-
公开(公告)号：US5264325A
公开(公告)日：1993-11-23
申请号：US918304
申请日：1992-07-21
申请人： Robert D. Allen , Richard A. Day , Donald H. Glatzel , William D. Hinsberg , John R. Mertz , David J. Russell , Gregory M. Wallraff
发明人： Robert D. Allen , Richard A. Day , Donald H. Glatzel , William D. Hinsberg , John R. Mertz , David J. Russell , Gregory M. Wallraff
CPC分类号： G03F7/2053 , G03F7/0385 , H05K3/0082 , H05K3/287
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which preferably is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. A third resin, either an epoxy cresol novolak or a polyepoxy resin, is also added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译： 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料，其适用于各种基材。 该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂优选为分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量％至72重量％的软化点为约60℃至约110℃，分子量为约600至2,500的溴化双酚A的环氧化缩水甘油醚。 树脂体系中还加入第三树脂，环氧甲酚酚醛清漆或聚环氧树脂。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，在330至700nm区域中的光的吸光度小于0.1。 任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。
-
公开(公告)号：US5439766A
公开(公告)日：1995-08-08
申请号：US976115
申请日：1992-11-13
申请人： Richard A. Day , Donald H. Glatzel , John R. Mertz , Joel L. Roth , David J. Russell , Logan L. Simpson
发明人： Richard A. Day , Donald H. Glatzel , John R. Mertz , Joel L. Roth , David J. Russell , Logan L. Simpson
IPC分类号： G03C1/725
CPC分类号： G03C1/725
摘要： According to the present invention, good image resolution of a cationically polymerized epoxy based coating, such as a solder mask or dielectric or etch resist, is provided by combining a cationically polymerized epoxy based coating with conventional epoxy glass substrates cured with a curing agent that does not produce basic reaction products. Preferably, the coating is photoimagable. The method for making the same is also provided. The coating material includes an epoxy resin system comprising between from about 10% to about 90%, preferably about 28% to about 57% by weight of a polyol epoxy resin, and from about 10% to about 90%, preferably about 43% to 72% by weight, of a brominated epoxy resin. Optionally, a polyepoxy resin or an epoxy creosol novolak resin is added to the resin system. The polyepoxy resin may be added from an effective amount up to less than 90% of the resin system; the epoxy creosol novolak may be added from an effective amount up to about 80 pph.
摘要翻译： 根据本发明，通过将阳离子聚合的环氧基涂层与用固化剂固化的常规环氧玻璃基底组合来提供阳离子聚合的环氧基涂层（例如焊料掩模或电介质或抗蚀剂）的良好图像分辨率， 不产生碱性反应产物。 优选地，涂层是可光成像的。 还提供了制造它们的方法。 涂料包括环氧树脂体系，其包含约10％至约90％，优选约28％至约57％重量的多元醇环氧树脂，以及约10％至约90％，优选约43％至 72重量％的溴化环氧树脂。 任选地，在树脂体系中加入聚环氧树脂或环氧酚醛清漆树脂。 聚环氧树脂可以从有效量添加到树脂体系的90％以下; 可以从高达约80pph的有效量加入环氧裂解酚醛清漆。
-
公开(公告)号：US5439779A
公开(公告)日：1995-08-08
申请号：US259355
申请日：1994-06-13
CPC分类号： G03F7/0385
摘要： The present invention provides a photoimageable soldermask that may be applied using aqueous solvents, thereby reducing the emission of organic solvents. The soldermask contains an epoxy based resin system comprised of at least one epoxy resin, a coating agent, and preferably a cationic photoinitiator and a dye.
摘要翻译： 本发明提供可以使用水性溶剂施用的可光成像的焊接掩模，从而减少有机溶剂的排放。 所述焊接掩模含有由至少一种环氧树脂，涂覆剂，优选阳离子光引发剂和染料组成的环氧树脂体系。
-
公开(公告)号：US5300402A
公开(公告)日：1994-04-05
申请号：US730149
申请日：1991-07-15
CPC分类号： G03F7/0385 , G03F7/2053 , H05K3/0082 , H05K3/287
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of 4,000 to 10,000; and if flame retardancy is required between about 35% and 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60 C. and about 110 C. and a molecular weight of between about 600 and 2,500. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film, and an effective amount of thixatropic agent. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译： 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料。 该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 约20％至约90％重量的分子量为4,000至10,000的环氧化八官能双酚A甲醛酚醛清漆树脂; 并且如果阻燃性需要约35重量％至50重量％的四氟双酚A的环氧化缩水甘油醚，其软化点为约60℃至约110℃，分子量为约600至2,500。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，330〜700nm区域的光的吸光度小于0.1，有效量的触变剂。 任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。
-
公开(公告)号：US5278010A
公开(公告)日：1994-01-11
申请号：US956831
申请日：1992-10-05
IPC分类号： G03C3/00
CPC分类号： G03C3/00
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of 4,000 to 10,000; and if flame retardancy is required between about 35% and 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译： 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料。 该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 约20％至约90％重量的分子量为4,000至10,000的环氧化八官能双酚A甲醛酚醛清漆树脂; 并且如果阻燃性需要约35重量％至50重量％的四溴双酚A的环氧化缩水甘油醚，其软化点在约60℃至约110℃之间，分子量为约600至 2,500。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，在330至700nm区域中的光的吸光度小于0.1。 任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。
-
公开(公告)号：US5026624A
公开(公告)日：1991-06-25
申请号：US318536
申请日：1989-03-03
CPC分类号： G03F7/0385 , Y10S430/122 , Y10S430/123
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of 4,000 to 10,000; and if flame retardancy is required between about 35% and 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
-
公开(公告)号：US5304457A
公开(公告)日：1994-04-19
申请号：US956836
申请日：1992-10-05
IPC分类号： G03C1/725
CPC分类号： G03C1/725
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of 4,000 to 10,000; and if flame retardancy is required between about 35% and 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
-
8.发明授权Construction of reliable stacked via in electronic substrates—vertical stiffness control method 有权在电子基板中构建可靠的堆叠通孔 - 垂直刚度控制方法公开(公告)号：US09099458B2
公开(公告)日：2015-08-04
申请号：US13539480
申请日：2012-07-01
IPC分类号： H05K1/11 , H05K1/09 , H01L23/498 , H05K3/46 , H05K1/02
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2224/05001 , H01L2224/05548 , H01L2224/05572 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H05K1/0271 , H05K1/116 , H05K3/4602 , H05K2201/0347 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/0969 , Y10T29/49155 , H01L2224/05599 , H01L2224/05099
摘要： A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes an etched pattern.
摘要翻译： 用于减小垂直刚度的堆叠通孔结构包括：多个堆叠的通孔，每个通孔设置在盘状结构上。 盘状结构包括支撑多个堆叠的通孔的平板通孔平台。 镀层通孔着色包括蚀刻图案。
-
9.发明授权Construction of reliable stacked via in electronic substrates—vertical stiffness control method 有权在电子基板中构建可靠的堆叠通孔 - 垂直刚度控制方法公开(公告)号：US08866026B2
公开(公告)日：2014-10-21
申请号：US13569826
申请日：2012-08-08
IPC分类号： H05K1/11 , H05K1/09 , H05K3/46 , H01L23/498 , H05K1/02
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2224/05001 , H01L2224/05548 , H01L2224/05572 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H05K1/0271 , H05K1/116 , H05K3/4602 , H05K2201/0347 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/0969 , Y10T29/49155 , H01L2224/05599 , H01L2224/05099
摘要： A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing with a thickness of substantially 3 μm. The platted through hole landing includes an etched pattern and a copper top surface.
摘要翻译： 用于减小垂直刚度的堆叠通孔结构包括：多个堆叠的通孔，每个通孔设置在盘状结构上。 盘状结构包括厚度基本为3μm的板状通孔着落。 镀层通孔着色包括蚀刻图案和铜顶表面。
-
公开(公告)号：US20120032321A1
公开(公告)日：2012-02-09
申请号：US12850404
申请日：2010-08-04
申请人： David J. West , David J. Russell
发明人： David J. West , David J. Russell
IPC分类号： H01L23/538 , H01L23/488 , H01L21/60
CPC分类号： H01L21/02697 , H01L23/49816 , H01L23/49838 , H01L23/544 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2223/54426 , H01L2223/54473 , H01L2224/1132 , H01L2224/13082 , H01L2224/13147 , H01L2224/1403 , H01L2224/14051 , H01L2224/14136 , H01L2224/14155 , H01L2224/14177 , H01L2224/14179 , H01L2224/16238 , H01L2224/17515 , H01L2224/17517 , H01L2224/81141 , H01L2224/81194 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2224/131 , H01L2924/00
摘要： An electronic apparatus and method of fabrication of the apparatus, the apparatus including a first electronic device having an interconnection surface with a first plurality of interconnection pads extending from the surface by a first distance and a second plurality of alignment posts extending from the surface by a second distance greater than the first distance, and a second electrical device having an interconnection surface with a first plurality of electrical interconnection pads, each pad arranged to contact a corresponding first electronic device interconnection surface pad upon assembly of the first electronic device interconnection surface upon the second electronic device interconnection surface, the second electronic device interconnection surface including a third plurality of alignment posts, each located to be adjacent to at least one of the first electronic device alignment posts upon assembly.
摘要翻译： 一种电子装置和该装置的制造方法，该装置包括第一电子装置，该第一电子装置具有互连表面，该第一电子装置具有从表面延伸第一距离的第一多个互连焊盘以及从该表面延伸的第二多个对准柱 第二距离大于第一距离;以及第二电气设备，其具有与第一多个电互连焊盘的互连表面，每个焊盘布置成在第一电子设备互连表面组装时接触相应的第一电子设备互连表面焊盘 第二电子设备互连表面，所述第二电子设备互连表面包括第三多个对准柱，每个定位柱在组装时定位成与所述第一电子设备对准柱中的至少一个相邻。
-
-
-
-
-
-
-
-
-
搜索结果
46 条记录 (耗时 0.03 秒)
