公开(公告)号：US4979862A

公开(公告)日：1990-12-25

申请号：US289278

申请日：1988-12-23

申请人： Richard A. Bartlett ,  Dominic A. Casale ,  John J. Konrad ,  James M. Larnerd ,  Donald R. Olson ,  Charles R. Pigos, Jr.

发明人： Richard A. Bartlett ,  Dominic A. Casale ,  John J. Konrad ,  James M. Larnerd ,  Donald R. Olson ,  Charles R. Pigos, Jr.

IPC分类号： C25D17/06 ,  B65G29/00 ,  B65G49/05 ,  C23C18/31 ,  C25D7/00 ,  H05K3/18 ,  H05K13/00

CPC分类号： H05K13/0061

摘要： An automatic loading mechanism for use in the manufacture of thin, metallic circuit board panels. The invention includes a lower drum unit which accepts the metallic panels from a conveyor system. The lower drum unit is rotatably mounted within a frame assembly, and includes a plurality of clamps which can automatically receive several metallic panels of varying size. The lower unit includes automatic clamp control means, and has the capability of rotating the panels from a horizontal to a vertical position or vice-versa. The lower drum unit guidingly feeds the metallic panels, through a spline assembly, to an upper unit. The uppper unit includes a plurality of clamps, in diametrically placed pairs, which delicately handle only the peripheral edge of the metallic panels while feeding them automatically into a rack assembly.

公开(公告)号：US07348677B2

公开(公告)日：2008-03-25

申请号：US11397713

申请日：2006-04-05

申请人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

发明人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

IPC分类号： H01L29/40

CPC分类号： H05K3/429 ,  H01L2224/13 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845

摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

摘要翻译： 一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。 一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。 也可以使用一个或多个孔连接所有三个导电层。 所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。 在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

公开(公告)号：US07157646B2

公开(公告)日：2007-01-02

申请号：US10882167

申请日：2004-07-02

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K1/11

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

摘要： A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

摘要翻译： 电路化基板，其包括多个邻接的开放段，其在导电层内限定面对的边缘部分，以隔离导电层的分离部分，使得该层可用于不同的功能，例如功率和接地元件内部的功能和接地元件 包括基板作为其一部分的产品（例如，电气组件）。 还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

公开(公告)号：US06483046B1

公开(公告)日：2002-11-19

申请号：US09559018

申请日：2000-04-24

申请人： David E. Houser ,  James M. Larnerd ,  Jeffrey L. Lee ,  Francis S. Poch

发明人： David E. Houser ,  James M. Larnerd ,  Jeffrey L. Lee ,  Francis S. Poch

IPC分类号： H01R909

CPC分类号： H05K3/403 ,  H05K3/0052 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2203/0228 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention provides a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation during conventional profiling, is removed or pre-profiled to off-set the leading edge of the plated through hole from a surface of the circuit board.

摘要翻译： 本发明提供一种电路板，其具有无毛刺的搪瓷电镀通孔。 特别地，在常规成形期间倾向于产生毛刺形成的电镀通孔的前缘被去除或预先形成以从电路板的表面偏移电镀通孔的前缘。

公开(公告)号：US4869418A

公开(公告)日：1989-09-26

申请号：US269137

申请日：1988-11-09

申请人： John P. Simpson ,  Gary L. Newman ,  James M. Larnerd ,  Alan J. Emerick

发明人： John P. Simpson ,  Gary L. Newman ,  James M. Larnerd ,  Alan J. Emerick

IPC分类号： B23K1/08 ,  H05K3/34

CPC分类号： B23K1/08 ,  B23K2201/42 ,  H05K3/3468

摘要： A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in the molten solder, the rack is vigorously agitated. The rack is then withdrawn from the molten solder and is pivoted upwardly while positioned over the molten solder. Simultaneously, an anvil is rotated from a home position to an impact position at precisely the correct moment. With the solder still molten on the substrate surfaces, the rack is then permitted to descend and is positively biased to strike the anvil thereby dislodging any excess molten solder. A unique supporting arrangement for the rack insures that only a minimum of mass acutally impacts against the anvil while insuring the effectiveness of the operation. Each cantilevered arm from which a rack is suspended is temporarily supported during the impacting operation after which the support member is withdrawn. Also, a solder pot of unique design and operation is provided to assure rapid, complete heating of substrates while eliminating contamination thereof by dross and oxides.

摘要翻译： 一种用于在凹陷销上产生冲洗焊料的方法和装置，以及在电路化基板中的通孔上。 在将基底承载架类似地浸入焊剂熔池中之后，将其浸入熔融焊料的容器中。 在熔融焊料中，架被剧烈搅动。 然后将架子从熔融焊料中取出，并且在定位在熔融焊料上方的同时向上枢转。 同时，在正确的时刻，砧座从起始位置旋转到冲击位置。 由于焊料仍然在基板表面上熔化，则允许齿条下降并且被正向偏压以撞击砧座，从而移除任何多余的熔融焊料。 机架的独特配套安排确保在确保操作的有效性的同时，只有最小的质量对砧座产生严重的影响。 在冲击操作期间暂时支撑悬挂架的每个悬臂，支撑构件被抽出之后。 此外，提供独特的设计和操作的焊料罐，以确保快速，完全地加热基板，同时消除浮渣和氧化物的污染。

公开(公告)号：US07814649B2

公开(公告)日：2010-10-19

申请号：US11482945

申请日：2006-07-10

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4641 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer.

摘要翻译： 一种制造电路化衬底的方法，该衬底包括沿着其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔开，其基本上填充开放段，例如在 层压工艺，其将基板的两个电介质层粘合到导电层。

公开(公告)号：US07377033B2

公开(公告)日：2008-05-27

申请号：US11641810

申请日：2006-12-20

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H01K3/10

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

摘要： A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.

摘要翻译： 一种制造电路化衬底的方法，其包括多个邻接的开放段，其限定导电层内的相对边缘部分以隔离导电层的分离部分，使得该层可用于不同的功能，例如电力和地面 元件，在包括基板作为其一部分的产品（例如，电气组件）内。 还提供了代表其中可以使用衬底的产品之一的信息处理系统，例如主机计算机。

公开(公告)号：US07211289B2

公开(公告)日：2007-05-01

申请号：US10737974

申请日：2003-12-18

申请人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

发明人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

IPC分类号： B05D5/12 ,  B28B19/00 ,  B29B15/10

CPC分类号： H05K3/429 ,  H01L2224/13 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845

摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

摘要翻译： 一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。 一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。 也可以使用一个或多个孔连接所有三个导电层。 所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。 在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

公开(公告)号：US07157647B2

公开(公告)日：2007-01-02

申请号：US10882170

申请日：2004-07-02

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K1/11

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4641 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

摘要翻译： 电路化衬底，其包括沿其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔离，所述阻挡层基本上填充开放段，例如在层压过程期间 将基板的两个电介质层粘合到导电层。 还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

公开(公告)号：US07491896B2

公开(公告)日：2009-02-17

申请号：US12010004

申请日：2008-01-18

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K1/11

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

摘要： An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within the system. At least one electrical component is positioned on and electrically coupled to the circuitized substrate of the system's electrical assembly.

摘要翻译： 一种信息处理系统，例如主机计算机，其包括作为其一部分的壳体，其中具有包括电路化基板的电组件，该电组件又包括多个邻接的开放段，其限定导电层内的相对边缘部分，以隔离单独的 导电层的部分，使得该层可用于不同的功能，例如作为系统内的功率和接地元件。 至少一个电气部件位于系统的电气组件的电路化基板上并电耦合到电路基板。