摘要:
Embodiments of the present invention include a track fitting assembly comprising a main body, at least one pre-loaded stud assembly, and a track comprising a pair of lips. The at least one pre-loaded stud assembly comprises a stud and a compressing device. The at least one pre-loaded stud assembly comprises a clamped position, wherein the stud is coupled to the pair of lips and does not contact the compressing device. The at least one pre-loaded stud assembly also comprises an unclamped position, wherein the stud contacts the compressing device and does not contact the pair of lips. Other embodiments include the main body, at least one shear plunger assembly, and the track comprising the pair of lips, where the pair of lips comprise at least one circular opening. The at least one shear plunger assembly comprises a shear pin and a button. The at least one shear pin assembly comprises an disengaged position, wherein the button extends from the main body and the shear pin is positioned within the main body. The at least one shear plunger assembly also comprises an engaged position, wherein the button is positioned flush with the main body and the shear pin is extended from the main body and within the at least one circular opening.
摘要:
Described are track fitting assemblies having a main body with at least one plunger aperture, at least one button aperture intersecting the at least one plunger aperture, and at least one disengagement recess, at least one shear plunger assembly having a plunger, a shear pin, a plunger-spring, and a button comprising a recess, and a track with a pair of lips having at least one opening. The shear plunger assembly is configured to have a disengaged position, wherein the button is extended from the main body and the shear pin is positioned within the main body, and an engaged position, wherein the button is positioned substantially flush with the main body, the recess of the button is positioned substantially flush with the disengagement recess of the main body, and the shear pin is extended from the main body and within the at least one opening.
摘要:
Described are track fitting assemblies having a main body, at least one pre-loaded stud assembly, and a track comprising a pair of lips. The at least one pre-loaded stud assembly includes a stud and a compressing device, wherein the stud does not contact the compressing device in a clamped position and does not contact the pair of lips in an unclamped position. As examples, track fitting assemblies also include at least one shear plunger assembly having a shear pin and a button, wherein the button extends from the main body and the shear pin is positioned within the main body in a disengaged position, and the button is positioned flush with the main body and the shear pin is extended from the main body in an engaged position.
摘要:
Described are track fitting assemblies having a main body with at least one plunger aperture, at least one button aperture intersecting the at least one plunger aperture, and at least one disengagement recess, at least one shear plunger assembly having a plunger, a shear pin, a plunger-spring, and a button comprising a recess, and a track with a pair of lips having at least one opening. The shear plunger assembly is configured to have a disengaged position, wherein the button is extended from the main body and the shear pin is positioned within the main body, and an engaged position, wherein the button is positioned substantially flush with the main body, the recess of the button is positioned substantially flush with the disengagement recess of the main body, and the shear pin is extended from the main body and within the at least one opening.
摘要:
Graded dielectric layers and methods of fabricating such dielectric layers provide dielectrics in a variety of electronic structures for use in a wide range of electronic devices and systems. In an embodiment, a dielectric layer is graded with respect to a doping profile across the dielectric layer. In an embodiment, a dielectric layer is graded with respect to a crystalline structure profile across the dielectric layer. In an embodiment, a dielectric layer is formed by atomic layer deposition incorporating sequencing techniques to generate a doped dielectric material.
摘要:
Methods of forming an insulative element are described, including forming a first metal oxide material having a first dielectric constant, forming a second metal oxide material having a second dielectric constant different from the first, and heating at least portions of the structure to crystallize at least a portion of at least one of the first dielectric material and the second dielectric material. Methods of forming a capacitor are described, including forming a first electrode, forming a dielectric material with a first oxide and a second oxide over the first electrode, and forming a second electrode over the dielectric material. Structures including dielectric materials are also described.
摘要:
A capacitor structure includes a storage node; a capacitor dielectric on the storage node; and a plate electrode on the capacitor dielectric. The capacitor dielectric may include a Si-doped ZrO2 layer or crystalline ZrSiOx with a Si/(Zr+Si) content ranging between 4-9% by atomic ratio. The capacitor structure further includes an interfacial TiO2/TiON layer between the storage node and the capacitor dielectric.
摘要:
Some embodiments include methods of forming rutile-type titanium oxide. A monolayer of titanium nitride may be formed. The monolayer of titanium nitride may then be oxidized at a temperature less than or equal to about 550° C. to convert it into a monolayer of rutile-type titanium oxide. Some embodiments include methods of forming capacitors that have rutile-type titanium oxide dielectric, and that have at least one electrode comprising titanium nitride. Some embodiments include thermally conductive stacks that contain titanium nitride and rutile-type titanium oxide, and some embodiments include methods of forming such stacks.
摘要:
A capacitor structure includes a storage node; a capacitor dielectric on the storage node; and a plate electrode on the capacitor dielectric. The capacitor dielectric may include a Si-doped ZrO2 layer or crystalline ZrSiOx with a Si/(Zr+Si) content ranging between 4-9% by atomic ratio. The capacitor structure further includes an interfacial TiO2/TiON layer between the storage node and the capacitor dielectric.
摘要:
A method for using a metal bilayer is disclosed. First, a bottom electrode is provided. Second, a dielectric layer which is disposed on and is in direct contact with the lower electrode is provided. Then, a metal bilayer which serves as a top electrode in a capacitor is provided. The metal bilayer is disposed on and is in direct contact with the dielectric layer. The metal bilayer consists of a noble metal in direct contact with the dielectric layer and a metal nitride in direct contact with the noble metal.