas Mohammed
IPC分类号： H01L23/02
CPC分类号： H01L24/73 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/85 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49 , H01L2224/73215 , H01L2224/73259 , H01L2224/73277 , H01L2224/85 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic package including a dielectric element with at least one conductive ground pad. The package may also include a microelectronic element with at least one ground contact exposed at a rear surface of the element. The ground pad and the ground contact are electrically connected to each other by an electrically conducting material.
摘要翻译： 一种微电子封装，其包括具有至少一个导电接地焊盘的电介质元件。 封装还可以包括具有在元件的后表面处暴露的至少一个接地触头的微电子元件。 接地焊盘和接地触头通过导电材料彼此电连接。
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公开(公告)号：US20120155055A1
公开(公告)日：2012-06-21
申请号：US13157722
申请日：2011-06-10
申请人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
发明人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
CPC分类号： H01L24/81 , B23K1/0016 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/73 , H01L2224/13016 , H01L2224/13017 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/8138 , H01L2224/81801 , H01L2224/8185 , H01L2224/831 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K1/113 , H05K3/341 , H05K3/4007 , H05K2201/0195 , Y10T29/49126 , Y10T29/4913 , H01L2924/00 , H01L2924/00014
摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.
摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。
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公开(公告)号：US07453157B2
公开(公告)日：2008-11-18
申请号：US11140312
申请日：2005-05-27
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.
摘要翻译： 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括多个蚀刻的导电柱，其暴露在所述柔性基板的表面处并与所述微电子元件电互连，其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中，并且设置柔性层 在微电子元件的第一面和柔性基板之间，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的封装模具材料，由此封装模具材料覆盖在柔性基板的外部区域上。
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公开(公告)号：US09137903B2
公开(公告)日：2015-09-15
申请号：US13157722
申请日：2011-06-10
申请人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
发明人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
CPC分类号： H01L24/81 , B23K1/0016 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/73 , H01L2224/13016 , H01L2224/13017 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/8138 , H01L2224/81801 , H01L2224/8185 , H01L2224/831 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K1/113 , H05K3/341 , H05K3/4007 , H05K2201/0195 , Y10T29/49126 , Y10T29/4913 , H01L2924/00 , H01L2924/00014
摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.
摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。
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公开(公告)号：US08728865B2
公开(公告)日：2014-05-20
申请号：US13012949
申请日：2011-01-25
申请人： Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
发明人： Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , G01R31/2886 , H01L21/56 , H01L23/3128 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L23/49894 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and exposed within openings extending from an exterior surface of the molded dielectric material. The remote surfaces can be disposed at heights from said surface of said substrate which are lower or higher than a height of the exterior surface of the molded dielectric material from the substrate surface. The conductive elements can be arranged to simultaneously carry first and second different electric potentials: e.g., power, ground or signal potentials.
摘要翻译： 制造微电子组件的方法可以包括将电介质材料模制成围绕安装有微电子元件的衬底的高度突出的至少两个导电元件，使得导电元件的远端表面保持可接近并暴露在从 模制电介质材料的外表面。 所述远程表面可以从所述衬底的所述表面高度设置，所述表面低于或高于所述模制电介质材料的外表面与所述衬底表面的高度。 导电元件可被布置成同时携带第一和第二不同的电势：例如功率，接地或信号电位。
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公开(公告)号：US08093697B2
公开(公告)日：2012-01-10
申请号：US12769930
申请日：2010-04-29
申请人： Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
发明人： Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
IPC分类号： H01L23/02
CPC分类号： H01L21/565 , G01R31/2886 , H01L21/56 , H01L23/3128 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L23/49894 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.
摘要翻译： 制造微电子组件的方法包括提供具有衬底，覆盖衬底的微电子元件和从衬底的表面突出的至少两个导电元件的微电子封装，所述至少两个导电元件具有远离所述衬底的表面的表面 基质。 该方法包括压缩至少两个导电元件使其远端表面位于公共平面中，并且在压缩步骤之后，提供围绕至少两个导电元件的密封剂材料，用于支撑微电子封装并使得远端表面 所述至少两个导电元件在所述密封剂材料的外表面处保持可接近。
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公开(公告)号：US20110269272A1
公开(公告)日：2011-11-03
申请号：US13183122
申请日：2011-07-14
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L21/56
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US20100258956A1
公开(公告)日：2010-10-14
申请号：US12789683
申请日：2010-05-28
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US20100232129A1
公开(公告)日：2010-09-16
申请号：US12769930
申请日：2010-04-29
申请人： Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
发明人： Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
IPC分类号： H05K7/00
CPC分类号： H01L21/565 , G01R31/2886 , H01L21/56 , H01L23/3128 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L23/49894 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.
摘要翻译： 制造微电子组件的方法包括提供具有衬底，覆盖衬底的微电子元件和从衬底的表面突出的至少两个导电元件的微电子封装，所述至少两个导电元件具有远离所述衬底的表面的表面 基质。 该方法包括压缩至少两个导电元件使其远端表面位于公共平面中，并且在压缩步骤之后，提供围绕至少两个导电元件的密封剂材料，用于支撑微电子封装并使得远端表面 所述至少两个导电元件在所述密封剂材料的外表面处保持可接近。
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公开(公告)号：US07745943B2
公开(公告)日：2010-06-29
申请号：US11799771
申请日：2007-05-03
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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