公开(公告)号：US10141248B2

公开(公告)日：2018-11-27

申请号：US15385637

申请日：2016-12-20

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Koji Bando ,  Yukihiro Sato ,  Kazuhiro Mitamura

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/544 ,  H01L23/31

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

公开(公告)号：US10049968B2

公开(公告)日：2018-08-14

申请号：US15858493

申请日：2017-12-29

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yukihiro Sato ,  Akira Muto ,  Ryo Kanda ,  Takamitsu Kanazawa

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L27/06 ,  H01L29/739 ,  H01L25/075 ,  H02P27/06

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

公开(公告)号：US09997620B2

公开(公告)日：2018-06-12

申请号：US15621651

申请日：2017-06-13

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Nobuya Koike ,  Masaki Kotsuji ,  Yukihiro Narita

IPC: H01L29/739 ,  H01L29/78 ,  H01L23/495 ,  H01L23/00 ,  H01L23/538 ,  H01L29/66 ,  H01L21/48 ,  H01L23/552

CPC classification number: H01L29/7393 ,  H01L21/4842 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/538 ,  H01L23/552 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L29/66348 ,  H01L29/7397 ,  H01L29/7805 ,  H01L29/7813 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

公开(公告)号：US10217727B2

公开(公告)日：2019-02-26

申请号：US15501750

申请日：2014-08-25

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Norio Kido

IPC: H01L25/07 ,  H01L23/28 ,  H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H02P27/06 ,  H02P25/092

Abstract: For example, a semiconductor device capable of achieving a high performance applicable to an SR motor is provided. The semiconductor device includes a chip mounting portion TAB1 on which a semiconductor chip CHP1 having an IGBT is mounted, and a chip mounting portion TAB2 on which a semiconductor chip CHP2 having a diode is formed. The semiconductor device also includes a lead LD1A electrically connected to an emitter electrode pad EP of the semiconductor chip CHP1 via a clip CLP1, and a lead LD1B electrically connected to an anode electrode pad ADP of the semiconductor chip CHP2 via a clip CLP2. At this time, the chip mounting portion TAB1 is separated electrically from the chip mounting portion TAB2, and the clip CLP1 is separated electrically from the clip CLP2.

公开(公告)号：US20180261690A1

公开(公告)日：2018-09-13

申请号：US15977556

申请日：2018-05-11

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Nobuya Koike ,  Masaki Kotsuji ,  Yukihiro Narita

IPC: H01L29/739 ,  H01L29/66 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

公开(公告)号：US10453946B2

公开(公告)日：2019-10-22

申请号：US15977556

申请日：2018-05-11

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Nobuya Koike ,  Masaki Kotsuji ,  Yukihiro Narita

IPC: H01L29/739 ,  H01L23/538 ,  H01L23/495 ,  H01L23/00 ,  H01L29/78 ,  H01L29/66 ,  H01L21/48 ,  H01L23/552

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

公开(公告)号：US10056309B2

公开(公告)日：2018-08-21

申请号：US15655617

申请日：2017-07-20

Applicant: Renesas Electronics Corporation

Inventor： Koji Bando ,  Akira Muto

IPC: H01L23/053 ,  H01L23/057 ,  H01L23/495 ,  H01L23/50 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L23/433 ,  H01L25/11 ,  H02M7/00 ,  H01L23/31 ,  H01L29/739 ,  H01L29/78 ,  H01L29/861 ,  H01L23/373

Abstract: Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.

公开(公告)号：US09887151B2

公开(公告)日：2018-02-06

申请号：US15174568

申请日：2016-06-06

Applicant: Renesas Electronics Corporation

Inventor： Yukihiro Sato ,  Akira Muto ,  Ryo Kanda ,  Takamitsu Kanazawa

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L29/739 ,  H01L27/06 ,  H01L25/075 ,  H02P27/06

CPC classification number: H01L23/49562 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/0753 ,  H01L27/0664 ,  H01L29/7397 ,  H01L2224/0603 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/4903 ,  H01L2224/49111 ,  H02P27/06

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

公开(公告)号：US20170287818A1

公开(公告)日：2017-10-05

申请号：US15621651

申请日：2017-06-13

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Nobuya Koike ,  Masaki Kotsuji ,  Yukihiro Narita

IPC: H01L23/495

CPC classification number: H01L29/7393 ,  H01L21/4842 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/538 ,  H01L23/552 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L29/66348 ,  H01L29/7397 ,  H01L29/7805 ,  H01L29/7813 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

公开(公告)号：US09530723B2

公开(公告)日：2016-12-27

申请号：US14862102

申请日：2015-09-22

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Koji Bando ,  Yukihiro Sato ,  Kazuhiro Mitamura

IPC: H01L23/495 ,  H01L23/00 ,  B60L3/00 ,  B60L11/18 ,  B60L15/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/544

CPC classification number: H01L23/49575 ,  B60L3/003 ,  B60L11/1803 ,  B60L15/007 ,  B60L2220/12 ,  B60L2240/525 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49565 ,  H01L23/544 ,  H01L23/564 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/29116 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/40998 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/77704 ,  H01L2224/78704 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8485 ,  H01L2224/84862 ,  H01L2224/8585 ,  H01L2224/92147 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05559 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

Abstract translation: 假设在引线框架中设置一对悬挂部件，并且夹子包括主体部分和一对延伸部分，所述一对延伸部分被安装并支撑在所述一对悬挂部分上。 因此，夹子安装在一个引线（一点）上，一对悬挂部分（两点）和夹子被三个点支撑。