公开(公告)号：US20140254092A1

公开(公告)日：2014-09-11

申请号：US14104435

申请日：2013-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Kyol Park ,  Hee-Jung Hwang

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.

Abstract translation: 包括该半导体封装的电子系统包括具有电路图案的封装板。 半导体芯片安装在封装板上并与封装板的电路图形电连接。 非接触式温度检测器设置有半导体封装，并且在不与外部热源接触的情况下检测外部热源的温度。 温度控制器根据由非接触式温度检测器检测到的外部热源的温度来控制半导体芯片。

公开(公告)号：US09666503B2

公开(公告)日：2017-05-30

申请号：US14104435

申请日：2013-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Kyol Park ,  Hee-Jung Hwang

IPC: G01J5/00 ,  G01K1/00 ,  G01K7/00 ,  H01L23/34 ,  H01L23/36 ,  H01L23/498 ,  H01L25/10 ,  H01L25/18 ,  H01L23/14

CPC classification number: H01L23/34 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.

公开(公告)号：US20140264339A1

公开(公告)日：2014-09-18

申请号：US14132790

申请日：2013-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Chul Kim ,  Hee-Jung Hwang ,  Seong-Ho Shin

IPC: F25B21/02 ,  H01L23/38 ,  H01L23/34

CPC classification number: F25B21/02 ,  F25B2321/0212 ,  H01L23/34 ,  H01L23/36 ,  H01L23/38 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the dielectric layer and a conductive pattern arranged on the dielectric layer and electrically connected to the thermoelectric element. The electrical characteristics of the thermoelectric element are interacted with heat generated from a heat source.

Abstract translation: 在散热片和包括其的半导体封装件中，散热片包括导热体，其具有活性面和与有源面相反的散开面，覆盖主体的有源面的电介质层，至少一个热电元件 布置在电介质层上，并且布置在电介质层上并与电热元件电连接的导电图案。 热电元件的电气特性与从热源产生的热量相互作用。

公开(公告)号：US09704815B2

公开(公告)日：2017-07-11

申请号：US15156327

申请日：2016-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Na Choi ,  Young-Deuk Kim ,  Jae-Choon Kim ,  Eon-Soo Jang ,  Hee-Jung Hwang

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/45099

Abstract: A package substrate may include an insulating substrate, internal circuits and a warpage-suppressing member. The insulating substrate may have a plurality of mount regions in which semiconductor chips may be mounted, and a peripheral region. The internal circuits may be arranged in the mount regions. The warpage-suppressing member is different from the semiconductor chips and may be arranged in at least one of the mount regions to suppress a warpage of the insulating substrate. Thus, warpage of the package substrate may be suppressed during a reflow process.

公开(公告)号：US09263492B2

公开(公告)日：2016-02-16

申请号：US14098858

申请日：2013-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Jung Hwang

IPC: G01D11/24 ,  H01L27/146

CPC classification number: H01L27/14643 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image sensor package including a PCB including bonding areas, an image sensor including bonding pads on edge portions thereof on the PCB, bonding wires connecting the bonding pads with the bonding areas, an insulating adhesion film attaching the bonding wires to the bonding pads on the edge portions of the image sensor, a heat spread pattern spaced apart from the bonding wires and the image sensor on the insulating adhesion film, a supporting holder spaced apart from the edge portions of the image sensor, encloses the image sensor, contacts a top surface of the heat spread pattern and the PCB, and includes a supporting portion at an upper portion thereof, and a transparent cover covering the image sensor on the supporting portion of the supporting holder and spaced apart from the top surface of the image sensor is provided.

Abstract translation: 一种图像传感器封装，包括具有接合区域的PCB，包括在PCB的边缘部分上的接合焊盘的图像传感器，将接合焊盘与接合区域连接的接合线，将接合线附接到接合焊盘上的绝缘粘合膜 图像传感器的边缘部分，与接合线隔开的热扩散图案和绝缘粘合膜上的图像传感器，与图像传感器的边缘部分间隔开的支撑保持器，包围图像传感器，接触顶部表面 的散热图案和PCB，并且在其上部包括支撑部分，并且设置覆盖支撑保持器的支撑部分并与图像传感器的顶表面间隔开的图像传感器的透明盖。

公开(公告)号：US09177887B2

公开(公告)日：2015-11-03

申请号：US14068091

申请日：2013-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Na Choi ,  Ji-Chul Kim ,  Se-Ran Bae ,  Eun-Seok Cho ,  Hee-Jung Hwang

IPC: H01L23/48 ,  H01L23/34 ,  G01R31/28 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L23/345 ,  G01R31/2875 ,  H01L22/34 ,  H01L23/34 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

Abstract translation: 可以提供半导体测试装置及其制造方法。 半导体测试装置可以包括第一热测试倒装芯片单元，其包括第一加热器和第一传感器，以及形成在第一热测试倒装芯片单元下的测试基板。 第一热测试倒装芯片单元可以包括布置在第一热测试倒装芯片单元的底表面上的多个第一凸块，并且被配置为电连接到第一加热器和第一传感器。 测试基板可以包括在第一方向上布置在测试基板的底表面上的第一球阵列，并且被配置为电连接到电连接到第一加热器和第一传感器的多个第一凸块。