公开(公告)号：US07157646B2

公开(公告)日：2007-01-02

申请号：US10882167

申请日：2004-07-02

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K1/11

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

摘要： A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

摘要翻译： 电路化基板，其包括多个邻接的开放段，其在导电层内限定面对的边缘部分，以隔离导电层的分离部分，使得该层可用于不同的功能，例如功率和接地元件内部的功能和接地元件 包括基板作为其一部分的产品（例如，电气组件）。 还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

公开(公告)号：US07348677B2

公开(公告)日：2008-03-25

申请号：US11397713

申请日：2006-04-05

申请人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

发明人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

IPC分类号： H01L29/40

CPC分类号： H05K3/429 ,  H01L2224/13 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845

摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

摘要翻译： 一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。 一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。 也可以使用一个或多个孔连接所有三个导电层。 所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。 在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

公开(公告)号：US07814649B2

公开(公告)日：2010-10-19

申请号：US11482945

申请日：2006-07-10

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4641 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer.

摘要翻译： 一种制造电路化衬底的方法，该衬底包括沿着其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔开，其基本上填充开放段，例如在 层压工艺，其将基板的两个电介质层粘合到导电层。

公开(公告)号：US07377033B2

公开(公告)日：2008-05-27

申请号：US11641810

申请日：2006-12-20

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H01K3/10

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

摘要： A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.

摘要翻译： 一种制造电路化衬底的方法，其包括多个邻接的开放段，其限定导电层内的相对边缘部分以隔离导电层的分离部分，使得该层可用于不同的功能，例如电力和地面 元件，在包括基板作为其一部分的产品（例如，电气组件）内。 还提供了代表其中可以使用衬底的产品之一的信息处理系统，例如主机计算机。

公开(公告)号：US07211289B2

公开(公告)日：2007-05-01

申请号：US10737974

申请日：2003-12-18

申请人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

发明人： James M. Larnerd ,  John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

IPC分类号： B05D5/12 ,  B28B19/00 ,  B29B15/10

CPC分类号： H05K3/429 ,  H01L2224/13 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845

摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

摘要翻译： 一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。 一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。 也可以使用一个或多个孔连接所有三个导电层。 所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。 在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

公开(公告)号：US07157647B2

公开(公告)日：2007-01-02

申请号：US10882170

申请日：2004-07-02

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K1/11

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4641 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

摘要翻译： 电路化衬底，其包括沿其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔离，所述阻挡层基本上填充开放段，例如在层压过程期间 将基板的两个电介质层粘合到导电层。 还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

公开(公告)号：US07491896B2

公开(公告)日：2009-02-17

申请号：US12010004

申请日：2008-01-18

申请人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

发明人： John M. Lauffer ,  James M. Larnerd ,  Voya R. Markovich

IPC分类号： H05K1/11

CPC分类号： H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

摘要： An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within the system. At least one electrical component is positioned on and electrically coupled to the circuitized substrate of the system's electrical assembly.

摘要翻译： 一种信息处理系统，例如主机计算机，其包括作为其一部分的壳体，其中具有包括电路化基板的电组件，该电组件又包括多个邻接的开放段，其限定导电层内的相对边缘部分，以隔离单独的 导电层的部分，使得该层可用于不同的功能，例如作为系统内的功率和接地元件。 至少一个电气部件位于系统的电气组件的电路化基板上并电耦合到电路基板。

公开(公告)号：US08242376B2

公开(公告)日：2012-08-14

申请号：US12854252

申请日：2010-08-11

申请人： John M. Lauffer ,  Voya R. Markovich ,  Michael Wozniak

发明人： John M. Lauffer ,  Voya R. Markovich ,  Michael Wozniak

IPC分类号： H05K1/03

CPC分类号： H01L21/4857 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/383 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2203/0353 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/12556 ,  Y10T428/12993 ,  H01L2224/0401

摘要： A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.

摘要翻译： 其中两个导电层（例如，电镀铜箔）被结合（例如层压）到电介质层的电路化衬底。 物理地结合到电介质的两个箔表面中的每一个是光滑的（例如，优选通过化学处理），并且在其上包括薄的有机层，而两个箔的外表面也是光滑的（例如，优选也使用化学处理 步）。 这些导电层中的一个可以用作接地或电压平面，而另一个可以用作具有多个单独信号线作为其一部分的信号平面。 还提供了使用这种电路化基板的电气组件和信息处理系统。

公开(公告)号：US07977034B1

公开(公告)日：2011-07-12

申请号：US12657394

申请日：2010-01-20

申请人： John M. Lauffer ,  Voya R. Markovich ,  James J. McNamara, Jr. ,  Peter A. Moschak

发明人： John M. Lauffer ,  Voya R. Markovich ,  James J. McNamara, Jr. ,  Peter A. Moschak

IPC分类号： H05K3/02 ,  H05K3/06

CPC分类号： H05K3/4641 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/44 ,  H05K3/445 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0143 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.

摘要翻译： 使用连续辊式制造电路化基板的装置和方法，其中导体层被馈送到装置中，可光成像电介质层被施加到导体层的相对侧，穿过复合材料形成通孔， 然后在电介质上添加金属层，然后在其中形成图案（例如电路）。 除了这些之外，还进行了几个操作以形成最终终端产品，电路化基板（例如，印刷电路板），同时产品的导体层保持为固体形式，直到与连续层的最终分离 。

公开(公告)号：US07897877B2

公开(公告)日：2011-03-01

申请号：US11438424

申请日：2006-05-23

申请人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01L27/12 ,  H01L28/40 ,  H05K1/0306 ,  H05K3/125 ,  H05K3/4667 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2203/013

摘要： A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

摘要翻译： 电容性基板及其制造方法，其中使用第一和第二玻璃层。 第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。 然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。 形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。