Semiconductor light emitting device having a rod shape, and display apparatus including the same

    公开(公告)号:US11527675B2

    公开(公告)日:2022-12-13

    申请号:US16749356

    申请日:2020-01-22

    Inventor: Tan Sakong

    Abstract: A semiconductor light emitting device includes a light emitting structure having a rod shape with first and second surfaces opposing each other and a side surface connected between the first and second surfaces, and including a first conductivity-type semiconductor providing the first surface, an active layer and a second conductivity-type semiconductor, a first electrode layer on a first region of the first surface of the light emitting structure and connected to the first conductivity-type semiconductor, the first region having a level that is vertically offset from a level of a second region adjacent thereto, and a second electrode layer connected to the second conductivity-type semiconductor.

    Semiconductor light emitting device and method of fabricating the same

    公开(公告)号:US11515449B2

    公开(公告)日:2022-11-29

    申请号:US16935356

    申请日:2020-07-22

    Abstract: Semiconductor light emitting devices and methods of fabricating the same are provided. The semiconductor light emitting device includes a light emitting structure, a first electrode, a first dielectric layer, a second electrode, and a vertical conductive pattern. The light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first opening that penetrates the second semiconductor layer and the active layer, the first opening exposing the first semiconductor layer. The first electrode fills at least a portion of the first opening. The first dielectric layer is on the first electrode. The second electrode is on the light emitting structure and covers the first dielectric layer, the second electrode being electrically connected to the second semiconductor layer. The vertical conductive pattern surrounds outer lateral surfaces of the light emitting structure and is electrically connected to the first electrode.

    Light emitting diode display device with separation film and partition aligning to each other

    公开(公告)号:US10892298B2

    公开(公告)日:2021-01-12

    申请号:US16205454

    申请日:2018-11-30

    Abstract: A light emitting diode display device is provided. The light emitting diode display device includes a first light emitting diode pixel including a first light emitting diode layer and a first color conversion material on the first light emitting diode layer, a second light emitting diode pixel including a second light emitting diode layer and a second color conversion material on the second light emitting diode layer, a separation film disposed between the first light emitting diode layer and the second light emitting diode layer and a partition disposed between the first color conversion material and the second color conversion material and including a partition material, wherein the first and second light emitting diode pixels are divided by the separation film and the partition, the partition is disposed on the separation film in alignment with the separation film such that the partition includes linear portions that extend in a first direction and the separation film includes linear portions that also extend in the first direction and vertically overlap the linear portions of the partition, and the partition material includes an insulating material different from silicon.

    Light emitting diode display device

    公开(公告)号:US10957833B2

    公开(公告)日:2021-03-23

    申请号:US16356283

    申请日:2019-03-18

    Abstract: A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.

    METHOD OF MANUFACTURING LIGHT EMITTING DIODE
    8.
    发明申请
    METHOD OF MANUFACTURING LIGHT EMITTING DIODE 审中-公开
    制造发光二极管的方法

    公开(公告)号:US20170062675A1

    公开(公告)日:2017-03-02

    申请号:US15219454

    申请日:2016-07-26

    Abstract: A method of manufacturing a light emitting diode (LED) includes forming a first material layer on a substrate, forming a second material layer on the first material layer, forming a photomask pattern on the second material layer, performing a first etching on the second material layer and a portion of the first material layer by using the photomask pattern as an etch mask, removing the photomask pattern, and forming a plurality of isolated structures by performing a second etching on the remaining portion of the first material layer until a top surface of the substrate is exposed.

    Abstract translation: 一种制造发光二极管(LED)的方法包括在基板上形成第一材料层,在第一材料层上形成第二材料层,在第二材料层上形成光掩模图案,对第二材料进行第一蚀刻 层和一部分第一材料层,通过使用光掩模图案作为蚀刻掩模,去除光掩模图案,以及通过对第一材料层的剩余部分进行第二蚀刻形成多个隔离结构,直到第 衬底被暴露。

    Method of manufacturing light emitting device
    9.
    发明授权
    Method of manufacturing light emitting device 有权
    制造发光器件的方法

    公开(公告)号:US08828751B2

    公开(公告)日:2014-09-09

    申请号:US13844569

    申请日:2013-03-15

    CPC classification number: H01L33/005 H01L33/26

    Abstract: Provided a method of manufacturing a semiconductor light emitting device, the method includes forming a light emitting structure by growing a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer on a substrate. The forming of the light emitting structure includes: forming a protective layer after a portion of the light emitting structure is formed forming a sacrificial layer on the protective layer; and continuously forming a further portion of the light emitting structure on the sacrificial layer.

    Abstract translation: 提供一种制造半导体发光器件的方法,该方法包括通过在衬底上生长第一导电类型半导体层,有源层和第二导电类型半导体层来形成发光结构。 发光结构的形成包括:在形成发光结构的一部分之后形成保护层,在保护层上形成牺牲层; 并且在牺牲层上连续地形成发光结构的另一部分。

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